- Tytuł:
- Correlation Between Pin Misalignment and Crack Length in THT Solder Joints
- Autorzy:
-
Molnar, A.
Benke, M.
Gacsi, Z. - Powiązania:
- https://bibliotekanauki.pl/articles/353833.pdf
- Data publikacji:
- 2017
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
THT solder joint
pin misalignment
crack propagation
thermal shock tests - Opis:
- In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.
- Źródło:
-
Archives of Metallurgy and Materials; 2017, 62, 2B; 1063-1066
1733-3490 - Pojawia się w:
- Archives of Metallurgy and Materials
- Dostawca treści:
- Biblioteka Nauki
Artykuł