Informacja

Drogi użytkowniku, aplikacja do prawidłowego działania wymaga obsługi JavaScript. Proszę włącz obsługę JavaScript w Twojej przeglądarce.

Wyszukujesz frazę "SOI" wg kryterium: Temat


Tytuł:
Silicon-on-Insulator technology for imaging and application to a switching photodetector
Autorzy:
Abdo, N.
Sallin, D.
Koukab, A.
Estribeau, M.
Magnan, P.
Kayal, M.
Powiązania:
https://bibliotekanauki.pl/articles/397865.pdf
Data publikacji:
2015
Wydawca:
Politechnika Łódzka. Wydział Mikroelektroniki i Informatyki
Tematy:
photodetectors
silicon-on-insulator
fotodetektory
SOI
Opis:
This paper analyzes some advantages of Silicon-on-Insulator (SOI) based photodetectors for low light imaging. It shows that SOI based sensors not only solve the bulk carriers problem, it can also act as a very selective spectral filter by acting as a resonant cavity, which is useful in application with a very narrow spectrum of interest, such as bioluminescence imaging. The SOI implementation of a switching photodetector based with an hybrid MOS-PN structure is presented and its advantages in terms of dark current minimization and SNR improvement highlighted.
Źródło:
International Journal of Microelectronics and Computer Science; 2015, 6, 4; 136-141
2080-8755
2353-9607
Pojawia się w:
International Journal of Microelectronics and Computer Science
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Reliability of deep submicron MOSFETs
Autorzy:
Balestra, F.
Powiązania:
https://bibliotekanauki.pl/articles/307658.pdf
Data publikacji:
2001
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
bulk MOSFETs
SOI devices
deep submicron
transistors
reliability
Opis:
In this work, a review of the reliability of n- and p-channel Si and SOI MOSFETs as a function of gate length and temperature is given. The main hot carrier effects and degradation are compared for bulk and SOI devices in a wide range of gate length, down to deep submicron. The worst case aging, defice lifetime and maximum drain bias that can be applied are addressed. The physical mechanisms and the emergence of new phenomena at the origin of the degradation are studied for advanced MOS transistors. The impact of the substrate bias is also outlined.
Źródło:
Journal of Telecommunications and Information Technology; 2001, 1; 12-17
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
TSSOI as an efficient tool for diagnostics of SOI technology in Institute of Electron Technology
Autorzy:
Barański, M.
Domański, K.
Grabiec, P.
Grodner, M.
Jaroszewicz, B.
Kociubiński, A.
Kucewicz, W.
Kucharski, K.
Marczewski, J.
Niemiec, H.
Sapor, M.
Tomaszewski, D.
Powiązania:
https://bibliotekanauki.pl/articles/308825.pdf
Data publikacji:
2005
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
SOI CMOS technology
pixel detector
test structure
Opis:
This paper reports a test structure for characterization of a new technology combining a standard CMOS process with pixel detector manufacturing technique. These processes are combined on a single thick-_lm SOI wafer. Preliminary results of the measurements performed on both MOS SOI transistors and dedicated SOI test structures are described in detail.
Źródło:
Journal of Telecommunications and Information Technology; 2005, 1; 85-93
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Raconter des histoires pour développer des compétences transversales en FLE
Tell stories to develop transversal competencies in FLE
Autorzy:
Blachowska-Szmigiel, Marzena
Powiązania:
https://bibliotekanauki.pl/articles/1048268.pdf
Data publikacji:
2019-07-09
Wydawca:
Uniwersytet im. Adama Mickiewicza w Poznaniu
Tematy:
transversal competencies
narrative competence
‘SOI’ integrity
FLE teaching / learning
Opis:
The purpose of this paper is to seek to highlight the usefulness of storytelling skills for the development of transversal competencies in the context of FLE teaching / learning in Romance philology at Adam Mickiewicz University. As a first step we define the importance of transversal competencies in developing the general communicative competence of the student as a participant in social life, then we go on to describe narrative competence as transversal competence and to show its role in managing the ‘SOI’ integrity, finally, we concentrate on developing narrative competence on Roman philology at Adam Mickiewicz University.
Źródło:
Studia Romanica Posnaniensia; 2019, 46, 2; 99-110
0137-2475
2084-4158
Pojawia się w:
Studia Romanica Posnaniensia
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Montaigne : l’écriture de soi pour penser l’altérité
Montaigne: Writing and Thinking the Other from the Self
Autorzy:
Buchs, Arnaud
Powiązania:
https://bibliotekanauki.pl/articles/2056745.pdf
Data publikacji:
2021
Wydawca:
Uniwersytet Marii Curie-Skłodowskiej. Wydawnictwo Uniwersytetu Marii Curie-Skłodowskiej
Tematy:
Montaigne
essais
otherness
writing
self
Essais
altérité
écriture
soi
Opis:
Le souci de l’autre, chez Montaigne, est constant, les figures de l’altérité sont d’une extraordinaire richesse. Et pourtant, Montaigne est surtout connu pour être l’écrivain de soi. Mais le « soy » de Montaigne, comme le Journal de voyage et les Essais, est en fait traversé par l’altérité. Cet article vise alors à montrer comment Montaigne, en particulier dans les Essais, va écrire puis penser l’autre à partir de soi.
Concern for the other is constant with Montaigne, the figures of otherness are extraordinarily rich. And yet, Montaigne is known above all as the writer of the self. But the “soy” of Montaigne, like the Journal de voyage and the Essais, is in fact saturated by otherness. This article aims therefore to show how Montaigne, in particular in the Essais, will write and imagine the other from the self. 
Źródło:
Lublin Studies in Modern Languages and Literature; 2021, 45, 4; 5-13
0137-4699
Pojawia się w:
Lublin Studies in Modern Languages and Literature
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Possibilites of Cadmium Uptake Lowering by Seeds of Legumes with the Application of Zn2+ into the Soil
Możliwość zmieszenia pobrania kadmu przez nasiona roślin strąkowych dzięki aplikacji jonów Zn2+ do gleby
Autorzy:
Bystrická, J.
Musilová, J.
Toth, T.
Powiązania:
https://bibliotekanauki.pl/articles/388346.pdf
Data publikacji:
2009
Wydawca:
Towarzystwo Chemii i Inżynierii Ekologicznej
Tematy:
nasiona soi
nasiona bobu
kadm
cynk
kumulacja
soya bean
faba bean
cadmium
zinc
accumulation
Opis:
Cadmium is toxic, carcinogenic element naturally occurring in soil in concentration of about l mg - kg-1. High concentrations of cadmium increase its uptake by the plants and lower the yields. One of the ways how to manage with the phytotoxicity of cadmium could be the antagonistic system of cadmium with cations Zn2+, Ni2+ and Mn2+. The system Cd2+ and Zn2+ was created and added into the soil. We observed the ability of Zn2+ cation to eliminate the negative affecting of cadmium in plant nutrition and to lower the cadmium in the dry matter. The gained results show that the addition of single Cd2+ ions into the soil (B variant) had negative effect also on the yield amount as well as on observed qualitative parameters of soya and faba beans. In C variant, when both Cd2+ and Zn2+ cations were added, there was slight yield increasing in both crops observed. By the assessing of Cd content in dry matter of soya and faba beans by the application of both elements (C variant) there was awaited effect of content lowering in the case of cadmium in both crops. While the single Cd2+ addition enhanced the content of this metal in soya beans on the value 3.41 mg o kg-1, by common application of Cd2+ and Zn24" ions this value presented 0.2 mg o kg-1. In the case of faba in B variant the value 2.45 mg Cd kg-1 was determined, but by the application of both Cd2+ and Zn2+ ions the content was lowered on 1.33 mg Cd kg-1.
Kadm jest toksycznym i rakotwórczym pierwiastkiem występującym w glebie w stężeniu wynoszącym około l mg o kg-1. Kadm jest łatwo wychwytywany przez rośliny, co prowadzi do obniżenia plonów. Jednym ze sposobów zmniejszenia wychwytu kadmu przez rośliny może być wykorzystanie antagonizmu między jonami Cd2+ a jonami Zn2+, Ni2+ i Mn2+. W prezentowanych badaniach obserwowaliśmy zdolność jonów Zn2+ do obniżenia kumulacji jonów Cd2+ przez rośliny strączkowe oraz zmniejszenia szkodliwego wpływu Cd2+ na odżywianie badanych roślin. Uzyskane wyniki wykazują, że dodanie jonów kadmu do gleby (wariant B) miało negatywny wpływ na ilość plonów oraz badane parametry jakościowe soi oraz bobu. Dodanie do gleby jonów Zn2* oraz Cd2+ (wariant C) spowodowało niewielki wzrost plonów w obu obserwowanych uprawach. Dodanie jonów Zn2+ do gleby spowodowało zmniejszenie zawartości Cd2+ u obydwóch badanych gatunków roślin. Ziarn soi rosnące w glebie z dodatkiem kadmu zawierały w suchej masie kadm w stężeniu 3,41 mg o kg-1. Obecność w glebie jonów Zn2+ spowodowało obniżenie zawartości Cd w suchej masie nasion soi do 0.2 mg o kg-1. W przypadku bobu rosnącego w glebie zawierającej kadm (wariant B) zawartość Cd2+ w suchej masie nasion wynosiła 2,45 mg - kg-1. Jony Zn2+ dodane do gleby zmniejszały zawartość Cd2+ w suchej masie nasion bobu do 1,33 mg o kg-1.
Źródło:
Ecological Chemistry and Engineering. A; 2009, 16, 12; 1547-1553
1898-6188
2084-4530
Pojawia się w:
Ecological Chemistry and Engineering. A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Trends in hybrid pixel detectors for X-ray imaging using deep submicron VLSI technology
Autorzy:
Drozd, A.
Satława, T.
Powiązania:
https://bibliotekanauki.pl/articles/115661.pdf
Data publikacji:
2014
Wydawca:
Fundacja na Rzecz Młodych Naukowców
Tematy:
X-ray imaging
hybrid pixel detectors
3D technologies
SOI technologies
obrazowanie rentgenowskie
hybrydowe detektory pikseli
technologie 3D
technologia SOI
Opis:
The article covers the latest developments in pixel detectors used for X-ray imaging as well as the description of the practical solution – a multichannel integrated circuit dedicated to X-ray imaging. In general introduction a wide range of pixel detector applications is presented. The main part focuses on the challenges and new solutions for the field of X-ray imaging, including 3D integration, silicon-on-insulator and submicron technologies. Since minimization of a pixel size together with implementing more functionality are important issues in the detectors’ and integrated circuits’ design, the aspects of channel-to-channel uniformity and additional effects like charge sharing between pixels are taken into consideration. In the last section, the Authors present the application specific integrated circuit designed in 40 nm technology dedicated to X-ray detection and future prospects are discussed.
Źródło:
Challenges of Modern Technology; 2014, 5, 4; 3-7
2082-2863
2353-4419
Pojawia się w:
Challenges of Modern Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
On possibility to extend the operation temperature range of SOI sensors with polysilicon piezoresistors
Autorzy:
Druzhinin, A.
Lavitska, E.
Maryamova, I.
Kogut, I.
Khoverko, Y.
Powiązania:
https://bibliotekanauki.pl/articles/307642.pdf
Data publikacji:
2001
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
SOI
mechanical sensors
poly-Si piezoresistor
ZMR
Opis:
The aim of this work was to study the possibilities of developing mechanical sensors with poly-Si piezoresistors on insulating substrate for operation in different temperature ranges (low, elevated and high temperatures). Laser recrystallization is used as a technological tool to adjust the electrical and piezoresistive parameters of the polysilicon layer. For this purpose a set of studies including numerical simulation and experimental work has been carried out. The main three directions of the studies are considered: problems of thermal stabilization of the pressure sensor performance at elevated and high temperatures; problem of sensor operation at cryogenic temperatures; development of a multifunctional pressure-temperature sensor.
Źródło:
Journal of Telecommunications and Information Technology; 2001, 1; 40-45
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Traduire l'expression «soi-disant» en polonais: le cas des copies d'étudiants
Translation of the expression soi-disant into Polish: a case of students calques
Autorzy:
Dutka-Mańkowska, Anna
Powiązania:
https://bibliotekanauki.pl/articles/1053091.pdf
Data publikacji:
2003-10-01
Wydawca:
Uniwersytet im. Adama Mickiewicza w Poznaniu
Tematy:
Expression "soi-disant"
Translation
Opis:
Students' translations into Polish of the French expression soi disant (found in the "Frantext" programme) are considered on two Ievels: that of linguistic means used (modalisers, antonymous modality, apparent reported speech, verb expressions of the type: vouloir/paraitre/passer pour and ways of quoting another discourse (possibility of using explicite/implicite). The semantic and contrastive approach appears to be useful in the description of Polish words (e.g. niejako), particularly difficult from the point of view of the theory of combinations.Translation
Źródło:
Studia Romanica Posnaniensia; 2003, 30; 41-49
0137-2475
2084-4158
Pojawia się w:
Studia Romanica Posnaniensia
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
The Impact of Externally Applied Mechanical Stress on Analog and RF Performances of SOI MOSFETs
Autorzy:
Emam, M.
Houri, S.
Vanhoenacker-Janvier, D.
Raskin, J.-P.
Powiązania:
https://bibliotekanauki.pl/articles/308245.pdf
Data publikacji:
2009
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
cut-off frequency fT
intrinsic gain
mechanical stress
piezoresistance coefficient
SOI MOSFET
Opis:
This paper presents a complete study of the impact of mechanical stress on the performance of SOI MOSFETs. This investigation includes dc, analog and RF characteristics. Parameters of a small-signal equivalent circuit are also ex- tracted as a function of applied mechanical stress. Piezoresistance coefficientis shown to be a key element in describing the enhancement in the characteristics of the device due to mechanical stress.
Źródło:
Journal of Telecommunications and Information Technology; 2009, 4; 18-24
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Characterization of SOI fabrication process using gated-diode measurements and TEM studies
Autorzy:
Gibki, J.
Kątcki, J.
Ratajczak, J.
Łukasik, L.
Jakubowski, A.
Tomaszewski, D.
Powiązania:
https://bibliotekanauki.pl/articles/309219.pdf
Data publikacji:
2000
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
microelectronics
SOI technology
characterization
Opis:
SOI fabrication process was characterized using electrical and TEM methods. The investigated SOI structures included partially and fully depleted capacitors, gated diodes and transistors fabricated on SIMOX substrates. From C-V and I-V measurements of gated diodes, the following parameters of partially depleted structures were determined: doping concentration in both n- and p-type regions, average carrier generation lifetimes in the region under the gate and generation velocity at top and bottom surfaces of the active layer. Structures with short lifetime were studied using a transmission electron microscope. TEM studies indicate that the quality of the active layer in the investigated structures is good. Moreover, these studies were used to verify the thicknesses determined by means of electrical characterization methods.
Źródło:
Journal of Telecommunications and Information Technology; 2000, 3-4; 81-83
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Characterization of SOI MOSFETs by means of charge-pumping
Autorzy:
Głuszko, G.
Szostak, S.
Gottlob, H.
Lemme, M.
Łukasiak, L.
Powiązania:
https://bibliotekanauki.pl/articles/308671.pdf
Data publikacji:
2007
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
charge-pumping
electrical characterization
interface traps
SOI MOSFET
Opis:
This paper presents the results of charge-pumping measurements of SOI MOSFETs. The aim of these measurements is to provide information on the density of interface traps at the front and back Si-SiO2 interface. Three-level charge-pumping is used to obtain energy distribution of interface traps at front-interface.
Źródło:
Journal of Telecommunications and Information Technology; 2007, 3; 67-72
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Charge-pumping characterization of SOI devices fabricated by means of wafer bonding over pre-patterned cavities
Autorzy:
Głuszko, G.
Łukasiak, L.
Kilchytska, V.
Chung, T. M.
Olbrechts, B.
Flandrie, D.
Raskin, J. P.
Powiązania:
https://bibliotekanauki.pl/articles/308669.pdf
Data publikacji:
2007
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
charge-pumping
electrical characterization
interface traps
SOI
water bonding
Si layer transfer
Opis:
The quality of the silicon-buried oxide bonded interface of SOI devices created by thin Si film transfer and bonding over pre-patterned cavities, aiming at fabrication of DG and SON MOSFETs, is studied by means of chargepumping (CP) measurements. It is demonstrated that thanks to the chemical activation step, the quality of the bonded interface is remarkably good. Good agreement between values of front-interface threshold voltage determined from CP and I-V measurements is obtained.
Źródło:
Journal of Telecommunications and Information Technology; 2007, 3; 61-66
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Comparison of microwave performances for sub-quarter micron fully- and partially-depleted SOI MOSFETs
Autorzy:
Goffioul, M.
Dambrine, G.
Vanhoenacker, D.
Raskin, J.P.
Powiązania:
https://bibliotekanauki.pl/articles/309323.pdf
Data publikacji:
2000
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
microelectronics
microwave devices
SOI MOSFET
Opis:
The high frequency performances including microwave noise parameters for sub-quarter micron fully- (FD and partially-depleted (PD) silicon-on-insulator (SOI) n-MOSFETs are described and compared. Direct extraction techniques based on the physical meaning of each small-signal and noise model element are used to extract the microwave characteristics of various FD and PD SOI n-MOSFETs with different channel lenghts and widths. TiSi2 silicidation process has been demonstrated very efficient to reduce the sheet and contact resistances of gate, source and drain transistor regions. 0.25 žm FD SOI n-MOSFETs with a total gate width of 100 žm present a state-of-the-art minimum noise figure of 0.8 dB and high associated gain of 13 dB at 6 GHz for V(ds) = 0.75 V and P(dc) < 3 mW. A maximum extrapolated oscillation frequency of about 70 GHz has been obtained at V(ds) = 1 V and J(ds) = 100 mA/mm. This new generation of MOSFETs presents very good analogical and digital high speed performances with a low power consumption which make them extremely attractive for high frequency portable applications such as the wireless communications.
Źródło:
Journal of Telecommunications and Information Technology; 2000, 3-4; 72-80
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Direct extraction techniques of microwave small-signal model and technological parameters for sub-quarter micron SOI MOSFETs
Autorzy:
Goffioul, M.
Vanhoenacker, D.
Raskin, J.P.
Powiązania:
https://bibliotekanauki.pl/articles/309316.pdf
Data publikacji:
2000
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
microelectronics
microwave devices
SOI MOSFET
Opis:
Original extraction techniques of microwave small-signal model and technological parameters for SOI MOSFETs are presented. The characterization method combines careful design of probing and calibration structures, rigorous in situ calibration and a powerful direct extraction method. The proposed characterization procedure is directly based on the physical meaning of each small-signal behavior of each model parameter versus bias conditions, the high frequency equivalent circuit can be simplified for extraction purposes. Biasing MOSFETs under depletion, strong inversion and saturation conditions, certain technological parameters and microwave small-signal elements can be extracted directly from the measured S-parameters. These new extraction techniques allow us to understand deeply the behavior of the sub-quarter micron SOI MOSFETs in microwave domain and to control their fabrication process.
Źródło:
Journal of Telecommunications and Information Technology; 2000, 3-4; 59-66
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł

Ta witryna wykorzystuje pliki cookies do przechowywania informacji na Twoim komputerze. Pliki cookies stosujemy w celu świadczenia usług na najwyższym poziomie, w tym w sposób dostosowany do indywidualnych potrzeb. Korzystanie z witryny bez zmiany ustawień dotyczących cookies oznacza, że będą one zamieszczane w Twoim komputerze. W każdym momencie możesz dokonać zmiany ustawień dotyczących cookies