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Wyświetlanie 1-15 z 21
Tytuł:
Effect of Surface Treatments on Cast-Bonding Characteristics of Steel-Aluminum Hybrid Composite Materials
Autorzy:
Kim, Hyo-Jung
Kim, Tae Hyeong
Shin, Je Sik
Park, Seung Yeon
Hyun, Soongkeun
Lim, Kyoung Mook
Powiązania:
https://bibliotekanauki.pl/articles/353007.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
cast-bonding
aluminum
steel sheet
composite material
bonding surface
Opis:
In this study, we investigated the bonding mechanism of surface-treated steel with an Al-Si alloy in order to produce steel-aluminum (STL-Al) hybrid composite materials by cast-bonding. The results showed that there are differences in the phase and properties of the hybrid composite materials bonded specimens depending on the surface treatment of the steel sheet used, and that the bonding conditions can be controlled further by detailed conditions of the surface treatment. Based on the interfacial bonding strengths measured here, the galvanized surface treatment induced metallurgical bonding to form a reaction layer on the bonding surface and was determined to be the most effective surface treatment.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 3; 889-892
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Sn-Pd-Ni Electroplating on Bi2Te3-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding Interface
Autorzy:
Kang, Seok Jun
Bae, Sung Hwa
Son, Injoon
Powiązania:
https://bibliotekanauki.pl/articles/2049169.pdf
Data publikacji:
2021
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
tin electroplating
thermoelectric module
thermocompression bonding
Bi2Te3
direct bonding
Opis:
The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi2Te3-based thermoelectric (TE) modules, as Sn-based solder alloys have a low melting temperature (approximately 220°C) and good wettability with Cu electrodes. However, this process may result in uneven solder thickness when the printing pressure is not constant. Therefore, we suggested a novel direct-bonding method between the Bi2Te3-based TE elements and the Cu electrode by electroplating a 100 μm Sn/ 1.3 μm Pd/ 3.5 μm Ni bonding layer onto the Bi2Te3-based TE elements. It was determined that there is a problem with the amount of precipitation and composition depending on the pH change, and that the results may vary depending on the composition of Pd. Thus, double plating layers were formed, Ni/Pd, which were widely commercialized. The Sn/Pd/Ni electroplating was highly reliable, resulting in a bonding strength of 8 MPa between the thermoelectric and Cu electrode components, while the Pd and Ni electroplated layer acted as a diffusion barrier between the Sn layer and the Bi2Te3 TE. This process of electroplating Sn/Pd/Ni onto the Bi2Te3 TE elements presents a novel method for the fabrication of TE modules without using the conventional Sn-alloy-paste screen-printing method.
Źródło:
Archives of Metallurgy and Materials; 2021, 66, 4; 963-966
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric Elements
Autorzy:
Kim, Subin
Bae, Sung Hwa
Son, Injoon
Powiązania:
https://bibliotekanauki.pl/articles/2049171.pdf
Data publikacji:
2021
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermoelectric
ENEPIG
bonding strength
BiTe
plating
Opis:
To improve the mechanical performance of BiTe-based thermoelectric modules, this study applies anti-diffusion layers that inhibit the generation of metal intercompounds and an electroless nickel/electrode palladium/mission gold (ENEPIG) plating layers to ensure a stable bonding interface. If a plated layer is formed only on BiTe-based thermoelectric, the diffusion of Cu in electrode substrates produces an intermetallic compound. Therefore, the ENEPIG process was applied on the Cu electrode substrate. The bonding strength highly increased from approximately 10.4 to 16.4 MPa when ENEPIG plating was conducted to the BiTe-based thermoelectric element. When ENEPIG plating was performed to both the BiTe-based thermoelectric element and the Cu electrode substrate, the bonding strength showed the highest value of approximately 17.6 MPa, suggesting that the ENEPIG process is ef-fective in ensuring a highly reliable bonding interface of the BiTe-based thermoelectric module.
Źródło:
Archives of Metallurgy and Materials; 2021, 66, 4; 967-970
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Torsion Property of the Structure Bonded Aluminum Foam Due to Impact
Autorzy:
Hwang, G. W.
Cho, J. U.
Powiązania:
https://bibliotekanauki.pl/articles/352148.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
aluminum foam
bonding stress
fracture energy
adhesively bonded structure
Opis:
An aluminum foam added with foaming agent, is classified into an open-cell type for heat transfer and a closed-cell type for shock absorption. This study investigates the characteristic on the torsion of aluminum foam for a closed-cell type under impact. The fracture characteristics are investigated through the composite of five types of aluminum foam (the thicknesses of 25, 35, 45, 55 and 65 mm), when applying the torsional moment of impact energy on the junction of a porous structure attached by an adhesive. When applying the impact energy of 100, 200 and 300J, the aluminum foams with thicknesses of 25 mm and 35 mm broke off under all conditions. For the energy over 200J, aluminums thicker than 55 mm continued to be attached. Furthermore, the aluminum specimens with thicknesses of 55 mm and 65 mm that were attached with more than 30% of bonding interface remained, proving that they could maintain bonding interface against impact energy. By comparing the data based on the analysis and test result, an increase in the thickness of specimen leads to the plastic deformation as the stress at the top and bottom of bonding interface moves to the middle by spreading the stress horizontally. Based on this fracture characteristic, this study can provide the data on the destruction and separation of bonding interface and may contribute to the safety design.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1353-1357
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules
Autorzy:
Kim, S. S.
Son, I.
Kim, K. T.
Powiązania:
https://bibliotekanauki.pl/articles/356583.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermoelectric
Ni–P plating
bonding strength
Bi–Te
soldering
Opis:
In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1225-1229
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Pd-P Layer on the Bonding Strength of Bi-Te Thermoelectric Elements
Autorzy:
Bae, Sung Hwa
Han, Se Hun
Son, Injoon
Kim, Kyung Tae
Powiązania:
https://bibliotekanauki.pl/articles/353621.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
bismuth telluride
thermoelectric module
electroless Pd-P plating
bonding strength
Opis:
In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoelectric elements without electroless Pd-P plating, and the fracture of the bond originated from these intermetallic compounds. A Pd-Sn solder reaction layer with a thickness of approximately 20 μm was formed under the Pd-P plating layer in the case of the electroless Pd-P plating, and prevented the diffusion of Bi and Te. In addition, the fracture did not occur on the bonding interface but in the thermoelectric elements for the electroless Pd-P plating because the bonding strength of the Pd-Sn reaction layer was higher than the shear strength of the thermoelectric elements.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 3; 963-968
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Fabrication and Evaluation of AA6061/AA5052/AA6061/AA5052 Multi-Layer Complex Sheet by Cold-Roll Bonding Process
Autorzy:
Lee, Seong-Hee
Powiązania:
https://bibliotekanauki.pl/articles/353230.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
aluminum alloy
cold roll-bonding
aging treatment
mechanical properties
microstructure
Opis:
A cold roll bonding process is applied to fabricate an AA6061/AA5052/AA6061/AA5052multi-layer sheet. Two AA6061 and two AA5052 sheets with 2mm thickness are stacked alternately to each other, and reduced to a thickness of 2 mm by multi-pass cold rolling. The roll bonded multi-layer sheet is then hardened by natural aging (T4) and artificial aging (T6) treatments. The as roll-bonded sheet shows a typical deformation structure that the grains are elongated to the rolling direction. However, after T4 and T6 aging treatments, it has a recrystallization structure consisting of the coarse equiaxed grains in both AA5052 and AA6061 sheets. The as rolled material shows a lamella structure in which AA5052 and AA6061 sheets are stacked alternately to each other, having higher hardness in AA5052 than in AA6061. However, T4 and T6 aging treated materials show a different lamella structurein which the hardness of the AA6061 layers is higher than that of the AA5052 layers. The strengths of the T4 and T6 age-treated specimens are found to increase by 1.3 and 1.5 times respectively, compared to that of the starting material.
Źródło:
Archives of Metallurgy and Materials; 2020, 65, 3; 1093-1097
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Characteristics of Die-Attach Method by Sinter Bonding Using Ag-40Cu Mechanically Alloyed Particles
Autorzy:
Choi, Woo Lim
Lee, Jong-Hyun
Powiązania:
https://bibliotekanauki.pl/articles/355701.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
mechanical alloying
Ag-Cu
die-attach
sinter bonding
shear strength
Opis:
Ag and Cu powders were mechanically alloyed using high-energy planetary milling to evaluate the sinter-bonding characteristics of a die-attach paste containing particles of these two representative conductive metals mixed at atomic scale. This resulted in the formation of completely alloyed Ag-40Cu particles of 9.5 μm average size after 3 h. The alloyed particles exhibited antioxidation properties during heating to 225°C in air; the combination of high pressure and long bonding time at 225°C enhanced the shear strength of the chip bonded using the particles. Consequently, the chips sinter-bonded at 225°C and 10 MPa for 10 min exhibited a sufficient strength of 15.3 MPa. However, an increase in bonding temperature to 250°C was detrimental to the strength, due to excessive oxidation of the alloyed particles. The mechanically alloyed phase in the particle began to decompose into nanoscale Ag and Cu phases above a bonding temperature of 225°C during heating.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 2; 507-512
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste
Autorzy:
Jo, Kyeong Hwan
Lee, Jong-Hyun
Powiązania:
https://bibliotekanauki.pl/articles/351336.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
die attach
Cu formate paste
sinter bonding
Cu finish
shear strength
Opis:
A paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesisn of the plate-type Cu formate particles from CuO was accomplished through a wet reaction for 180 min. Cu, formed in situ in the bondline by pyrolysis of the formate during heating for the attachment, was sufficiently active to lead high-speed sintering within a carbon dioxide-hydrogen atmosphere derived from the pyrolysis, and the oxide layer on the Cu finish was reduced by the hydrogen. As a result, sinter bonding for 10 min formed a robust bonding with a shear strength approaching 27 MPa.
Źródło:
Archives of Metallurgy and Materials; 2020, 65, 3; 1057-1061
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process
Autorzy:
Park, S. H.
Kim, D. B.
Lee, R. G.
Son, I. J.
Powiązania:
https://bibliotekanauki.pl/articles/355632.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
metal matrix composites
thermal conductivity
thermal expansion
interfacial bonding
spark plasma sintering
Opis:
This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm-1K-1 and 8 to 5 ppm k-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1303-1306
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Change In Microstructure and Mechanical Properties Of Four-Layer Stack ARB Processed Complex Aluminum Sheet with Annealing
Autorzy:
Jo, Sang-Hyeon
Lee, Seong-Hee
Powiązania:
https://bibliotekanauki.pl/articles/2049296.pdf
Data publikacji:
2021
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
accumulative roll bonding
heterogeneous microstructure
aluminum alloy
electron back scatter diffraction
annealing
Opis:
The four-layer stack accumulative roll bonding (ARB) process using AA1050, AA5052 and AA6061 alloy sheets is performed up to 2 cycles without a lubricant at room temperature. The sample fabricated by the ARB is a multi-layer complex aluminum alloy sheet in which the AA1050, AA5052 and AA6061 alloys are alternately stacked to each other. The changes of microstructure and mechanical properties with annealing for the-ARBed aluminum sheet are investigated in detail. The as-ARBed sheet shows an ultrafine grained structure, however the grain diameter is some different depending on the kind of aluminum alloys. The complex aluminum alloy still shows ultrafine structure up to annealing temperature of 250℃, but above 275℃ it exhibits a heterogeneous structure containing both the ultrafine grains and the coarse grains due to an occurrence of discontinuous recrystallization. This change in microstructure with annealing also has an effect on the change of the mechanical properties of the sample. Especially, the specimen annealed at 300℃ represents abnormal values for the strength coefficient K and work hardening exponent n value.
Źródło:
Archives of Metallurgy and Materials; 2021, 66, 3; 765-770
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Cone Size on the Bonding Strength of Bimetallic Composite Pipes Produced by Drawing Approach
Autorzy:
Zheng, M.
Zhao, T.
Gao, H.
Teng, H.
Hu, J.
Powiązania:
https://bibliotekanauki.pl/articles/352274.pdf
Data publikacji:
2018
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
bi-metallic composite pipe
drawing approach
cone size
interfacial bonding strength
ideal elastoplastic
Opis:
The effect of cone size on interfacial bonding strength of bimetallic composite pipe manufactured by drawing approach is studied on base of the plane strain assumption and ideal elastic-plastic model, a simple expression for the effect of cone size on the bonding strength of bimetallic composite pipes is proposed. The agreement of the predicted results with the experimental results shows the reliability.
Źródło:
Archives of Metallurgy and Materials; 2018, 63, 1; 451-456
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
The Effect of Power Ultrasound on Microstructure Evolution During the Transient Liquid Stage of Ultrasonic-Promoted TLP Bonding SiCp/Al MMCs
Autorzy:
Zhou, Changzhuang
Ma, Lin
Zhu, Chao
Cui, Qinghe
Liang, Jindi
Song, Yujian
Powiązania:
https://bibliotekanauki.pl/articles/2174569.pdf
Data publikacji:
2022
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
transient liquid phase bonding
silicon carbide reinforced aluminum matrix composites
ultrasonics
zinc interlayer
Opis:
Ultrasound-promoted transient liquid phase bonding (U-TLP) is a high quality, high efficiency, and low-cost method for fast bonding of difficult-wetting materials in the atmospheric environment. In this paper, U-TLP was used to bond SiC particles reinforced aluminium-based metal matrix composite which particle volume fraction was 70%. The pure zinc foil was used as the intermediate layer. The effects of ultrasonic on microstructure evolution and mechanical properties of joints during the transient liquefaction stage were investigated. The mechanism of ultrasonic effects in the transient liquefaction stage of U-TLP was also inducted. The results showed that high volume fraction SiCp/Al MMCs were bonded well at low temperature in the air environment. Ultrasonic vibration can remove the oxide film on the surface of aluminum matrix composites, enhance the wettability of SiC particles with weld metal, promote atomic diffusion and homogenization of SiC particles, and improve the welding quality and efficiency. Reasonable increase of ultrasonic vibration time could effectively improve the joint strength.
Źródło:
Archives of Metallurgy and Materials; 2022, 67, 4; 1283--1291
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
Autorzy:
Hwang, J. H.
Lee, J.-H.
Powiązania:
https://bibliotekanauki.pl/articles/353042.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Sn-coated Cu
immersion plating
chip bonding
intermetallic compounds (IMC)
transient liquid phase (TLP)
sintering
Opis:
Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1143-1148
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Enhancement of Explosive Welding Possibilities by the Use of Emulsion Explosive
Rozwój możliwości łączenia wybuchowego przez użycie emulsji wybuchowych
Autorzy:
Zlobin, B.
Silvestrov, V. V.
Shtertser, A.
Plastinin, A.
Kiselev, V.
Powiązania:
https://bibliotekanauki.pl/articles/357048.pdf
Data publikacji:
2014
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
explosive welding
emulsion explosive
carbide composite
bonding formation
zgrzewanie wybuchowe
emulsja wybuchowa
kompozyt węglika
spajanie klejowe
Opis:
Explosive welding is an effective method of joining of various metals and alloys. However, when the materials with very different strength and thermo-physical properties are welded or thin-layer cladding is performed, the difficulties occur which call for extra investigations. In the present paper, with the couples of steel / carbide composite and copper / hardened steel used as examples, under study were the peculiarities of bonding formation by the explosive welding of metals with highly differing properties. The experiments were carried out with emulsion explosive containing hollow micro-spheres and detonating in thin layers with the low (2 - 3 km/s) detonation velocity. Obtained results show that the emulsion explosives enable to extend the explosion welding potentiality.
Połączenie wybuchowe jest wydajną metodą łączenia silnie zróżnicowanych metali i stopów. Jednakże, pojawiają się realne trudności w łączeniu, gdy jeden z materiałów posiada bardzo odmienne właściwości wytrzymałościowe lub termo-fizyczne bądź też wytwarzane jest połączenie bardzo cienkich folii. W niniejszej pracy, badano przykładowe: stal/węglik oraz miedź/stal hartowana, jako układy materiałów o silnie zróżnicowanych własnościach spajanych z wykorzystaniem metod wybuchowych. Badania eksperymentalne wykonano z użyciem emulsji wybuchowych zawierających wydrążone mikrosfery oraz układy złożone z cienkich warstw. Proces łączenia wykonywano z wykorzystaniem małych prędkości detonacji (2-3 km/s). Otrzymane rezultaty pokazują, że zastosowanie emulsji wybuchowych znacznie poszerza potencjalny zakres możliwości wykorzystania techniki spajania wybuchowego.
Źródło:
Archives of Metallurgy and Materials; 2014, 59, 4; 1587-1592
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
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