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Wyszukujesz frazę "electronic cooling" wg kryterium: Temat


Wyświetlanie 1-3 z 3
Tytuł:
Study of heat transfer during pool boiling on minifins surface coated with carbon nanotubes
Autorzy:
Strąk, E.
Pastuszko, R.
Kłosowiak, R.
Urbaniak, R.
Powiązania:
https://bibliotekanauki.pl/articles/175588.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
pool boiling
carbon nanotube
heat transfer coefficient
power
electronic cooling
Opis:
The article describes the study of heat transfer during pool boiling on minifins surface coated with nanostructure. This is a molecular level technology used in engineering or mechanical factory. A surface with carbon nanotubes (CNTs) is highly effective in reducing the superheat incipience and enhancing both the heat flux and heat transfer coefficient. The paper focuses on the comparison of the surfaces, on which pool boiling heat transfer occurs, i.e., on minifins coated with carbon nanotubes (MF+N) with surfaces formed by sintering the woven copper wire mesh to the minifins tips (MF+M) and with plain minifins surface (MF). The experiments were carried out for two boiling fluids: water and ethyl alcohol. The purpose of the presented study was to find out which of those tested surfaces and fluids could be the best alternative for use in the cooling of electronic devices and which surfaces could be used as thermosyphon or heat pipe evaporator.
Źródło:
Transactions of the Institute of Fluid-Flow Machinery; 2015, 128; 59-72
0079-3205
Pojawia się w:
Transactions of the Institute of Fluid-Flow Machinery
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Thermal investigations of PCM enhanced electronics cooling
Autorzy:
Felczak, Mariusz
Więcek, Bogusław
Powiązania:
https://bibliotekanauki.pl/articles/114610.pdf
Data publikacji:
2019
Wydawca:
Stowarzyszenie Inżynierów i Techników Mechaników Polskich
Tematy:
heat exchange
phase change materials
thermal impedance
cooling of electronic systems
Opis:
The paper presents experimental results of PCM (Phase Change Material) enhanced cooling system. The investigations were focused on obtaining the best results of the cooling system during its start-up. The latent heat of phase change material was used to decrease temperature of the cooled electronic device. Comparison of a standard heat sink available on the market and the same heat sink filled with PCM applications was done. Temperature was monitored and registered during device start-up until its thermal steady state. It was done using contact and IR temperature measurement methods. PCMs usage enabled to absorb heat during electronic device start-up. The paper proves that using PCMs it is possible to delay temperature rise during electronic devices heating.
Źródło:
Measurement Automation Monitoring; 2019, 65, 2; 44-47
2450-2855
Pojawia się w:
Measurement Automation Monitoring
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Conjugate numerical investigation of a miniature flat-plate evaporator of a capillary pumped loop for electronics cooling
Autorzy:
Wan, Z.
Liu, W.
Tu, Z.
Nakayama, A.
Powiązania:
https://bibliotekanauki.pl/articles/1933189.pdf
Data publikacji:
2008
Wydawca:
Politechnika Gdańska
Tematy:
capillary pumped loop
flat plate evaporator
sidewall effect heat transfer limit
cooling of electronic devices
Opis:
A capillary pumped loop (CPL) is a two-phase thermal control device applied in cooling electronic devices. A two-dimensional conjugate numerical model of a miniature flat-plate capillary evaporator is presented in order to describe liquid and vapor flow, heat transfer and phase change in the porous wick structure, liquid flow and heat transfer in the compensation cavity and heat transfer in the vapor grooves and the metallic wall. The entire evaporator is solved with the SIMPLE algorithm as a conjugate problem. The shape and location of the vapor-liquid interface inside the wick are calculated, and a side wall effect heat transfer limit is introduced to estimate the evaporator's heat transport capability. The influence of various wall materials on the evaporator's performance is discussed in detail. The results suggest that an evaporator with a combined wall is capable of dissipating high heat flux and stabilizing the temperature of electronic devices at a moderate temperature level.
Źródło:
TASK Quarterly. Scientific Bulletin of Academic Computer Centre in Gdansk; 2008, 12, 1-2; 5-19
1428-6394
Pojawia się w:
TASK Quarterly. Scientific Bulletin of Academic Computer Centre in Gdansk
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-3 z 3

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