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Tytuł:
Electroless Nickel Plating on AM60B Magnesium Alloy via Ti-Zr/Sol-Gel Composite Layer as Pretreatment
Autorzy:
Nazari, Zhale
Seifzadeh, Davod
Rajabalizadeh, Zahra
Powiązania:
https://bibliotekanauki.pl/articles/2125541.pdf
Data publikacji:
2022
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
sol-gel
Mg alloy
electroless plating
Opis:
The Ti-Zr and Ti-Zr/sol-gel were used as pretreatment layers before the electroless nickel coating on AM60B magnesium alloy. Scanning Electron Microscopy was employed to investigate the surface morphology of the pretreated layers and applied electroless coatings. Chemical analysis of the Ti-Zr layer, and nickel coatings was done using the Energy-Dispersive X-ray Spectroscopy. Moreover, the X-ray Diffraction and Atomic Force Microscopy methods were utilized to evaluate the microstructure and surface roughness of the electroless coatings, respectively. Electrochemical Impedance Spectroscopy was employed to study the corrosion behavior of Ni-P coatings. The results show that Ti-Zr layer has structural cracks, and the sol-gel film was covered all cracks entirely. The cauliflower-like electroless nickel coating was applied on both mentioned pretreated layers. The cross-sectional images revealed the higher thickness for the electroless coating on Ti-Zr/sol-gel layer, probably due to a large number of Ni nucleation centers. The EIS results demonstrate that the electroless coating on Ti-Zr/sol-gel has high corrosion protection and microhardness value.
Źródło:
Archives of Metallurgy and Materials; 2022, 67, 3; 913--920
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric Elements
Autorzy:
Kim, Subin
Bae, Sung Hwa
Son, Injoon
Powiązania:
https://bibliotekanauki.pl/articles/2049171.pdf
Data publikacji:
2021
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermoelectric
ENEPIG
bonding strength
BiTe
plating
Opis:
To improve the mechanical performance of BiTe-based thermoelectric modules, this study applies anti-diffusion layers that inhibit the generation of metal intercompounds and an electroless nickel/electrode palladium/mission gold (ENEPIG) plating layers to ensure a stable bonding interface. If a plated layer is formed only on BiTe-based thermoelectric, the diffusion of Cu in electrode substrates produces an intermetallic compound. Therefore, the ENEPIG process was applied on the Cu electrode substrate. The bonding strength highly increased from approximately 10.4 to 16.4 MPa when ENEPIG plating was conducted to the BiTe-based thermoelectric element. When ENEPIG plating was performed to both the BiTe-based thermoelectric element and the Cu electrode substrate, the bonding strength showed the highest value of approximately 17.6 MPa, suggesting that the ENEPIG process is ef-fective in ensuring a highly reliable bonding interface of the BiTe-based thermoelectric module.
Źródło:
Archives of Metallurgy and Materials; 2021, 66, 4; 967-970
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Nanocomposite chromium coatings on aluminum alloys
Autorzy:
Gidikova, N.
Valov, R.
Petkov, V.
Sułowski, M.
Witkowska, M.
Cempura, G.
Powiązania:
https://bibliotekanauki.pl/articles/391428.pdf
Data publikacji:
2017
Wydawca:
Sieć Badawcza Łukasiewicz - Instytut Odlewnictwa
Tematy:
chromium coating
aluminum
nanodiamond particles
electrochemical plating
Opis:
Chromium coatings modified with nanodiamond particles were deposited on aluminum alloys. The concentration of the nanodiamond particles in the chrome plating electrolyte was from 5 to 25 g/l. The thickness of the layer varied between 30 and 70 μm. The layers were prepared with the same electrolytic conditions and were measured with a metallographic microscope. The maximum microhardness of the coating was 840 kg/mm2. X-ray diffraction analysis was performed with a Siemens D500 apparatus using the Bragg-Brentano technique. The distribution of Cr, Al and O in the cross section was studied by SEM-EDS. It was found that the layers were homogenous – only consisted of chromium. The coatings were also studied for non-destructivity by X-ray 3D computed tomography. It was found that the coatings were intact and continuous along the section. In order to obtain the maximum yield of chromium and maximum thickness of the layer, the optimum nanodiamond particle concentration was 10 g/l.
Źródło:
Prace Instytutu Odlewnictwa; 2017, 57, 4; 241-244
1899-2439
Pojawia się w:
Prace Instytutu Odlewnictwa
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Surface Analysis of ABS 3D Prints Subjected to Copper Plating
Autorzy:
Maciąg, T.
Wieczorek, J.
Kałsa, W.
Powiązania:
https://bibliotekanauki.pl/articles/351640.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
FDM
ABS smoothing
copper plating
surface analysis
Opis:
3D printing in FDM (Fused Deposition Modelling) technology is commonly used, mainly in the preparation of prototypes, but also for the production of ready-made elements. Objects printed using the FDM method have characteristic, adverse surface features related to the limitations of this technology. That is why surface treatment of 3D prints becomes crucial. One of the method is metal plating of elements. The most frequently used material in FDM technology is PLA (polylactic acid) and ABS (acrylonitrile butadiene styrene). Study of surface parameters determination for ABS prints after galvanic copper plating is presented in this paper. For this purpose, samples printed with ABS were smoothed in acetone vapour. Most favorable parameters of the surface were obtained for samples that had contact with acetone vapour for 60 minutes. Ultimately, surface analysis of samples after graphite coating and subjected to copper plating was performed. It was found that surface parameters are close to results obtained with traditional methods of metal processing.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 2; 639-646
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Electroplating nickel onto uranium as fission-recoil barrier
Autorzy:
Cieszykowska, I.
Żółtowska, M.
Mielcarski, M.
Powiązania:
https://bibliotekanauki.pl/articles/146450.pdf
Data publikacji:
2009
Wydawca:
Instytut Chemii i Techniki Jądrowej
Tematy:
uranium
nickel
plating
fission-recoil barriers
Opis:
Plating experiments have been performed in order to obtain fission recoil barriers on low-enriched uranium (LEU) metal foils used as targets suitable for the production of 99Mo. The results of Ni deposition obtained in electroplating and electroless plating baths are presented. The best method of pretreatment uranium prior to plating is suggested. It was found that etching in solutions containing NiCl2 gave better results on uranium rods, whereas electroplating produces coatings with the desired level of adherence and coverage on uranium foils. The thickness of the nickel plates, evaluated both microscopically and gravimetrically, is sufficient to act as a fission recoil barrier.
Źródło:
Nukleonika; 2009, 54, 1; 29-32
0029-5922
1508-5791
Pojawia się w:
Nukleonika
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Forecasting deflections of plates in case of perception of transient loads
Autorzy:
Burakovskiy, E. P.
Burakovskiy, P. E.
Powiązania:
https://bibliotekanauki.pl/articles/359708.pdf
Data publikacji:
2014
Wydawca:
Akademia Morska w Szczecinie. Wydawnictwo AMSz
Tematy:
side plating
accumulation
service condition
adaptivity
Opis:
In this paper the results of experimental research of residual deflection accumulation process in plates under the influence of repeated static loads in the mode of “creeping” and “relaxing” are presented. The main ideas of the nature of plate deformation, which make it possible to take into account the history of loading resulting deformation, and the results of modeling the process of accumulation of residual deflections in the use of short-term service loads are formulated in this document.
Źródło:
Zeszyty Naukowe Akademii Morskiej w Szczecinie; 2014, 39 (111); 43-46
1733-8670
2392-0378
Pojawia się w:
Zeszyty Naukowe Akademii Morskiej w Szczecinie
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules
Autorzy:
Kim, S. S.
Son, I.
Kim, K. T.
Powiązania:
https://bibliotekanauki.pl/articles/356583.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermoelectric
Ni–P plating
bonding strength
Bi–Te
soldering
Opis:
In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1225-1229
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Reversion of argE3 ochre strain Escherichia coli AB1157 as a tool for studying the stationary-phase (adaptive) mutations.
Autorzy:
Nowosielska, Anetta
Grzesiuk, Elżbieta
Powiązania:
https://bibliotekanauki.pl/articles/1044376.pdf
Data publikacji:
2000
Wydawca:
Polskie Towarzystwo Biochemiczne
Tematy:
mutY
replica plating
Arg+ revertants
Escherichia coli
adaptive mutations
mutT
Opis:
Adaptive (starvation-associated) mutations occur in non-dividing cells and allow growth under the selective conditions imposed. We developed a new method for the determination of adaptive mutations in Escherichia coli. The system involves reversion to prototrophy of the argE3OC mutation and was tested on AB1157 strains mutated in the mutT and/or mutY genes. The bacteria that mutated adaptively grow into colonies on minimal medium plates devoid of arginine (starvation conditions) when incubated longer than 4 days. Using the replica plating method we solved the problem of discrimination between growth-dependent and adaptive argE3→Arg+ revertants. Phenotype analysis and susceptibility of the Arg+ revertants to a set of T4 phage mutants create an additional possibility to draw a distinction between these two types of Arg+ revertants.
Źródło:
Acta Biochimica Polonica; 2000, 47, 2; 459-467
0001-527X
Pojawia się w:
Acta Biochimica Polonica
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Pd-P Layer on the Bonding Strength of Bi-Te Thermoelectric Elements
Autorzy:
Bae, Sung Hwa
Han, Se Hun
Son, Injoon
Kim, Kyung Tae
Powiązania:
https://bibliotekanauki.pl/articles/353621.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
bismuth telluride
thermoelectric module
electroless Pd-P plating
bonding strength
Opis:
In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoelectric elements without electroless Pd-P plating, and the fracture of the bond originated from these intermetallic compounds. A Pd-Sn solder reaction layer with a thickness of approximately 20 μm was formed under the Pd-P plating layer in the case of the electroless Pd-P plating, and prevented the diffusion of Bi and Te. In addition, the fracture did not occur on the bonding interface but in the thermoelectric elements for the electroless Pd-P plating because the bonding strength of the Pd-Sn reaction layer was higher than the shear strength of the thermoelectric elements.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 3; 963-968
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Production of Chromium Boride Layers on Carbon Steel with Conversion Treatment: Chromium Deposition + Diffusion Annealing
Autorzy:
Boubaaya, R.
Benarioua, Y.
Allaoui, O.
Djendel, M.
Powiązania:
https://bibliotekanauki.pl/articles/1031720.pdf
Data publikacji:
2017-09
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
carbon steel
boriding
chromium plating
diffusion annealing
chromium boride
Opis:
The present study has been conducted in order to obtaining chromium boride layers on carbon steel using a conversion processing comprising the following steps: boriding treatment in order to increase the amount of boron atoms in the steel surface, deposition of a thin layer of pure chromium using electrolytic method, and finally an annealing treatment for boron diffusion and formation of boride layer until complete transformation of chromium layer. Depending on the method used (chromium deposition followed by boriding or boriding followed by chromium deposition) and the holding time, the partial or complete conversion is obtained as a result of the diffusion process. The role of the annealing temperature on transformation rates of chromium into chromium boride films was investigated. It is shown that for 1 h at 900°C, the chromium layer is totally transformed. The scanning electron microscopy analysis and X-ray diffraction showed the presence of CrB and CrB₂ chromium borides in addition of FeB and Fe₂B iron borides.
Źródło:
Acta Physica Polonica A; 2017, 132, 3; 541-543
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Deposition of Ru-106 and I-125 on silver by internal electrolysis
Autorzy:
Mielcarski, M.
Puchalska, I.
Powiązania:
https://bibliotekanauki.pl/articles/147176.pdf
Data publikacji:
2002
Wydawca:
Instytut Chemii i Techniki Jądrowej
Tematy:
electroless plating
internal electrolysis
iodine-125
ruthenium-106
sealed radiation sources
Opis:
The application of internal electrolysis for the deposition of ruthenium-106 and iodine-125 on silver was examined. These investigations were aimed at the preparation of sealed radiation sources for brachytherapy. The current and voltage of a cell built of silver cathode and aluminium anode, immersed in electrolytes containing different concentrations of ruthenium were determined. The same parameters were measured for the cell consisting of silver anode and platinum cathode as a function of the concentrations of NaI and NaOH in the electrolyte. The changes of current and voltage of the cells as a function of duration of electrolysis were investigated. The influence of white light observed during the deposition of iodine indicates that photolysis of silver iodide formed on the anode affects the cell parameters. From the results obtained it follows that electrolysis performed without application of external electric tension is a simple and convenient method for fixing considerable amounts of both ruthenium-106 and iodine-125 on silver.
Źródło:
Nukleonika; 2002, 47, 2; 83-86
0029-5922
1508-5791
Pojawia się w:
Nukleonika
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Electrochemical Deposition of Silver on Aluminum Alloys
Autorzy:
Valov, R.
Petkov, V.
Valkanov, S.
Powiązania:
https://bibliotekanauki.pl/articles/946872.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
silver plating
aluminum alloys
diamond nanoparticles
SEM
posrebrzanie
stopy aluminium
nanocząsteczki diamentu
Opis:
Silver coatings have a very high reflection ability. To avoid their darkening from the hydrogen sulphide in the air, a thin layer of heat-resistant colorless lacquer is applied to the coatings. Silver plating is mainly used in jewelery, optics, electronics and electrical engineering. Depending on their application the thickness of the layer may vary from 2 to 24 μm. It can be done in several ways: chemical, electrochemical, contact, etc. The most common way of silver plating is the electrochemical deposition using cyanide and non-cyanide electrolytes. The cyanide electrolytes produce light, fine crystalline, dense and plastic coatings upon silver-plating. Usually silver coatings are applied with copper or nickel intermediate layer. In order to improve the de-oxidation of the aluminum surface new chemical treatment in acid – alkaline solution was applied. Our previous research shows that the presence of diamond nanoparticles in the electrolyte increase the metal deposition. Samples were prepared from electrolyte containing 10 g/l diamond nanoparticles. Their properties were compared to the properties of reference samples. The diamonds were obtained by detonation synthesis. The aim of this study is to obtain electrochemically deposited silver layer with high density, adhesion and electric conductivity on aluminum alloys substrate. The coating was directly plated without intermediate layer. Non-cyanide electrolyte composition and electrochemical parameters were determined in order to produce Ag coatings on Al alloy substrate without intermediate layer. The coating is with good adhesion, density and thickness of 14-23 μm.
Źródło:
Archives of Foundry Engineering; 2020, 20, 2; 101-104
1897-3310
2299-2944
Pojawia się w:
Archives of Foundry Engineering
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Optimization of Roll Bonding by Hot Rolling in Experimental and Industrial Use
Autorzy:
Szabó, G.
Powiązania:
https://bibliotekanauki.pl/articles/352683.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
sandwich sheet rolling
aluminum-plating technology
welding by rolling
pressure welding
bounding faults
Opis:
In this study the major topic were the bonding properties of the layer-clad aluminum sheets. The bonding was performed between AlMn1Si0.8 and AlSi10 alloys using hot rolling (a VON ROLL experimental duo mill). The experimental temperatures were 460, 480 and 500°C. The goodness of bonding was tested by tensile test and T-peel test. T-peel test provided a good description about the quality of bonding. Structure analysis was also performed by light microscopy to detect typical bonding faults. The aim of this investigation is modelling the bonding conformation in experimental conditions. Further aim of this investigation is to produce some typical bonding faults and find the cause of formation. The influence of the rolling temperature and surface roughness on the bonding was also analyzed. Rolling schedule and the role of first pass on the development of perfect bonding were experimentally determined.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1205-1208
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
Autorzy:
Hwang, J. H.
Lee, J.-H.
Powiązania:
https://bibliotekanauki.pl/articles/353042.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Sn-coated Cu
immersion plating
chip bonding
intermetallic compounds (IMC)
transient liquid phase (TLP)
sintering
Opis:
Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1143-1148
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses
Autorzy:
Choi, E. B.
Lee, J.-H.
Powiązania:
https://bibliotekanauki.pl/articles/351202.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Ag-coated Cu particle
submicrometer
Glycol-based Ag plating solution
mult-step addition
antioxidation
Opis:
For application as a low-cost conductive filler material, submicroscale Cu@Ag particles were fabricated at room temperature without any reductants by a multi-step addition method using an ethylene glycol-based Ag plating solution. Scanning electron microscopy images of the Ag-coated Cu particles demonstrated the formation of discrete Ag particles less than 100 nm in size as well as a thin Ag coating on Cu particles, during the early addition steps. However, as the thickness of the Ag coating increased, the small Ag particles agglomerated into Ag coatings with an increase in the number of Ag plating steps. Owing to the absence of additives such as surfactants, a comparison between the microstructural images and calculations indicated increased agglomeration between fabricated Ag-coated Cu particles with an increase in the number of Ag plating steps. However, thermogravimetric-differential scanning calorimetry of the agglomerated Ag-coated Cu particles after the fifth addition of the Ag plating solution demonstrated their antioxidation behavior even after 70 min in air at 150°C.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1137-1142
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
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