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    Wyświetlanie 1-3 z 3
    Tytuł:
    Dilatometric Analysis of the Sintering Behavior of Bi2Te3 Thermoelectric Powders
    Autorzy:
    Han, Ju-Yeon
    Byun, Jong Min
    Lee, Young-In
    Choi, Byung Joon
    Kim, Hogyoung
    Oh, Sung-Tag
    Powiązania:
    https://bibliotekanauki.pl/articles/354899.pdf
    Data publikacji:
    2020
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    Bi2Te3
    dilatometric analysis
    sintering behavior
    microstructure
    Opis:
    The sintering behavior of p-type bismuth telluride powder is investigated by means of dilatometric analysis. The alloy powders, prepared by ball milling of melt-spun ribbons, exhibit refined and flake shape. Differential thermal analysis reveals that the endothermic peak at about 280°C corresponds to the melting of bismuth, and peaks existing between 410°C and 510°C are presumably due to the oxidation and crystallization of the powder. The shrinkage behavior of ball-milled powders was strongly dependent of heating rate by the thermal effect exerted on specimens. In the case of 2°C/min, the peak temperature for the densification is measured at 406°C, while the peak temperature at a heating rate of 20°C/min is approximately 443°C. The relative density of specimen pressureless-sintered at 500°C exhibited relatively low value, and thus further study is required in order to increase the density of sintered body.
    Źródło:
    Archives of Metallurgy and Materials; 2020, 65, 3; 1117-1120
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    The Influence of Ag2Te Addition on Thermoelectric Properties of Bismuth Telluride
    Autorzy:
    Drzewowska, Sylwia
    Lan, Tian-Wey
    Onderka, Bogusław
    Powiązania:
    https://bibliotekanauki.pl/articles/2048873.pdf
    Data publikacji:
    2022
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    thermoelectric materials
    Seebeck coefficient
    resistivity
    thermal diffusivity
    Bi2Te3-Ag2Te system
    Opis:
    The resistivity, Seebeck coefficient and thermal diffusivity were determined for BiTe3 + Ag2Te composite mixtures. Subsequent measurements were carried out in the temperature range from 20 to 270°C, and for compositions from pure Bi2Te3 to xAg2Te = 0.65 selected along the pseudo-binary section of Ag-Bi-Te ternary system. It was found that conductivity vs. temperature dependence shows visible jump between 140 and 150°C in samples with highest Ag2Te content, which is due to monoclinic => cubic Ag2Te phase transformation. Measured Seebeck coefficient is negative for all samples indicating they are n-type semiconductors. Evaluated power factor is of the order 1.52·10-3 and it decreases with increasing Ag2Te content (at. %). Recalculated thermal conductivity is of the order of unity in W/(m K), and is decreasing with Ag2Te addition. Finally, evaluated Figure of Merit is 0.43 at 100°C and decreases with temperature rise.
    Źródło:
    Archives of Metallurgy and Materials; 2022, 67, 1; 5-15
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Sn-Pd-Ni Electroplating on Bi2Te3-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding Interface
    Autorzy:
    Kang, Seok Jun
    Bae, Sung Hwa
    Son, Injoon
    Powiązania:
    https://bibliotekanauki.pl/articles/2049169.pdf
    Data publikacji:
    2021
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    tin electroplating
    thermoelectric module
    thermocompression bonding
    Bi2Te3
    direct bonding
    Opis:
    The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi2Te3-based thermoelectric (TE) modules, as Sn-based solder alloys have a low melting temperature (approximately 220°C) and good wettability with Cu electrodes. However, this process may result in uneven solder thickness when the printing pressure is not constant. Therefore, we suggested a novel direct-bonding method between the Bi2Te3-based TE elements and the Cu electrode by electroplating a 100 μm Sn/ 1.3 μm Pd/ 3.5 μm Ni bonding layer onto the Bi2Te3-based TE elements. It was determined that there is a problem with the amount of precipitation and composition depending on the pH change, and that the results may vary depending on the composition of Pd. Thus, double plating layers were formed, Ni/Pd, which were widely commercialized. The Sn/Pd/Ni electroplating was highly reliable, resulting in a bonding strength of 8 MPa between the thermoelectric and Cu electrode components, while the Pd and Ni electroplated layer acted as a diffusion barrier between the Sn layer and the Bi2Te3 TE. This process of electroplating Sn/Pd/Ni onto the Bi2Te3 TE elements presents a novel method for the fabrication of TE modules without using the conventional Sn-alloy-paste screen-printing method.
    Źródło:
    Archives of Metallurgy and Materials; 2021, 66, 4; 963-966
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-3 z 3

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