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Wyszukujesz frazę "Son, S." wg kryterium: Autor


Wyświetlanie 1-11 z 11
Tytuł:
In Situ Solution Process for Fabricating Thermally and Mechanically Stable Highly Conductive ZnO-CNT Fiber Composites
Autorzy:
Hossain, M.
Son, S.
Hahn, J.
Powiązania:
https://bibliotekanauki.pl/articles/1033363.pdf
Data publikacji:
2017-01
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
81.05.-t
Opis:
A simple in situ solution process was developed to produce a mechanically and thermally stable ZnO-carbon nanotube fiber composite. ZnO nanoparticles were homogeneously deposited onto the surfaces of and interstices within CNT fibers (between individual CNTs). X-ray photoelectron spectroscopy and Raman analysis revealed that ZnO nanoparticles contained oxygen vacancy defects and CNT fibers included oxygen containing functional group that strongly interacted with Zn. The strong interaction enhanced the mechanical properties of the composite fibers. The Young modulus (20 GPa) and tensile strength (118 MPa) were enhanced compared to the corresponding values of the pristine CNT fibers. The thermal stability was high up to 880°C and light absorption was enhanced across the UV to near IR region in a ZnO-CNT fiber composite. The electrical conductivity of the composite was high up to 954 S/cm despite semiconductor deposition.
Źródło:
Acta Physica Polonica A; 2017, 131, 1; 124-132
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Enhancement of Life Time of the Dimensionally Stable Anode for Copper Electroplating Applications
Autorzy:
Son, S. H.
Park, S. C.
Lee, M. S.
Powiązania:
https://bibliotekanauki.pl/articles/356684.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
dimensionally stable anode
surface treatment
life time
copper
electrodeposition
Opis:
In order to enhance the long-term stability of DSA for copper electroplating process, in the present study, noble metal oxides with excellent electrochemical properties was used and optimum condition was determined the ratio of noble metal oxides, surface pre-treatment of titanium substrate and heat treatment. The effect of the surface pretreatment of titanium substrate and ratio of noble metal oxides were estimated by accelerated test at the highly current density conditions. The lifetime of DSA increase six-fold higher as the oxide thickness of Ta 7 : Ir 3 composition ratio. Under the optimal condition, surface pretreatment led to dramatic increase in the lifetime of DSA.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1019-1022
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Recovery Of Valuable Metals In Tin-Based Anodic Slimes By Carbothermic Reaction
Odzysk cennych metali ze szlamów anodowych na bazie Sn metodą reakcji karbotermicznej
Autorzy:
Han, C.
Kim, Y.-M.
Son, S. H.
Choi, H.
Kim, T. B.
Kim, Y. H.
Powiązania:
https://bibliotekanauki.pl/articles/352796.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
tin
anodic slime
carbothermic reduction
carbon
recovery
cyna
szlam anodowy
reakcja karbotermiczna
węgiel
odzysk metali
Opis:
This study investigated the recovery of anodic slimes by carbothermic reaction in the temperature range of 973~1,273K and amount of carbon as a function of time. Tin anodic slime samples were collected from the bottom of the electrolytic cells during the electro-refining of tin. The anodic slimes are consisted of high concentrated tin, silver, copper and lead oxides. The kinetics of reduction were determined by means of the weight-loss measurement technique. In order to understand in detail of carbothermic reaction, thermodynamic calculation was carried out and compared with experiments. From thermodynamic calculation and experiment, it was confirmed that Sn-based anodic slime could be reduced by controlling temperature and amount of carbon. However, any tendency between the reduction temperature and carbon content for the reduction reaction was not observed.
Źródło:
Archives of Metallurgy and Materials; 2015, 60, 2B; 1213-1216
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Study On The Electro-Refining Of Tin In Acid Solution From Electronic Waste
Badanie elektrorafinacji cyny w roztworze kwasu z e-odpadów
Autorzy:
Son, S. H.
Park, S. C.
Kim, J. H.
Kim, Y. H.
Lee, M. S.
Ahn, J.-W.
Powiązania:
https://bibliotekanauki.pl/articles/352665.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
electrorefining
tin
electronic waste
recycling
high purity
elektrorafinacja
cyna
odpady elektroniczne
recykling
Opis:
The tin metal could be retractable from wasted tin scrap, sludge, and wasted electroplated solution hydrometallurgical treatment, and purification process. In order to be used as resource of electronic devices, the retracted crude metal should be purified to the extent of higher than 99.9%. In this study, tin electro-refining process was performed to purify the casted tin crude metal at various experimental conditions: at the current density of 3, 5A/dm2, and in various electrolytes such as hydrochloric acid, sulfuric acid and methansulfonic acid. Additional experiment was conducted using Rotating Disk Electrode (RDE) in order to investigate the rate determining step of tin electro-refining process. The current efficiency, 65.6%, was achievable at the condition of current density, 5A/dm2, and in the electrolyte of Hydrochloric acid. During tin electro-refining process, impurity dissolved from tin crude metal into the electrolyte was analyzed using Inductively Coupled Plasma Optical Emission Spectrometer (ICP-OES), and the result showed the concentration of impurity metal gradually increased. Quantitative analysis on casted tin crude metal showed that it consists of tin with 93.9 wt.% and several impurity metals of Ag, Bi, Pb, Cu, and etc. After tin electro-refining process, the purity of tin increased up to 99.985 wt.%.
Źródło:
Archives of Metallurgy and Materials; 2015, 60, 2B; 1217-1220
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
On the monitoring system of collision risks among multiple ships
Autorzy:
Son, N. S.
Kim, S. Y.
Lee, C. S.
Powiązania:
https://bibliotekanauki.pl/articles/320903.pdf
Data publikacji:
2012
Wydawca:
Polskie Forum Nawigacyjne
Tematy:
collision risk among multiple ships
Opis:
To reduce crewmembers’ error and increase the safety of ships’ navigation, a recognition system of collision risks among multiple ships is newly-developed. By using ships’ navigational information such as AIS data, an algorithm to calculate collision risks among multiple ships is newly-designed. Collision risks of multiple ships can be estimated considering ships’ position and course of now and future by using fuzzy algorithm. To evaluate the performance of new system, replay simulation is carried out by using actual AIS data of actual collision accident in Korea. In this paper, main features of the monitoring system of collision risks and the results of replay simulation are discussed.
Źródło:
Annual of Navigation; 2012, No. 19, part 1; 149-163
1640-8632
Pojawia się w:
Annual of Navigation
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Fe Content on the Contact Resistance of Electroplated Au-Fe Alloy Layers
Autorzy:
Park, H. S.
Son, I.
Powiązania:
https://bibliotekanauki.pl/articles/352468.pdf
Data publikacji:
2018
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
electroplating
Au-Fe alloy
contact resistance
thermal aging
Opis:
In this study, variations in the contact resistance of electroplated Au-Fe alloy layers with Fe content were investigated. The contact resistance of electroplated Au-Fe alloy layers that were subject to thermal aging at 260°C in the atmosphere, tended to increase significantly with an increase in the Fe content. Through an analysis method employing X-ray photoelectron spectroscopy (XPS/ESCA) and Auger electron spectroscopy (AES), Ni oxides, such as NiO and Ni2O3, on the surface of the thermally aged electroplated Au-Fe alloy layers were observed. It is believed that the Ni oxide existing on the surface diffused from the underlying electroplated Ni layers to the surface through the grain boundaries in the electroplated Au-Fe layers during the thermal aging. As the Fe content in the electroplated Au-Fe layers increased, the grain size decreased. As the grain size decreases, more Ni oxide was detected on the surface. Therefore, with a rise in the Fe content, more Ni diffuses to the surface via grain boundaries, and more Ni oxide is formed on the surface of the electroplated Au-Fe layers, increasing the contact resistance of the electroplated Au-Fe alloy layers.
Źródło:
Archives of Metallurgy and Materials; 2018, 63, 3; 1503-1507
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules
Autorzy:
Kim, S. S.
Son, I.
Kim, K. T.
Powiązania:
https://bibliotekanauki.pl/articles/356583.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermoelectric
Ni–P plating
bonding strength
Bi–Te
soldering
Opis:
In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1225-1229
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Thermal Diffusion of 57Co into Rh Foil for Preparing Mössbauer Source
Autorzy:
Uhm, Y. R.
Kim, J. J.
Choi, S. M.
Son, K. J.
Powiązania:
https://bibliotekanauki.pl/articles/352775.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Mössbauer source
diffusion
electroplating
57Co/Rh
Opis:
To establish the coating conditions for 57 Co, non-radioactive Co ions are dissolved in an acid solution and electroplated on to a rhodium plate. The thermal diffusion of electroplated Co into a rhodium matrix was studied to apply a 57 Co Mössbauer source. The procedure to form a Co deposited onto Rh foil was established using two different electroplating baths: the acid-based buffer (pH 3) containing boric acid, sodium chloride, and saccharin, and the alkaline-based buffer (pH 10) containing hydrazine hydrate and ammonium citrate. The influence of different annealing conditions was investigated. From the results, the best diffusion degree of electrodeposited Co onto the rhodium matrix was obtained in an annealing process performed at 1100°C for 3 h in vacuum over 10-5 hPa.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1249-1252
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Trace Elements (Co, Cr) on the Microstructure and Physical Properties of Al-Si-Cu-Mg-Fe Extruded Alloy
Autorzy:
Ahn, S. S.
Sharief, P.
Lee, C. H.
Son, H. T.
Kim, Y. H.
Kim, Y. C.
Hong, S.
Hong, S. J.
Powiązania:
https://bibliotekanauki.pl/articles/352787.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Al-Si alloy
microstructure
extrusion
coefficient of thermal expansion
trace elements
Opis:
Trace elements Co, Cr were added to investigate their influence on the microstructure and physical properties of Al-Si extruded alloy. The Co, Cr elements were randomly distributed in the matrix, forms intermetallic phase and their existence wereconfirmed by XRD, EDS and SEM analysis. With addition of trace elements, the microstructure was modified, Si particle size was reduced and the growth rate of β-(Al5 FeSi) phase limited. Compared to parent alloy, hardness and tensile strength were enhanced while the linear coefficient of thermal expansion (CTE) was significantly reduced by 42.4% and 16.05% with Co and Cr addition respectively. It is considered that the low CTE occurs with addition of Co was due to the formation of intermetallic compound having low coefficient of thermal expansion. The results suggested that Co acts as an effective element in improving the mechanical properties of Al-Si alloy.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 3; 857-862
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process
Autorzy:
Park, S. H.
Kim, D. B.
Lee, R. G.
Son, I. J.
Powiązania:
https://bibliotekanauki.pl/articles/355632.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
metal matrix composites
thermal conductivity
thermal expansion
interfacial bonding
spark plasma sintering
Opis:
This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm-1K-1 and 8 to 5 ppm k-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1303-1306
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect Of Ti Powder Addition On The Fabrication Of TiO2 Nanopowders
Wpływ dodatku nanoproszku Ti na zagęszczanie i spiekanie nanoproszków TiO2
Autorzy:
Raihanuzzaman, R. M.
Park, H. Y.
Ghomashchi, R.
Kwon, T. H.
Son, H.-T.
Hong, S.-J.
Powiązania:
https://bibliotekanauki.pl/articles/353186.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
TiO2 nanopowder
magnetic pulsed compaction
densification
sintering
nanoproszek Ti
magnetyczne zagęszczanie impulsowe
zagęszczanie
spiekanie
Opis:
Sintered samples of Ti added TiO2 nanopowders were fabricated by combined application of magnetic pulsed compaction (MPC) and sintering. The effect of Ti nano powder on density, shrinkage and hardness of the samples were investigated as part of the study. The optimum processing conditions were found to be around 0.5 GPa MPC pressure and 1450°C sintering temperature, illustrating maximum density, hardness and minimum shrinkage. High pressure compaction using MPC was found to enhance density with increasing MPC pressure up to 0.9 GPa, and significantly reduce the total shrinkage (about 16% in this case) in the sintered bulks compared to other general processes (about 18%). While sintered samples blended with micro Ti showed presence of microstructural cracks, the samples with 1-2% nano Ti had less or no cracks on them. Overall, the inclusion of nano Ti indicated improvement in mechanical properties of TiO2 nanopowders sintered preforms as opposed to micro Ti-added TiO2.
Źródło:
Archives of Metallurgy and Materials; 2015, 60, 2B; 1473-1477
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-11 z 11

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