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    Wyświetlanie 1-11 z 11
    Tytuł:
    Analiza termiczna kleju metakrylowego podczas procesu wiązania
    Thermal analysis of methacrylate adhesive during the bonding process
    Autorzy:
    Chmielnicki, B.
    Jurczyk, S.
    Bula, A.
    Hulimka, J.
    Powiązania:
    https://bibliotekanauki.pl/articles/946264.pdf
    Data publikacji:
    2018
    Wydawca:
    Sieć Badawcza Łukasiewicz - Instytut Inżynierii Materiałów Polimerowych i Barwników
    Tematy:
    klej metakrylowy
    analiza termowizyjna
    różnicowa kalorymetria skaningowa
    DSC
    analiza termiczna
    methacrylate adhesive
    thermovision analysis
    differential scanning calorimetry
    thermal analysis
    Opis:
    Praca przedstawia analizę termiczną wybranego kleju metakrylowego podczas procesu wiązania. W pierwszym etapie wykonano analizę termowizyjną powierzchni próbki kleju. Wyniki przedstawiono w formie termogramów oraz w postaci wykresu zmiany temperatury powierzchniowej kleju w trakcie pierwszych 22 minut procesu sieciowania. Przeprowadzono także oznaczenie ciepła procesu wiązania kleju, prowadząc analizę metodą różnicową kalorymetrii skaningowej w warunkach izotermicznych w trakcie pierwszych 60 minut po zmieszaniu składników kleju.
    The paper presents thermal analysis of the selected methacrylate adhesive during the bonding process. In the first stage, a thermovision analysis of the adhesive sample surface was made. The results are presented in thermograms and in the form of the surface temperature change graph of the adhesive during the first 22 minutes of the crosslinking process. The heat of the adhesive bonding process was also determined by differential scanning calorimetry analysis under isothermal conditions during the first 60 minutes after mixing of the adhesive components.
    Źródło:
    Przetwórstwo Tworzyw; 2018, T. 24, Nr 6 (186), 6 (186); 5-10
    1429-0472
    Pojawia się w:
    Przetwórstwo Tworzyw
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Technologiczne uwarunkowania procesu klejenia elementów z terpolimeru abs w aspekcie wykonywania modeli metodą FDM
    Technological conditions of the adhesive bonding process of elements of abs terpolymer in the aspect of printing models with FDM method
    Autorzy:
    Gościański, M.
    Ciechacki, R.
    Dudziak, B.
    Powiązania:
    https://bibliotekanauki.pl/articles/336453.pdf
    Data publikacji:
    2012
    Wydawca:
    Sieć Badawcza Łukasiewicz - Przemysłowy Instytut Maszyn Rolniczych
    Tematy:
    tworzywa sztuczne
    terpolimery
    klejenie
    typy połączeń
    właściwości fizyczne
    badania laboratoryjne
    plastics
    terpolimers
    adhesive bonding
    types of connections
    physical properties
    laboratory experimentation
    Opis:
    W pracy przedstawiono wybrane aspekty technologiczne procesu łączenia elementów wykonanych z tworzywa ABS plus w procesie klejenia. Próbki wykonano metodą FDM na drukarce przestrzennej 3D Dimension 1200 es produkcji firmy Stratasys. Celem głównym prób technologicznych klejenia elementów była ocena najlepszego typu połączenia z punktu widzenia geometrii powierzchni, sposobu łączenia, a przede wszystkim właściwości wytrzymałościowych połączenia.
    The paper presents selected technological aspects of connection process of elements made of ABS plus material in the adhesive bonding joint. Sample elements were made with FDM method on the 3D spatial printer Dimension 1200es produced by the Stratasys company. The main objective of the research was to evaluate the best type of connection made in the aspect of surface geometry, method of connection, and particularly, the strength of adhesive bonding.
    Źródło:
    Journal of Research and Applications in Agricultural Engineering; 2012, 57, 1; 47-50
    1642-686X
    2719-423X
    Pojawia się w:
    Journal of Research and Applications in Agricultural Engineering
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Proces wiązania poprzez polimeryzację metakryloamidu prowadzony in situ na osnowie mineralnej
    The process of bonding by methacrylamide polymerization conducted in situ on a mineral matrix
    Autorzy:
    Grabowska, B.
    Powiązania:
    https://bibliotekanauki.pl/articles/391542.pdf
    Data publikacji:
    2017
    Wydawca:
    Sieć Badawcza Łukasiewicz - Instytut Odlewnictwa
    Tematy:
    gelcasting
    polimeryzacja
    sieciowanie
    utwardzanie
    polimetakryloamid
    osnowa mineralna
    polymerization
    cross-linking
    hardening
    polymethacrylamide
    mineral matrix
    Opis:
    Proces wiązania poprzez polimeryzację metakryloamidu prowadzono in situ na osnowie kwarcowej w temperaturze 25°C oraz w polu mikrofal (150°C; 800 W; 2,45 GHz). Skład mieszaniny reakcyjnej, oprócz metakryloamidu – jako monomeru, zawierał: inicjator (nadsiarczan amonu), aktywator (N,N,N’,N’-tetrametyloetylenodimina), upłynniacz (sorbitol) oraz osnowę kwarcową. Zmiany strukturalne powstałe wskutek oddziaływań makromolekularnych w mieszaninie reakcyjnej podczas procesu polimeryzacji metakryloamidu, a dalej konsolidacji ziaren osnowy, określono metodą spektroskopii w podczerwieni przy użyciu spektrometru z transformacją Fouriera (FTIR). Stwierdzono, że podczas sieciowania powstają nowe wiązania w obrębie grup polarnych, typu: -OH, >NH, >C=O oraz silanolowych (Si-O). Ponadto przeprowadzono termoanalizę układu reakcyjnego w zakresie temperatury 25−500°C z zastosowaniem metody spektroskopii rozproszonego odbicia (FTIR-DRS). Badania te miały na celu określenie zakresu temperatury, w którym dochodzi do zmian związanych z sieciowaniem układu, a jeszcze nie jego termodestrukcją. Dla otrzymanego układu poreakcyjnego wykonano badania mikroskopowe metodą SEM. Uzyskana wiedza na temat procesu wiązania, poprzedzonego polimeryzacją metakryloamidu prowadzoną in situ na osnowie kwarcowej, pozwoli na podjęcie dalszych prac w obszarze technologii formowania i konsolidacji układów polimerowo-krzemianowych metodą druku 3D.
    The process of bonding by polymerization of methacrylamide was performed in situ on a quartz matrix at 25°C as well as in a microwave field (150°C; 800 W; 2.45 GHz). The composition of the reaction mixture, beside methylacrylamide as the monomer, was: the initiator (ammonium persulfate), the activator (N,N,N’,N’-tetramethylethylenediamine), the fluidizer (sorbit) and the quartz matrix. The structural changes occurring as a result of macromolecular reactions in the reaction mixture during the process of methacrylamide polymerization and then consolidation of the matrix grains, were determined by means of Fourier transform infrared spectroscopy (FTIR). It was found that during the cross-linking, new bonds are formed within the polar groups, of the following types: -OH, >NH, >C=O and silanol (Si-O). Also, a thermoanalysis of the reaction system was performed in the temperature range of 25−500°C with the use of dispersed reflection spectroscopy (FTIR-DRS). These studies aimed at determining the temperature range in which we can observe changes connected with the cross-linking of the system, and not its thermodestruction. For the obtained post-reaction system, SEM microscopic examinations were performed. The obtained knowledge of the bonding process, preceded by methacrylamide polymerization performed in situ on a quartz matrix, will make it possible to conduct further research in the scope of the technology of forming and consolidating polymer-silicate systems with the method of 3D printing.
    Źródło:
    Prace Instytutu Odlewnictwa; 2017, 57, 2; 115-124
    1899-2439
    Pojawia się w:
    Prace Instytutu Odlewnictwa
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric Elements
    Autorzy:
    Kim, Subin
    Bae, Sung Hwa
    Son, Injoon
    Powiązania:
    https://bibliotekanauki.pl/articles/2049171.pdf
    Data publikacji:
    2021
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    thermoelectric
    ENEPIG
    bonding strength
    BiTe
    plating
    Opis:
    To improve the mechanical performance of BiTe-based thermoelectric modules, this study applies anti-diffusion layers that inhibit the generation of metal intercompounds and an electroless nickel/electrode palladium/mission gold (ENEPIG) plating layers to ensure a stable bonding interface. If a plated layer is formed only on BiTe-based thermoelectric, the diffusion of Cu in electrode substrates produces an intermetallic compound. Therefore, the ENEPIG process was applied on the Cu electrode substrate. The bonding strength highly increased from approximately 10.4 to 16.4 MPa when ENEPIG plating was conducted to the BiTe-based thermoelectric element. When ENEPIG plating was performed to both the BiTe-based thermoelectric element and the Cu electrode substrate, the bonding strength showed the highest value of approximately 17.6 MPa, suggesting that the ENEPIG process is ef-fective in ensuring a highly reliable bonding interface of the BiTe-based thermoelectric module.
    Źródło:
    Archives of Metallurgy and Materials; 2021, 66, 4; 967-970
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Microstructure and Mechanical Properties of AA1050/ AA6061/AA1050 Multi-Layer Sheet Fabricated by Cold Roll Bonding Process
    Autorzy:
    Lee, S.-H.
    Powiązania:
    https://bibliotekanauki.pl/articles/353150.pdf
    Data publikacji:
    2018
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    cold roll bonding process
    AA1050/AA6061/AA1050 complex sheet
    mechanical properties
    electron backscatter diffraction
    microstructure
    Opis:
    A cold roll-bonding process was applied to fabricate an AA1050/AA6061/AA1050 multi-layer sheet. Three Al sheets in which an AA6061 sheet is inserted inside two AA1050 sheets of 2 mm thickness, 40 mm width and 300 mm length were stacked up after surface treatment, and the material was then reduced to a thickness of 1.0 mm by multi-pass cold rolling. The AA1050/AA6061/AA1050 laminate complex sheet fabricated by roll bonding was then hardened by a natural aging (T4) and an artificial aging (T6) treatments. The microstructures of the as-roll bonded and the age-hardened Al complex sheets were revealed by optical microscope and electron back scatter diffraction analysis, and the mechanical properties were investigated by tensile and hardness testing. The strength of the as-roll bonded complex sheet was found to increase by 2.6 times, compared to that value of the starting material. Both AA1050 and AA6061 showed a typical recrystallization structure in which the grains were equiaxed after heat treatment. However, the grain size was smaller in AA6061 than in AA1050.
    Źródło:
    Archives of Metallurgy and Materials; 2018, 63, 3; 1489-1492
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Fabrication and Evaluation of AA6061/AA5052/AA6061/AA5052 Multi-Layer Complex Sheet by Cold-Roll Bonding Process
    Autorzy:
    Lee, Seong-Hee
    Powiązania:
    https://bibliotekanauki.pl/articles/353230.pdf
    Data publikacji:
    2020
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    aluminum alloy
    cold roll-bonding
    aging treatment
    mechanical properties
    microstructure
    Opis:
    A cold roll bonding process is applied to fabricate an AA6061/AA5052/AA6061/AA5052multi-layer sheet. Two AA6061 and two AA5052 sheets with 2mm thickness are stacked alternately to each other, and reduced to a thickness of 2 mm by multi-pass cold rolling. The roll bonded multi-layer sheet is then hardened by natural aging (T4) and artificial aging (T6) treatments. The as roll-bonded sheet shows a typical deformation structure that the grains are elongated to the rolling direction. However, after T4 and T6 aging treatments, it has a recrystallization structure consisting of the coarse equiaxed grains in both AA5052 and AA6061 sheets. The as rolled material shows a lamella structure in which AA5052 and AA6061 sheets are stacked alternately to each other, having higher hardness in AA5052 than in AA6061. However, T4 and T6 aging treated materials show a different lamella structurein which the hardness of the AA6061 layers is higher than that of the AA5052 layers. The strengths of the T4 and T6 age-treated specimens are found to increase by 1.3 and 1.5 times respectively, compared to that of the starting material.
    Źródło:
    Archives of Metallurgy and Materials; 2020, 65, 3; 1093-1097
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Characterization of the Bonding Zone in a ZE41/AlSi12 Joint Fabricated by Liquid- Solid Compound Casting
    Autorzy:
    Mola, R.
    Bucki, T.
    Powiązania:
    https://bibliotekanauki.pl/articles/381097.pdf
    Data publikacji:
    2018
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    innovative foundry technology
    innovative foundry material
    compound casting process
    magnesium alloy
    aluminum alloy
    bonding zone
    innowacyjna technologia odlewnicza
    innowacyjny materiał odlewniczy
    proces odlewania
    stop magnezu
    stop aluminium
    strefa złącza
    Opis:
    The study involved using the liquid-solid compound casting process to fabricate a lightweight ZE41/AlSi12 bimetallic material. ZE41 melt heated to 660 °C was poured onto a solid AlSi12 insert placed in a steel mold. The mold with the insert inside was preheated to 300 °C. The microstructure of the bonding zone between the alloys was examined using optical microscopy and scanning electron microscopy. The chemical composition was determined through linear and point analyses with an energy-dispersive X-ray spectroscope (EDS). The bonding zone between the magnesium and aluminum alloys was about 250 μm thick. The results indicate that the microstructure of the bonding zone changes throughout its thickness. The structural constituents of the bonding zone are: a thin layer of a solid solution of Al and Zn in Mg and particles of Mg-Zn-RE intermetallic phases (adjacent to the ZE41 alloy), a eutectic region (Mg17(Al,Zn)12 intermetallic phase and a solid solution of Al and Zn in Mg), a thin region containing fine, white particles, probably Al-RE intermetallic phases, a region with Mg2Si particles distributed over the eutectic matrix, and a region with Mg2Si particles distributed over the Mg-Al intermetallic phases matrix (adjacent to the AlSi12 alloy). The microstructural analysis performed in the length direction reveals that, for the process parameters tested, the bonding zone forming between the alloys was continuous. Low porosity was observed locally near the ZE41 alloy. The shear strength of the AZ91/AlSi17 joint varied from 51.3 to 56.1 MPa.
    Źródło:
    Archives of Foundry Engineering; 2018, 18, 2; 203-208
    1897-3310
    2299-2944
    Pojawia się w:
    Archives of Foundry Engineering
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Microstructure of the Bonding Zone Between AZ91 and AlSi17 Formed by Compound Casting
    Autorzy:
    Mola, R.
    Bucki, T.
    Dziadoń, A.
    Powiązania:
    https://bibliotekanauki.pl/articles/379744.pdf
    Data publikacji:
    2017
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    casting process
    joining
    magnesium alloys
    aluminum alloys
    intermetallic phases
    microstructure
    proces odlewania
    łączenie
    stop magnezu
    stop aluminium
    faza intermetaliczna
    mikrostruktura
    Opis:
    This paper discusses the joining of AZ91 magnesium alloy with AlSi17 aluminium alloy by compound casting. Molten AZ91 was cast at 650oC onto a solid AlSi17 insert placed in a steel mould under normal atmospheric conditions. Before casting, the mould with the insert inside was heated up to about 370oC. The bonding zone forming between the two alloys as a result of diffusion had a multiphase structure and a thickness of about 200 μm. The microstructure and composition of the bonding zone were analysed using optical microscopy, scanning electron microscopy and energy dispersive X-ray spectroscopy. The results indicate that the bonding zone adjacent to the AlSi17 alloy was composed of an Al3Mg2 intermetallic phase with not fully consumed primary Si particles, surrounded by a rim of an Mg2Si intermetallic phase and fine Mg2Si particles. The bonding zone near the AZ91 alloy was composed of a eutectic (an Mg17Al12 intermetallic phase and a solid solution of Al and Si in Mg). It was also found that the compound casting process slightly affected the AZ91alloy microstructure; a thin layer adjacent to the bonding zone of the alloy was enriched with aluminium.
    Źródło:
    Archives of Foundry Engineering; 2017, 17, 1; 202-206
    1897-3310
    2299-2944
    Pojawia się w:
    Archives of Foundry Engineering
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process
    Autorzy:
    Park, S. H.
    Kim, D. B.
    Lee, R. G.
    Son, I. J.
    Powiązania:
    https://bibliotekanauki.pl/articles/355632.pdf
    Data publikacji:
    2017
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    metal matrix composites
    thermal conductivity
    thermal expansion
    interfacial bonding
    spark plasma sintering
    Opis:
    This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm-1K-1 and 8 to 5 ppm k-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.
    Źródło:
    Archives of Metallurgy and Materials; 2017, 62, 2B; 1303-1306
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    A New Approach to Modelling and Testing the Fatigue Strength of Helicopter Rotor Blades during Repair Process
    Autorzy:
    Sałaciński, Michał
    Kowalski, Rafał
    Szmidt, Michał
    Augustyn, Sławomir
    Powiązania:
    https://bibliotekanauki.pl/articles/98006.pdf
    Data publikacji:
    2019
    Wydawca:
    Sieć Badawcza Łukasiewicz - Instytut Lotnictwa
    Tematy:
    rotor blade
    helicopter
    fatigue test
    repairs
    bonding
    composites
    Opis:
    The fatigue test was carried out on an element of a rotor blade removed from the Mi-2 helicopter. The purpose of the test was to check the fatigue strength of the repaired rotor blade. Metal composite rotor blades have a metal spar in the form of a box and the trailing sections in the form of metallic honeycomb sandwich panels. The trailing sections are bonded to the spar. The repair had been carried out at the point where the trailing section became debonded from the spar at the Air Force Institute of Technology in Warsaw using a methodology developed for carrying out repairs of rotor blades’ damage. All types of the Mi family helicopters are equipped with metal composite rotors blades. Depending on MTOW (Maximum Take-Off Weight) and destination of helicopters, blades differ in dimensions, but their design solutions are practically the same. For this reason, the developed repair methodology can be used for all characteristic rotor blades structures for Mi helicopters. The fatigue test was performed at the Łukasiewicz - Institute of Aviation in Warsaw, using a hydraulically driven fatigue machine. The fatigue test was carried out by performing over 1.1 million load cycles. In repair places, upon completion of fatigue testing, no damage was found.
    Źródło:
    Fatigue of Aircraft Structures; 2019, 11; 56-67
    2081-7738
    2300-7591
    Pojawia się w:
    Fatigue of Aircraft Structures
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Numerical analysis of contact plastic bodies made by aluminium alloy with taking account of micro-roughness surfaces
    Autorzy:
    Sidun, Paweł
    Piwnik, Jan
    Powiązania:
    https://bibliotekanauki.pl/articles/279880.pdf
    Data publikacji:
    2019
    Wydawca:
    Polskie Towarzystwo Mechaniki Teoretycznej i Stosowanej
    Tematy:
    bonding process
    FEM analysis
    cold welding
    wave roughness
    Opis:
    The following article describes selected aspects of numerical modeling of the process of bonding metal alloys with consideration for micro-roughness. Plastic contact between two deformable bodies is studied within a DEFROM FEM environment. The paper presents selected numerical analysis results for an aluminum alloy. The mathematical model of surface roughness has been created on the basis of the surface real profile. The dependence between the tool lathe angle and the feed has been used to build a numerical model of roughness after completion of the turning process. The article investigates the impact of wave roughness in respect to the size effect and the possibility of cold welding as well as the simplification process of real surface roughness.
    Źródło:
    Journal of Theoretical and Applied Mechanics; 2019, 57, 1; 73-84
    1429-2955
    Pojawia się w:
    Journal of Theoretical and Applied Mechanics
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
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