- Tytuł:
- The aberrations of the AC thermal characteristics in the presence of solder defects in mltilayer microelectronic structures
- Autorzy:
- Gnidzińska, K.
- Powiązania:
- https://bibliotekanauki.pl/articles/397696.pdf
- Data publikacji:
- 2011
- Wydawca:
- Politechnika Łódzka. Wydział Mikroelektroniki i Informatyki
- Tematy:
-
modelowanie termiczne prądu przemiennego
badania nieniszczące
opór cieplny
wymiana ciepła
AC thermal modeling
nondestructive testing
thermal impedance
heat transfer - Opis:
- In this paper, the multilayer microelectronic structures have been modeled using AC thermal modeling approach. The influence of defects in solder layers on the thermal parameters of the structures has been investigated. It has been presented how an aberration in a solder layer that may result e.g. from the manufacturing flaw, can significantly affect the thermal characteristics of the structure thus aggravating the conditions of the heat transfer. The phenomena have been described in the qualitative and quantitative way. Furthermore, the applicability of the proposed modeling method for the purpose of determining the optimal frequency range in non-destructive device testing technique - lock-in thermography - has been demonstrated.
- Źródło:
-
International Journal of Microelectronics and Computer Science; 2011, 2, 4; 156-159
2080-8755
2353-9607 - Pojawia się w:
- International Journal of Microelectronics and Computer Science
- Dostawca treści:
- Biblioteka Nauki
Artykuł