- Tytuł:
- Thermal modelling of modern processors using FEM and compact model
- Autorzy:
-
Galicia, M.
Zając, P.
Maj, C.
Szermer, M.
Napieralski, A. - Powiązania:
- https://bibliotekanauki.pl/articles/397698.pdf
- Data publikacji:
- 2015
- Wydawca:
- Politechnika Łódzka. Wydział Mikroelektroniki i Informatyki
- Tematy:
-
thermal simulation
finite-element method
multi-core
thermal modelling
symulacje termiczne
metoda elementów skończonych
wielordzeniowość
modelowanie cieplne - Opis:
- A variety of thermal models has been proposed to predict the temperatures inside modern processors. In this paper, we describe and compare two such approaches, a detailed FEMbased simulation and a simpler architectural compact model. It is shown that both models provide comparable results when it comes to predicting the maximal temperature, however there are also non-negligible differences when estimating thermal gradients within a chip. Furthermore, transient simulation results show some differences in temperature profile during processor heating.
- Źródło:
-
International Journal of Microelectronics and Computer Science; 2015, 6, 3; 110-116
2080-8755
2353-9607 - Pojawia się w:
- International Journal of Microelectronics and Computer Science
- Dostawca treści:
- Biblioteka Nauki
Artykuł