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Wyszukujesz frazę "Gergely, G." wg kryterium: Autor


Wyświetlanie 1-10 z 10
Tytuł:
Automated personalised pricing practices online
Autorzy:
Karácsony, Gergely G.
Powiązania:
https://bibliotekanauki.pl/articles/697490.pdf
Data publikacji:
2018
Wydawca:
Uniwersytet Opolski
Tematy:
automated personalised pricing
price discrimination
online trade
legal aspects of personalised pricing
Opis:
The paper discusses the problem of practices of online automated personalised pricing in Internet-based trading. The first part concerns the economics of price discrimination; the second discusses the ways this can be carried out in an online shopping environment, and the third one deals with legal aspects of the personalised pricing online practice. Finally, the author tries to assess the question whether personalised pricing is illegal, immoral, or just something we do not feel entirely comfortable about.
Źródło:
Opolskie Studia Administracyjno-Prawne; 2018, 16, 4 (2); 75-85
2658-1922
Pojawia się w:
Opolskie Studia Administracyjno-Prawne
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering
Wpływ powstawania pustek na wiarygodność badań ED-XRF bezołowiowych złączy lutowanych rozpływowo
Autorzy:
Koncz-Horváth, D.
Gergely, G.
Gacsi, Z.
Powiązania:
https://bibliotekanauki.pl/articles/355754.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
EDXRF
lead-free
void
intermetallic
reflow
ED-XRF
złącze bezołowiowe
pustka lutownicza
lutowanie rozpływowe
cząstka międzymetaliczna
Opis:
In lead-free reflow soldering, the presence of voids should be taken into account. For this reason, the effect of the applied heating profiles was examined via the characterization of voids in galvanic and immersion Sn coatings. According to EU Directive 2002/95/EC, the screening of Pb element of reflow soldering (i.e. of electrical and electronic equipment) is necessary; and the practical implementation of this measurement is largely affected by the characteristics of the solder (i.e. the presence of voids and the inhomogeneity of the solder). Comparing the results of the above two coating methods, it was found that by chemical coating more voids were formed and the detected lead content was higher than for galvanic Sn. The standard deviation of Ag and Cu concentrations was mainly influenced by the appearance of large compounds in the second case, while with chemical coating, no large compounds were formed due to the elevated number of voids.
Źródło:
Archives of Metallurgy and Materials; 2015, 60, 2B; 1445-1448
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Whisker-Like Formations in Sn-3.0Ag-Pb Alloys
Autorzy:
Koncz-Horváth, D.
Gergely, G.
Gacsi, Z.
Powiązania:
https://bibliotekanauki.pl/articles/351400.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Sn-Ag alloy
soldering
whisker formation
microstructure analysis
Opis:
In this study, different types of whisker-like formations of Sn-3.0Ag based alloy were presented. In the experimental process the amount of Pb element was changed between 1000 and 2000 ppm, and the furnace atmosphere and cooling rate were also modified. The novelty of this work was that whisker-like formations in macro scale size were experienced after an exothermic reaction. The whiskers of larger sizes than general provided opportunities to investigate the microstructure and the concentration nearby the whiskers. In addition, the whisker-like formations from Sn-Ag based bulk material did not only consist of pure tin but tin and silver phases. The whisker-like growth appeared in several forms including hillock, spire and nodule shaped formations in accordance with parameters. It was observed that the compound phases were clustered in many cases mainly at hillocks.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1027-1031
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Reliability Examinations of SAC Lead Free Solder Material
Autorzy:
Koncz-Horváth, D.
Gergely, G.
Gyökér, Z.
Gácsi, Z.
Powiązania:
https://bibliotekanauki.pl/articles/354957.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
SAC
thermal shock test
intermetallic layer
crack
Opis:
In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method. The solder joints were subjected to different cycle numbers up to 5000 thermal shock tests with two different thermal profiles of –30/+110°C and –40/+125°C. Microstructural properties of the tested joints were examined with the focus on intermetallic layer thickness and crack formation/propagation. Thickness of the scallop shaped Cu6Sn5 intermetallic layer was increased with increasing cycle number for both THRS and multiwave joints, but the thickening was more effective for the THRS joints. Cracks typically formed at the solder alloy/PTH barrel and the solder alloy/pin interfaces and propagated along grain boundaries and precipitations of intermetallic compound.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 3; 925-930
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Development of Crack Detection Method with 2 Dimensionally Generated 3 Dimensionally Reconstructed Images in THT Solder Joints
Autorzy:
Gergely, G.
Koncz-Horváth, D.
Weltsch, Z.
Gacsi, Z.
Powiązania:
https://bibliotekanauki.pl/articles/355906.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
serial sectioning
reconstruction
total crack length
TCL
through hole technology
THT
Opis:
This work represents an interesting development in the detection and interpretation of crack evolution in through hole technology (THT) solder joints, which based on the development of general and common method. Serial sectioning is a useful method because it overcomes the problems associated with traditional two-dimensional metallographic techniques by providing information about (micro)structures in three-dimensions. In our work, serials sectioning with reconstruction method was utilized to visualize the 3D nature of cracks in through hole solder joint. Accurate quantitive analysis of the cracks, such as crack length, position and extension are presented with a help of the developed method: newly defined parameter and serial-cross sectioning method.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1033-1038
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
The Inelastic Mean Free Path οf Electrons. Research in Budapest, Warsaw, Wrocław and Clermont-Ferrand. Brief History and New Results
Autorzy:
Gergely, G.
Gurban, S.
Menyhard, M.
Jablonski, A.
Zommer, L.
Powiązania:
https://bibliotekanauki.pl/articles/1177408.pdf
Data publikacji:
2008-12
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
81.05.Cy
82.80.Dx
82.80.Pv
Opis:
The inelastic mean free path of electrons (IMFP) is an important material parameter for description of electron transport processes in solids. This parameter is particularly useful for quantifying the electron spectroscopies, in particular Auger electron spectroscopy, X-ray photoelectron spectroscopy, electron energy loss spectroscopy and elastic peak electron spectroscopy. In this work, a brief overview of the IMFP determination is presented. Generally, there are two groups of methods to determine the IMFP: (i) calculations using the theoretical model based on the experimental optical data, and (ii) calculations using theory relating the IMFP and the measured probability elastic electron backscattering from solids. Major advances in the development of the second group of methods were made in three laboratories; these advances are reviewed here. The elastic backscattering probability, in absolute or relative units, can be conveniently evaluated from the elastic peak intensity. However, much effort is needed to develop the theory for calculating the IMFP, which typically involves the Monte Carlo simulations of electron trajectories in solids. Presently, this theory and typical procedures of the spectra processing are implemented in the software package EPESWIN developed by Jablonski. In recent years, much attention is devoted to the phenomenon of the electron energy losses in the surface region of solids. Reliability of the theory of elastic backscattering is distinctly improved if this effect is taken into account.
Źródło:
Acta Physica Polonica A; 2008, 114, S; S-49-S-58
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
The Transmission of the Electron Analyzers Determined by Elastic Peak Electron Spectroscopy
Autorzy:
Gruzza, B.
Bondot, P.
Porte, A.
Jardin, C.
Gergely, G.
Powiązania:
https://bibliotekanauki.pl/articles/1892398.pdf
Data publikacji:
1992-01
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
07.80.+x
25.30.Bf
68.35.-p
Opis:
Using the elastic peak electron spectroscopy (EPES), the transmission functions were determined for the 4-grid retarding field and the hemispherical analyzers, which are commonly used for surface physics experiments.
Źródło:
Acta Physica Polonica A; 1992, 81, 1; 159-164
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Influence of Ceramic Particles on the Microstructure and Mechanical Properties of SAC305 Lead-Free Soldering Material
Autorzy:
Kumar, Manoj Pal
Gergely, G.
Koncz-Horvath, D.
Gacsi, Z.
Powiązania:
https://bibliotekanauki.pl/articles/356293.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
composite solder
SiC particles
microstructure
wettability
microhardness
Opis:
In this study, silicon carbide (SiC) reinforced lead-free solder (SAC305) was prepared by the powder metallurgy method. In this method SAC305 powder and SiC powder were milled, compressed and sintered to prepare composite solder. The composite solders were characterized by optical and scanning electron microscopy for the microstructural investigation and mechanical test. Addition of 1.5 wt.% and 2 wt.% ceramic reinforcement to the composite increased compressive strengths and microhardness up to 38% and 68% compared to those of the monolithic sample. In addition, the ceramic particles caused an up to 55% decrease in the wetting angle between the substrate and the composite solder and porosity was always increased with increase of SiC particles.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 2; 603-606
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Influence of Recoil Effect and Surface Excitations on the Inelastic Mean Free Paths of Electrons in Polymers
Autorzy:
Lesiak, B.
Kosiński, A.
Jablonski, A.
Sulyok, A.
Gergely, G.
Tóth, J.
Varga, D.
Powiązania:
https://bibliotekanauki.pl/articles/2046849.pdf
Data publikacji:
2006-06
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
82.35.Cd
82.80.Pv
87.16.Ac
Opis:
In this work, the influence of recoil effect and surface excitations on the inelastic mean free paths for polythiophenes is investigated. The inelastic mean free paths of electrons in polythiophenes are measured with the elastic peak electron spectroscopy method using the Ag standard and the electron elastic scattering cross-sections from the database NIST 3.1 in the electron kinetic energy range 200-5000 eV. The Monte Carlo model is applied for evaluating the electron backscattering intensities from the polymers and the Ag standard, as well as for evaluating electrons quasi-elastically backscattered from atoms of different atomic numbers (the recoil effect). The surface excitation corrections are accounted for using the formalism of Chen, with the material parameters for polythiophenes evaluated from the elastic peak electron spectroscopy method. Deviations due to recoil effect and surface excitations to the inelastic mean free paths are compared and discussed. Correction to the inelastic mean free paths due to recoil effect is considerable but is smaller, however, than the correction due to surface excitations. Accounting for recoil effect and surface excitations leads to improvement of the inelastic mean free paths, as compared to the inelastic mean free paths resulting from the predictive formulae of Gries.
Źródło:
Acta Physica Polonica A; 2006, 109, 6; 789-800
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Microstructure And Mechanical Properties Of Al-WC Composites
Mikrostruktura i właściwości mechaniczne kompozytów Al-WC
Autorzy:
Simon, A.
Lipusz, D.
Baumli, P.
Balint, P.
Kaptay, G.
Gergely, G.
Sfikas, S.
Lekatou, A.
Karantzalis, A.
Gacsi, Z.
Powiązania:
https://bibliotekanauki.pl/articles/352222.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
composite
aluminium
WC
microstructure
mechanical properties
kompozyt
mikrostruktura
właściwości mechaniczne
Opis:
The scope of the research work is the production and characterization of Al matrix composites reinforced with WC ceramic nanoparticles. The synthesis process was powder metallurgy. The produced composites were examined as far as their microstructure and mechanical properties (resistance to wear, micro/macrohardness). Intermetallic phases (Al12W and Al2Cu) were identified in the microstrucutre. Al4C3 was not detected in the composites. Adding more than 5 wt% WC to the aluminum, microhardness and wear resistance exceed the values of Al alloy. Composites having weak interface bond performed the highest wear rate.
Źródło:
Archives of Metallurgy and Materials; 2015, 60, 2B; 1517-1521
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-10 z 10

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