- Tytuł:
- Surface forces in chemical mechanical planarization and semiconductor wafer cleaning systems
- Autorzy:
-
Hupka, Lukasz
Nalaskowski, Jakub
Miller, Jan D.
Hupka, Jan - Powiązania:
- https://bibliotekanauki.pl/articles/1853722.pdf
- Data publikacji:
- 2021
- Wydawca:
- Polskie Towarzystwo Chemiczne
- Tematy:
-
chemical mechanical planarization
CMP
surface chemistry phenomena
colloidal probe
atomic force microscopy
AFM - Opis:
- Superior uniformity and local planarity of semiconductor wafers in the chemical mechanical planarization (CMP) process as well as efficient post-CMP cleaning is controlled by surface chemistry phenomena. The AFM colloidal probe technique was used to demonstrate surface forces which are of special significance to CMP and post-CMP cleaning. Examples of ways to manipulate those interactions are provided, and the benefits to CMP processes and post-CMP cleaning are discussed.
- Źródło:
-
Wiadomości Chemiczne; 2021, 75, 9-10; 1229-1240
0043-5104
2300-0295 - Pojawia się w:
- Wiadomości Chemiczne
- Dostawca treści:
- Biblioteka Nauki
Artykuł