- Tytuł:
- Thermal investigations of PCM enhanced electronics cooling
- Autorzy:
-
Felczak, Mariusz
Więcek, Bogusław - Powiązania:
- https://bibliotekanauki.pl/articles/114610.pdf
- Data publikacji:
- 2019
- Wydawca:
- Stowarzyszenie Inżynierów i Techników Mechaników Polskich
- Tematy:
-
heat exchange
phase change materials
thermal impedance
cooling of electronic systems - Opis:
- The paper presents experimental results of PCM (Phase Change Material) enhanced cooling system. The investigations were focused on obtaining the best results of the cooling system during its start-up. The latent heat of phase change material was used to decrease temperature of the cooled electronic device. Comparison of a standard heat sink available on the market and the same heat sink filled with PCM applications was done. Temperature was monitored and registered during device start-up until its thermal steady state. It was done using contact and IR temperature measurement methods. PCMs usage enabled to absorb heat during electronic device start-up. The paper proves that using PCMs it is possible to delay temperature rise during electronic devices heating.
- Źródło:
-
Measurement Automation Monitoring; 2019, 65, 2; 44-47
2450-2855 - Pojawia się w:
- Measurement Automation Monitoring
- Dostawca treści:
- Biblioteka Nauki
Artykuł