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Wyszukujesz frazę "Koncz-Horváth, D." wg kryterium: Autor

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    Wyświetlanie 1-6 z 6
    Tytuł:
    The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering
    Wpływ powstawania pustek na wiarygodność badań ED-XRF bezołowiowych złączy lutowanych rozpływowo
    Autorzy:
    Koncz-Horváth, D.
    Gergely, G.
    Gacsi, Z.
    Powiązania:
    https://bibliotekanauki.pl/articles/355754.pdf
    Data publikacji:
    2015
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    EDXRF
    lead-free
    void
    intermetallic
    reflow
    ED-XRF
    złącze bezołowiowe
    pustka lutownicza
    lutowanie rozpływowe
    cząstka międzymetaliczna
    Opis:
    In lead-free reflow soldering, the presence of voids should be taken into account. For this reason, the effect of the applied heating profiles was examined via the characterization of voids in galvanic and immersion Sn coatings. According to EU Directive 2002/95/EC, the screening of Pb element of reflow soldering (i.e. of electrical and electronic equipment) is necessary; and the practical implementation of this measurement is largely affected by the characteristics of the solder (i.e. the presence of voids and the inhomogeneity of the solder). Comparing the results of the above two coating methods, it was found that by chemical coating more voids were formed and the detected lead content was higher than for galvanic Sn. The standard deviation of Ag and Cu concentrations was mainly influenced by the appearance of large compounds in the second case, while with chemical coating, no large compounds were formed due to the elevated number of voids.
    Źródło:
    Archives of Metallurgy and Materials; 2015, 60, 2B; 1445-1448
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Development of Crack Detection Method with 2 Dimensionally Generated 3 Dimensionally Reconstructed Images in THT Solder Joints
    Autorzy:
    Gergely, G.
    Koncz-Horváth, D.
    Weltsch, Z.
    Gacsi, Z.
    Powiązania:
    https://bibliotekanauki.pl/articles/355906.pdf
    Data publikacji:
    2017
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    serial sectioning
    reconstruction
    total crack length
    TCL
    through hole technology
    THT
    Opis:
    This work represents an interesting development in the detection and interpretation of crack evolution in through hole technology (THT) solder joints, which based on the development of general and common method. Serial sectioning is a useful method because it overcomes the problems associated with traditional two-dimensional metallographic techniques by providing information about (micro)structures in three-dimensions. In our work, serials sectioning with reconstruction method was utilized to visualize the 3D nature of cracks in through hole solder joint. Accurate quantitive analysis of the cracks, such as crack length, position and extension are presented with a help of the developed method: newly defined parameter and serial-cross sectioning method.
    Źródło:
    Archives of Metallurgy and Materials; 2017, 62, 2B; 1033-1038
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Whisker-Like Formations in Sn-3.0Ag-Pb Alloys
    Autorzy:
    Koncz-Horváth, D.
    Gergely, G.
    Gacsi, Z.
    Powiązania:
    https://bibliotekanauki.pl/articles/351400.pdf
    Data publikacji:
    2017
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    Sn-Ag alloy
    soldering
    whisker formation
    microstructure analysis
    Opis:
    In this study, different types of whisker-like formations of Sn-3.0Ag based alloy were presented. In the experimental process the amount of Pb element was changed between 1000 and 2000 ppm, and the furnace atmosphere and cooling rate were also modified. The novelty of this work was that whisker-like formations in macro scale size were experienced after an exothermic reaction. The whiskers of larger sizes than general provided opportunities to investigate the microstructure and the concentration nearby the whiskers. In addition, the whisker-like formations from Sn-Ag based bulk material did not only consist of pure tin but tin and silver phases. The whisker-like growth appeared in several forms including hillock, spire and nodule shaped formations in accordance with parameters. It was observed that the compound phases were clustered in many cases mainly at hillocks.
    Źródło:
    Archives of Metallurgy and Materials; 2017, 62, 2B; 1027-1031
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Influence of Ceramic Particles on the Microstructure and Mechanical Properties of SAC305 Lead-Free Soldering Material
    Autorzy:
    Kumar, Manoj Pal
    Gergely, G.
    Koncz-Horvath, D.
    Gacsi, Z.
    Powiązania:
    https://bibliotekanauki.pl/articles/356293.pdf
    Data publikacji:
    2019
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    composite solder
    SiC particles
    microstructure
    wettability
    microhardness
    Opis:
    In this study, silicon carbide (SiC) reinforced lead-free solder (SAC305) was prepared by the powder metallurgy method. In this method SAC305 powder and SiC powder were milled, compressed and sintered to prepare composite solder. The composite solders were characterized by optical and scanning electron microscopy for the microstructural investigation and mechanical test. Addition of 1.5 wt.% and 2 wt.% ceramic reinforcement to the composite increased compressive strengths and microhardness up to 38% and 68% compared to those of the monolithic sample. In addition, the ceramic particles caused an up to 55% decrease in the wetting angle between the substrate and the composite solder and porosity was always increased with increase of SiC particles.
    Źródło:
    Archives of Metallurgy and Materials; 2019, 64, 2; 603-606
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Reliability Examinations of SAC Lead Free Solder Material
    Autorzy:
    Koncz-Horváth, D.
    Gergely, G.
    Gyökér, Z.
    Gácsi, Z.
    Powiązania:
    https://bibliotekanauki.pl/articles/354957.pdf
    Data publikacji:
    2019
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    SAC
    thermal shock test
    intermetallic layer
    crack
    Opis:
    In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method. The solder joints were subjected to different cycle numbers up to 5000 thermal shock tests with two different thermal profiles of –30/+110°C and –40/+125°C. Microstructural properties of the tested joints were examined with the focus on intermetallic layer thickness and crack formation/propagation. Thickness of the scallop shaped Cu6Sn5 intermetallic layer was increased with increasing cycle number for both THRS and multiwave joints, but the thickening was more effective for the THRS joints. Cracks typically formed at the solder alloy/PTH barrel and the solder alloy/pin interfaces and propagated along grain boundaries and precipitations of intermetallic compound.
    Źródło:
    Archives of Metallurgy and Materials; 2019, 64, 3; 925-930
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Non-wetting to Wetting Transition Temperatures of Liquid Tin on Surfaces of Different Steel Samples Corresponding to their Spontaneous Deoxidation
    Autorzy:
    Varanasi, D.
    Aldawoudi, K. E
    Baumli, P.
    Koncz-Horvath, D.
    Kaptay, G.
    Powiązania:
    https://bibliotekanauki.pl/articles/2049712.pdf
    Data publikacji:
    2021
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    wetting transition
    deoxidation
    contact angles
    steels
    liquid tin
    Opis:
    The goal of this paper is to measure the non-wetting to wetting transition temperatures of liquid tin on surfaces of different steel samples in vacuum with residual pressure of 10-8 bar. The experiments were conducted on four steels (C45, S103, CK60 and EN1.4034) of varying compositions using pure tin (99.99%) by the sessile drop method. Non-wetting to wetting transition (contact angle decreasing below 90°) by liquid tin was observed as function of increasing temperature in the range of 820-940 K for low alloyed steels C45, S103 and CK60, while it was considerably higher (around 1130 K) for high chromium EN1.4034 steel. it is concluded that at about the same temperatures, the surfaces of the steel samples are spontaneously deoxidized due to the combined effect of high temperature, low vacuum and C-content of steels. After the oxide layer is removed, the contact angles of liquid tin on steel surfaces were found in the range of 45-80° for low alloyed C45, S103 and CK60 steels and around 20° for high chromium EN1.4034 steel. These relatively high contact angle values compared to other metal/metal couples (such as liquid Cu on steels) are due to the formation of not fully metallic intermetallic compounds (FeSn and FeSn2) at the interface (such do not form in the Cu/Fe system).
    Źródło:
    Archives of Metallurgy and Materials; 2021, 66, 2; 469-476
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-6 z 6

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