The aberrations of the AC thermal characteristics in the presence of solder defects in mltilayer microelectronic structures

In this paper, the multilayer microelectronic structures have been modeled using AC thermal modeling approach. The influence of defects in solder layers on the thermal parameters of the structures has been investigated. It has been presented how an aberration in a solder layer that may result e.g. from the manufacturing flaw, can significantly affect the thermal characteristics of the structure thus aggravating the conditions of the heat transfer. The phenomena have been described in the qualitative and quantitative way. Furthermore, the applicability of the proposed modeling method for the purpose of determining the optimal frequency range in non-destructive device testing technique - lock-in thermography - has been demonstrated.