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    Wyświetlanie 1-7 z 7
    Tytuł:
    Material Analysis and Application for Radio Frequency Electromagnetic Wave Shielding
    Autorzy:
    Yener, S.
    Cerezci, O.
    Powiązania:
    https://bibliotekanauki.pl/articles/1187407.pdf
    Data publikacji:
    2016-04
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    41.20.Gz
    41.20.Jb
    Opis:
    Our environment is full of radio frequency (RF) electromagnetic radiation due to rapid progress of wireless communication technologies, which have many applications, such as base stations of mobile communication networks and wireless internet antennas. In the context of Electromagnetic Compatibility (EMC) discipline, the word shield is used to describe any sort of metal sheet or material capable of reflecting, refracting or absorbing electromagnetic radiation (EMR), which is custom manufactured for the target electronic device casing, in a way to intervene any radiation passing to and from the device. Examining of electromagnetic shielding effectiveness (SE) is an important part of not only ensuring electromagnetic compatibility and of protecting electrical and electronic equipment but also protection of human beings against electromagnetic energy exposure as well. In this study, after a brief introduction and review on electromagnetic shielding, material selection and their applications for an indoor environment protection against electromagnetic radiation are explained. Potential electromagnetic shielding values of fabrics found in the market have been analyzed and compared by considering various criteria and requirements. Experimental results show that around 20 dB shielding effectiveness values can be obtained using test fabrics for a typical indoor environment.
    Źródło:
    Acta Physica Polonica A; 2016, 129, 4; 635-638
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Implementation of Microcontroller-Based Memristive Chaotic Circuit
    Autorzy:
    Yener, S.
    Barbaros, C.
    Mutlu, R.
    Karakulak, E.
    Powiązania:
    https://bibliotekanauki.pl/articles/1031484.pdf
    Data publikacji:
    2017-09
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    84.30.-R
    84.30.BV
    05.45.-A
    Opis:
    In 1971, Leon Chua theoretically postulated that the memristor is the fourth fundamental circuit element, besides the three well-known circuit elements; namely, resistor, capacitor and inductor. For a long time, because of lack of a simple and practical realization, memristor remained just a theoretical element and rarely appeared in the literature. In 2008, a research team from HP laboratories declared that they had found a physical implementation based on thin films, behaving as a memristor. Memristor can offer new opportunities in circuit design due to its nonlinear behavior and memory. Nevertheless, since a cheap and reliable practical implementation of memristor is yet unavailable on the market, the design of such a realization, which mimics memristor behavior, is vital from the point of view of real-world circuit design. In this paper, a new microcontroller-based memristive chaotic circuit is proposed. Presented design has been implemented using an Ardunio Mega board, which solves numerically the dynamics of the memristor-based chaotic system using Runge-Kutta method. It sends the chaotic signals to the outputs of the circuit, using digital-to-analog converters. Chaotic dynamics and the strange attractors are obtained from the circuit using both, the computer simulations and the lab experiments. Considering both simulation and experimental results, it is shown that the proposed circuit mimics well the dynamics of the memristive chaotic system.
    Źródło:
    Acta Physica Polonica A; 2017, 132, 3; 1058-1061
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    An Evaluation of Cu-B₄C Composites Manufactured by Powder Metallurgy
    Autorzy:
    Yener, T.
    Altinsoy, I.
    Yener, S.
    Celebi Efe, G.
    Ozbek, I.
    Bindal, C.
    Powiązania:
    https://bibliotekanauki.pl/articles/1401279.pdf
    Data publikacji:
    2015-04
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    81.05.Ni
    81.20.Ev
    72.80.Tm
    Opis:
    In this study, the influences of B₄C ratios on some mechanical and physical properties such as relative density, microhardness and electrical properties of cold pressed Cu-B₄C composites were investigated. Curve fitting is applied for the estimation of electrical conductivity. Commercial copper powders with 40 μm particle size were reinforced with B₄C, with particle size of 40 μm, at ratios of 1, 2, 3 wt.%, for improving mechanical properties of copper used as electrical conductor. Cu-B₄C composites have been fabricated by powder sintering process at a temperature of 900°C for 2 h. The presence of Cu and B₄C, which are dominant components in the sintered composites, were confirmed by X-ray diffraction analysis technique and SEM-EDS. Scanning electron microscope (SEM-EDS) has shown that B₄C particles are distributed homogenously in the copper matrix. The relative densities of Cu and Cu-B₄C composites, sintered at 900°C, ranged from 95.7 to 91.6%. Microhardness of composites ranged from 84.5 to 94.6 HB. It was observed that cold pressed Cu-1 wt.% B₄C composites revealed promising physical properties. Results of electrical conductivity measurement of Cu-B₄C composite material are compared to the results of the model and the overall accuracy level above 96% is obtained.
    Źródło:
    Acta Physica Polonica A; 2015, 127, 4; 1045-1047
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Production and characterization of niobium toughened Ti-TiAl₃ metallic-intermetallic composite
    Autorzy:
    Yener, T.
    Zeytin, S.
    Powiązania:
    https://bibliotekanauki.pl/articles/1054969.pdf
    Data publikacji:
    2017-09
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    46.50.+a
    72.80.Tm
    Opis:
    Ti-TiAl₃ in situ composites with 10 wt.% Nb were successfully prepared from Ti, Al, and Nb metallic powders by powder metallurgy processing technique of electric current activated/assisted sintering. The current and process time used for producing metallic-intermetallic composites were 2000 A and 90 s, respectively. In terms of fracture toughness, effects of addition of ductile niobium phase to Ti-TiAl₃ composites were investigated. According to SEM-EDS and XRD results, the synthesized composites mainly consisted of TiAl₃ matrix and dispersive Nb reinforcing phases, as well as ductile Ti phases. Hardness and fracture toughness values of the samples were measured by Vickers hardness tester under loads of 100 g and 10 kg, respectively. Fracture toughness value of TiAl₃ intermetallic composites was increased with Nb ductile phase addititon from 1.69± 0.05 MPa m^{1/2} to 5.23± 0.3 MPa m^{1/2}.
    Źródło:
    Acta Physica Polonica A; 2017, 132, 3; 941-943
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    In Situ Formation of Ti-TiAl₃ Metallic-Intermetallic Composite by Electric Current Activated Sintering Method
    Autorzy:
    Yener, T.
    Okumus, S.
    Zeytin, S.
    Powiązania:
    https://bibliotekanauki.pl/articles/1400568.pdf
    Data publikacji:
    2015-04
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    81.05.Zx
    81.20.Ev
    Opis:
    In this study we have investigated fabrication of in situ metallic- intermetallic Ti-TiAl₃ composites from powder mixture containing 40 wt % Ti-Al, 50 wt % Ti-Al and 60 wt % Ti-Al by electric current activated sintering method. Powder mixtures without additive were compressed uniaxially under 130 MPa of pressure and sintered 2000 A current for 20 minutes in a steel mould. Microstructures of sintered samples were investigated by optic and scanning electron microscopes, phases in samples were analyzed by XRD and their hardness was measured by Vickers hardness tester. Optic and scanning electron microscopes investigations showed that microstructures of samples were consisting of two components: Main component was titanium aluminide and other was metallic titanium. Besides this there was a trace amount of aluminium oxide in the sintered body. XRD analyses also demonstrated that main phase is TiAl₃. It was determined that as weight percentage of titanium in the mixture was decreasing, also the amount of metallic titanium has decreased in the sintered body. Additionally, average hardness values of samples were about 500 HV
    Źródło:
    Acta Physica Polonica A; 2015, 127, 4; 917-920
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Determination of the Young Modulus of Ti-TiAl₃ Metallic Intermetallic Laminate Composites by Nano-Indentation
    Autorzy:
    Yener, T.
    Güler, S.
    Siddique, S.
    Walther, F.
    Zeytin, S.
    Powiązania:
    https://bibliotekanauki.pl/articles/1398728.pdf
    Data publikacji:
    2016-04
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    72.80.Tm
    61.82.Bg
    68.55.Nq
    Opis:
    Nano-indentation is an important technique to determine the Young modulus of multiphase materials where normal tensile tests are not appropriate. In this work, Ti-TiAl₃ metallic-intermetallic laminate composites have been fabricated successfully in open atmosphere using commercial purity Al and Ti foils with 250 μm and 500 μm initial thicknesses, respectively. Sintering process was performed at 700°C under 2 MPa pressure for 7.5 h. Mechanical properties including the Young modulus were determined after manufacturing. The Young moduli of metallic and intermetallic phases were determined as 89 GPa and 140 GPa, respectively. Microstructure analyses showed that aluminum foil was almost consumed by forming a titanium aluminide intermetallic compound. Titanium aluminides grow up through spherical shaped islands and metallic-intermetallic interface is a wavy form in Ti-Al system. Thus, the final microstructure consists of alternating layers of intermetallic compound and unreacted Ti metal. Microstructure and phase characterizations were performed by scanning electron microscopy, energy dispersive spectroscopy, and X-ray diffraction. Hardness of test samples was determined as 600 HV for intermetallic zone and 130 HV for metallic zone by the Vickers indentation method.
    Źródło:
    Acta Physica Polonica A; 2016, 129, 4; 604-606
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Comparing of Commercial and Cemented Cu-SiC Composites
    Autorzy:
    Celebi Efe, G.
    Altinsoy, I.
    Yener, T.
    Ipek, M.
    Zeytin, S.
    Bindal, C.
    Powiązania:
    https://bibliotekanauki.pl/articles/1287723.pdf
    Data publikacji:
    2014-02
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    81.05.Bx
    81.05.Je
    81.05.Ni
    Opis:
    SiC with 30 μm particle size reinforced copper composites have been fabricated by powder metallurgy method and sintered at 700C for 2 h in open atmosphere. Copper powder was produced by cementation method and obtained as commercial for comparing. Cemented and commercial copper powders were reinforced with SiC having 30 μm particle size at ratios of 0, 1, 2, 3, and 5 wt% for improving mechanical properties of copper without decreasing the electrical conductivity. The presence of Cu and SiC which are dominant components in the sintered composites were confirmed by X-ray diffraction analyses technique. Scanning electron microscope showed that SiC particles are distributed homogeneously in the copper matrix. The relative densities of Cu and Cu-SiC composites sintered at 700C are ranged from 98.0% to 96.2% for commercial Cu-SiC composites, 97.55 to 95.0% for cemented Cu-SiC composites, microhardness of composites ranged from 133 to 277 HV for commercial Cu-SiC composites and 127 to 229 HV for cemented Cu-SiC composites, and the electrical conductivity of composites changed between 95.6%IACS and 77.2%IACS for commercial Cu-SiC composites, 91.7%IACS and 69%IACS for cemented Cu-SiC composites. It was observed that there is a good agreement between cemented Cu-SiC and commercial Cu-SiC composites.
    Źródło:
    Acta Physica Polonica A; 2014, 125, 2; 417-419
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-7 z 7

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