Autor: Son, I. - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: An updated annotated checklist of the molluscs of the Republic of Moldova
Autorzy:: Balashov, I.A.
Son, M.O.
Coada, V.
Welter-Schultes, F.
Powiązania:: https://bibliotekanauki.pl/articles/83930.pdf
Data publikacji:: 2013
Wydawca:: Uniwersytet Mikołaja Kopernika. Wydział Biologii i Ochrony Środowiska. Stowarzyszenie Malakologów Polskich
Źródło:: Folia Malacologica; 2013, 21, 3
1506-7629
Pojawia się w:: Folia Malacologica
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 2.

Tytuł:: Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules
Autorzy:: Kim, S. S.
Son, I.
Kim, K. T.
Powiązania:: https://bibliotekanauki.pl/articles/356583.pdf
Data publikacji:: 2017
Wydawca:: Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:: thermoelectric
Ni–P plating
bonding strength
Bi–Te
soldering
Opis:: In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.
Źródło:: Archives of Metallurgy and Materials; 2017, 62, 2B; 1225-1229
1733-3490
Pojawia się w:: Archives of Metallurgy and Materials
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 3.

Tytuł:: Effect of Fe Content on the Contact Resistance of Electroplated Au-Fe Alloy Layers
Autorzy:: Park, H. S.
Son, I.
Powiązania:: https://bibliotekanauki.pl/articles/352468.pdf
Data publikacji:: 2018
Wydawca:: Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:: electroplating
Au-Fe alloy
contact resistance
thermal aging
Opis:: In this study, variations in the contact resistance of electroplated Au-Fe alloy layers with Fe content were investigated. The contact resistance of electroplated Au-Fe alloy layers that were subject to thermal aging at 260°C in the atmosphere, tended to increase significantly with an increase in the Fe content. Through an analysis method employing X-ray photoelectron spectroscopy (XPS/ESCA) and Auger electron spectroscopy (AES), Ni oxides, such as NiO and Ni₂O₃, on the surface of the thermally aged electroplated Au-Fe alloy layers were observed. It is believed that the Ni oxide existing on the surface diffused from the underlying electroplated Ni layers to the surface through the grain boundaries in the electroplated Au-Fe layers during the thermal aging. As the Fe content in the electroplated Au-Fe layers increased, the grain size decreased. As the grain size decreases, more Ni oxide was detected on the surface. Therefore, with a rise in the Fe content, more Ni diffuses to the surface via grain boundaries, and more Ni oxide is formed on the surface of the electroplated Au-Fe layers, increasing the contact resistance of the electroplated Au-Fe alloy layers.
Źródło:: Archives of Metallurgy and Materials; 2018, 63, 3; 1503-1507
1733-3490
Pojawia się w:: Archives of Metallurgy and Materials
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 4.

Tytuł:: Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process
Autorzy:: Park, S. H.
Kim, D. B.
Lee, R. G.
Son, I. J.
Powiązania:: https://bibliotekanauki.pl/articles/355632.pdf
Data publikacji:: 2017
Wydawca:: Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:: metal matrix composites
thermal conductivity
thermal expansion
interfacial bonding
spark plasma sintering
Opis:: This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm^-1K^-1 and 8 to 5 ppm k^-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.
Źródło:: Archives of Metallurgy and Materials; 2017, 62, 2B; 1303-1306
1733-3490
Pojawia się w:: Archives of Metallurgy and Materials
Dostawca treści:: Biblioteka Nauki

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