Informacja

Drogi użytkowniku, aplikacja do prawidłowego działania wymaga obsługi JavaScript. Proszę włącz obsługę JavaScript w Twojej przeglądarce.

English (EN)·Polski (PL)·Yкраїнський (UK)
Przejdź do strony domowej biblioteki Centralna Biblioteka Wojskowa Link otwiera się w nowym oknie Logo biblioteki Prolib Integro - strona głównaCentralna Biblioteka Wojskowa

Wyszukujesz frazę "MESFET" wg kryterium: Temat

  Lista filtrów
Wyrównaj
    Wyświetlanie 1-2 z 2
    Tytuł:
    A 100 W SiC MESFET Amplifier for L-band T/R Module of APAR
    Autorzy:
    Wojtasiak, W.
    Gryglewski, D.
    Powiązania:
    https://bibliotekanauki.pl/articles/226539.pdf
    Data publikacji:
    2011
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    high power amplifier
    SiC
    MESFET
    T/R module
    APAR
    Opis:
    In the paper, a 100W SiC MESFET amplifier design dedicated for a L-band T/R module of APAR is presented. The output power higher than 100 W has been achieved by combining in a balanced configuration two single stages with Cree's 60 W CRF24060 SiC MESFETs. The amplifier design methodology is based on the small-signal model and DC characteristics of SiC MESFET. The model is extracted using the transistor Sparameters at three operating points for On-state, Off-state and normally biased. The measurements and simulations prove usefulness of the proposed design method. The amplifier was excited with pulsed and cw signals for the case temperature ranging from 60°C to 140°C. As a result of the case temperature changes the output power drop was lower than 0.5 dB at the level of 150 W.
    Źródło:
    International Journal of Electronics and Telecommunications; 2011, 57, 1; 135-140
    2300-1933
    Pojawia się w:
    International Journal of Electronics and Telecommunications
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Optimisation of LT-GaN nucleation layer growth conditions for the improvement of electrical and optical parameters of GaN layers
    Autorzy:
    Wośko, Mateusz
    Powiązania:
    https://bibliotekanauki.pl/articles/174388.pdf
    Data publikacji:
    2019
    Wydawca:
    Politechnika Wrocławska. Oficyna Wydawnicza Politechniki Wrocławskiej
    Tematy:
    GaN
    nucleation
    recrystallization
    metalorganic chemical vapor deposition
    nitrides
    LED
    MSM
    MESFET devices
    Opis:
    In this work we present the influence of low temperature gallium nitride (LT-GaN) nucleation layer deposition and recrystallization conditions on the electrical and optical properties of buffer and active layer of metal–semiconductor field-effect transistor (MESFET) structure. MESFET structures were used to investigate the properties of bulk materials that determine also the performance of many type GaN based devices, like light emitting diodes (LEDs), high electron mobility transistors (HEMTs) and metal–semiconductor–metal (MSM) detectors. The set of n-GaN/u-GaN/sapphire structures using different nucleation LT-GaN layers thickness and different annealing times was deposited using AIXTRON CCS epitaxial system. In contrast to typical procedure, the high resistive GaN buffer layer was not obtained by intentional Fe/Mg doping, but by specific adjustment of GaN nucleation conditions and recrystallization process parameters that introduce carbon atoms in epitaxial layers, that serve as donors. Generally, low pressure (below 200 mbar) in a reactor chamber, during initial stages of nucleation and recrystallization as well as HT-GaN epitaxy, promotes the growth of high resistive material. Obtained results show that annealing/recrystallization time of LT-GaN has a significant impact on the electrical and optical properties of GaN buffer layers. Longer annealing periods tend to promote crystallization of material with higher electron mobility and higher Si dopant incorporation/activation while maintaining high resistivity in u-GaN buffer area. It was shown that the dimensions of the GaN islands, that could be influenced by the duration of an annealing step of LT-GaN growth, have no impact on the HT-GaN buffer layer coalescence process and material resistivity, but influences mainly electrical properties of active n-GaN layer. Author suggests that the key parameters that are determining the buffer resistivity are the pressure and temperature during LT-GaN annealing and buffer layer coalescence. The influence of GaN island diameters, after LT-GaN annealing, on the u-GaN resistivity was not confirmed.
    Źródło:
    Optica Applicata; 2019, 49, 1; 167-176
    0078-5466
    1899-7015
    Pojawia się w:
    Optica Applicata
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-2 z 2

      Ta witryna wykorzystuje pliki cookies do przechowywania informacji na Twoim komputerze. Pliki cookies stosujemy w celu świadczenia usług na najwyższym poziomie, w tym w sposób dostosowany do indywidualnych potrzeb. Korzystanie z witryny bez zmiany ustawień dotyczących cookies oznacza, że będą one zamieszczane w Twoim komputerze. W każdym momencie możesz dokonać zmiany ustawień dotyczących cookies