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Wyszukujesz frazę "microelectromechanical systems (MEMS)" wg kryterium: Temat


Wyświetlanie 1-6 z 6
Tytuł:
Development of the basic acoustic elements models on the base of the VHDL – AMS language for computer-aided design at the schemotechnical level
Autorzy:
Teslyuk, V.
Holovatyy, A.
Alshawabkeh, H. A.
Powiązania:
https://bibliotekanauki.pl/articles/410618.pdf
Data publikacji:
2018
Wydawca:
Polska Akademia Nauk. Oddział w Lublinie PAN
Tematy:
microelectromechanical systems (MEMS)
VHDL-AMS model
basic acoustic element
schematic design level
Opis:
In this paper the basic acoustic elements models are developed on the base of the VHDL-AMS language. Constructed models are based on the thin plates theory and are intended to be used in computer-aided design at the schematic level of basic acoustic MEMS elements. The results of the models for basic acoustic elements of piezoelectric and electrostatic types investigation are also presented.
Źródło:
ECONTECHMOD : An International Quarterly Journal on Economics of Technology and Modelling Processes; 2018, 7, 2; 53-58
2084-5715
Pojawia się w:
ECONTECHMOD : An International Quarterly Journal on Economics of Technology and Modelling Processes
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Static, free and forced vibration analysis of a delaminated microbeam-based MEMS subjected to the electrostatic force
Autorzy:
Razeghi-Harikandeei, A.
Azizollah Ganji, B.
Jafari-Talookolaei, R.-A.
Abdipour, A.
Powiązania:
https://bibliotekanauki.pl/articles/38444172.pdf
Data publikacji:
2020
Wydawca:
Instytut Podstawowych Problemów Techniki PAN
Tematy:
microelectromechanical systems (MEMS)
delaminated microbeam
static deflection
pull-in voltage
non-linear electrostatic force
Opis:
In this paper, the delamination effect on the static and natural frequency response of a microbeam subjected to the nonlinear electrostatic force is studied using a semi-analytical approach for the first time. The Euler–Bernoulli beam assumption along with the non-classical modified couple stress theory is used to obtain the governing differential equation of motion and then a reduced-order model based on Galerkin’s decomposition method is obtained. At first the microbeam with very small delamination like an intact microbeam is solved and then the solution is compared with those reported in the literature and the solution obtained using 3D-coupled electromechanical software. After validation, the effects of delamination length and its locations in thickness and length directions on the microbeam behavior are investigated in details. It is shown that the delamination has remarkable effects on the characteristics of the microbeam, especially near the pull-in voltage. Also, the delaminated microbeam with various thicknesses is studied using both the classical and the non-classical theories. It is found that the difference between the two models is significant for the thin microbeam with a thickness near of below than its material length scale parameter. This investigation is helpful for the nondestructive detection of the delamination in the beams.
Źródło:
Archives of Mechanics; 2020, 72, 2; 169-188
0373-2029
Pojawia się w:
Archives of Mechanics
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Efficiency of MEMS inertial sensors used in low-dynamics application
Autorzy:
Szumski, A.
Eissfeller, B.
Powiązania:
https://bibliotekanauki.pl/articles/117053.pdf
Data publikacji:
2017
Wydawca:
Uniwersytet Morski w Gdyni. Wydział Nawigacyjny
Tematy:
Positioning, Navigation and Timing (PNT)
Fiber Optic Gyroscopes (FOG)
Microelectromechanical Systems (MEMS)
gyrocompassing
Inertial Measurement Unit (IMU)
inertial systems
Inertial Navigation Systems (INS)
Allan standard deviation
Opis:
The analysis presents the performance of navigation application driven with MEMS and FOG inertial sensors. The inertial sensors were working under conditions simulating a potential robotic mission, which reduce accuracy of some of the navigation applications. Empirical results of the test confirm degradation of the navigation system performance in the presented demanding mission. Influence of the testing conditions and of the inertial sensor technology is presented and discussed in the paper.
Źródło:
TransNav : International Journal on Marine Navigation and Safety of Sea Transportation; 2017, 11, 2; 221-226
2083-6473
2083-6481
Pojawia się w:
TransNav : International Journal on Marine Navigation and Safety of Sea Transportation
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
MEMS accelerometer simulations in Matlab/SIMULINK and COMSOL Multiphysics
Autorzy:
Nazdrowicz, J.
Powiązania:
https://bibliotekanauki.pl/articles/397778.pdf
Data publikacji:
2017
Wydawca:
Politechnika Łódzka. Wydział Mikroelektroniki i Informatyki
Tematy:
microelectromechanical systems
simulation model
microaccelerometer
MATLAB
SIMULINK
MEMS modeling
SimScape toolbox
mikroukład elektromechaniczny
model symulacyjny
mikroakcelerometr
modelowanie MEMS
SimScape
Opis:
In this paper modelling and simulation of MEMS accelerometers in Matlab/SIMULINK environment are presented. Results of simulations of three different approaches: mathematical, electrical equivalent and physical models are compared with FEM accelerometer model created in COMSOL software. Results of simulations are analyzed for displacement response for two of the most popular spring geometries - folded and straight. Author takes into consideration crucial aspects of damping coefficients influence on accelerometer performance.
Źródło:
International Journal of Microelectronics and Computer Science; 2017, 8, 4; 161-167
2080-8755
2353-9607
Pojawia się w:
International Journal of Microelectronics and Computer Science
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Modeling of vibrating angular. Motion sensor in Matlab/SIMULINK
Autorzy:
Nazdrowicz, Jacek
Powiązania:
https://bibliotekanauki.pl/articles/397700.pdf
Data publikacji:
2018
Wydawca:
Politechnika Łódzka. Wydział Mikroelektroniki i Informatyki
Tematy:
microelectromechanical systems
simulation model
microaccelerometer
MATLAB
SIMULINK
MEMS modeling
Simscape toolbox
mikroukład elektromechaniczny
model symulacyjny
mikroakcelerometr
modelowanie MEMS
SimScape
Opis:
This paper presents different models and results of simulations of MEMS vibrating gyroscope in Matlab/SIMULINK environment. Each model is created with different approach, using different blocks and different physics. Therefore author presents his proposal of mathematical, electrical equivalent and physical models. Results obtained from these models can give some hints regarding design and dimensions of some crucial parts of MEMS gyroscope. Here, decoupled vibrating sensor is considered, which minimize drive and sense motion mutual influence.
Źródło:
International Journal of Microelectronics and Computer Science; 2018, 9, 1; 27-32
2080-8755
2353-9607
Pojawia się w:
International Journal of Microelectronics and Computer Science
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Modeling and simulations of MEMS gyroscope with MATLAB/SIMULINK package
Autorzy:
Nazdrowicz, J.
Powiązania:
https://bibliotekanauki.pl/articles/397914.pdf
Data publikacji:
2017
Wydawca:
Politechnika Łódzka. Wydział Mikroelektroniki i Informatyki
Tematy:
MEMS
gyroscope
angular velocity sensor
microelectromechanical systems
model simulation
microaccelerometer
MATLAB
SIMULINK
MEMS modeling
equivalent circuit model
żyroskop
czujnik prędkości kątowej
mikroukład elektromechaniczny
model symulacyjny
akcelerometr
modelowanie MEMS
model obwodu zastępczego
Opis:
This paper presents developed mathematical model of MEMS gyroscope created in Matlab/SIMULINK environment. The model can be very useful for calculating MEMS gyroscope geometrical parameters. These parameters play very significant role, because they have huge and direct impact on device response, performance and further possibilities of application. Results of simulations are presented in this article separately for drive and sense direction. In addition there are also results in frequency domain presented. With all these results we obtain quick overview of behavior this kind of MEMS device and response characteristics.
Źródło:
International Journal of Microelectronics and Computer Science; 2017, 8, 1; 21-28
2080-8755
2353-9607
Pojawia się w:
International Journal of Microelectronics and Computer Science
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-6 z 6

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