Autor: Vanhoenacker, D. - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: Direct extraction techniques of microwave small-signal model and technological parameters for sub-quarter micron SOI MOSFETs
Autorzy:: Goffioul, M.
Vanhoenacker, D.
Raskin, J.P.
Powiązania:: https://bibliotekanauki.pl/articles/309316.pdf
Data publikacji:: 2000
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: microelectronics
microwave devices
SOI MOSFET
Opis:: Original extraction techniques of microwave small-signal model and technological parameters for SOI MOSFETs are presented. The characterization method combines careful design of probing and calibration structures, rigorous in situ calibration and a powerful direct extraction method. The proposed characterization procedure is directly based on the physical meaning of each small-signal behavior of each model parameter versus bias conditions, the high frequency equivalent circuit can be simplified for extraction purposes. Biasing MOSFETs under depletion, strong inversion and saturation conditions, certain technological parameters and microwave small-signal elements can be extracted directly from the measured S-parameters. These new extraction techniques allow us to understand deeply the behavior of the sub-quarter micron SOI MOSFETs in microwave domain and to control their fabrication process.
Źródło:: Journal of Telecommunications and Information Technology; 2000, 3-4; 59-66
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 2.

Tytuł:: Comparison of microwave performances for sub-quarter micron fully- and partially-depleted SOI MOSFETs
Autorzy:: Goffioul, M.
Dambrine, G.
Vanhoenacker, D.
Raskin, J.P.
Powiązania:: https://bibliotekanauki.pl/articles/309323.pdf
Data publikacji:: 2000
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: microelectronics
microwave devices
SOI MOSFET
Opis:: The high frequency performances including microwave noise parameters for sub-quarter micron fully- (FD and partially-depleted (PD) silicon-on-insulator (SOI) n-MOSFETs are described and compared. Direct extraction techniques based on the physical meaning of each small-signal and noise model element are used to extract the microwave characteristics of various FD and PD SOI n-MOSFETs with different channel lenghts and widths. TiSi2 silicidation process has been demonstrated very efficient to reduce the sheet and contact resistances of gate, source and drain transistor regions. 0.25 žm FD SOI n-MOSFETs with a total gate width of 100 žm present a state-of-the-art minimum noise figure of 0.8 dB and high associated gain of 13 dB at 6 GHz for V(ds) = 0.75 V and P(dc) < 3 mW. A maximum extrapolated oscillation frequency of about 70 GHz has been obtained at V(ds) = 1 V and J(ds) = 100 mA/mm. This new generation of MOSFETs presents very good analogical and digital high speed performances with a low power consumption which make them extremely attractive for high frequency portable applications such as the wireless communications.
Źródło:: Journal of Telecommunications and Information Technology; 2000, 3-4; 72-80
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 3.

Tytuł:: The Impact of Externally Applied Mechanical Stress on Analog and RF Performances of SOI MOSFETs
Autorzy:: Emam, M.
Houri, S.
Vanhoenacker-Janvier, D.
Raskin, J.-P.
Powiązania:: https://bibliotekanauki.pl/articles/308245.pdf
Data publikacji:: 2009
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: cut-off frequency fT
intrinsic gain
mechanical stress
piezoresistance coefficient
SOI MOSFET
Opis:: This paper presents a complete study of the impact of mechanical stress on the performance of SOI MOSFETs. This investigation includes dc, analog and RF characteristics. Parameters of a small-signal equivalent circuit are also ex- tracted as a function of applied mechanical stress. Piezoresistance coefficientis shown to be a key element in describing the enhancement in the characteristics of the device due to mechanical stress.
Źródło:: Journal of Telecommunications and Information Technology; 2009, 4; 18-24
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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