Informacja

Drogi użytkowniku, aplikacja do prawidłowego działania wymaga obsługi JavaScript. Proszę włącz obsługę JavaScript w Twojej przeglądarce.

Wyszukujesz frazę "Shilpi" wg kryterium: Autor


Wyświetlanie 1-8 z 8
Tytuł:
Ultra-low Power FinFET SRAM Cell with Improved Stability Suitable for Low Power Applications
Autorzy:
Birla, Shilpi
Powiązania:
https://bibliotekanauki.pl/articles/226772.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
FinFET
RSNM
WSNM
hold margin
subthreshold
leakage power
Opis:
In this paper, a new 11T SRAM cell using FinFET technology has been proposed, the basic component of the cell is the 6T SRAM cell with 4 NMOS access transistors to improve the stability and also makes it a dual port memory cell. The proposed cell uses a header scheme in which one extra PMOS transistor is used which is biased at different voltages to improve the read and write stability thus, helps in reducing the leakage power and active power. The cell shows improvement in RSNM (Read Static Noise Margin) with LP8T by 2.39x at sub-threshold voltage 2.68x with D6T SRAM cell, 5.5x with TG8T. The WSNM (Write Static Noise Margin) and HM (Hold Margin) of the SRAM cell at 0.9V is 306mV and 384mV. At sub-threshold operation also it shows improvement. The Leakage power reduced by 0.125x with LP8T, 0.022x with D6T SRAM cell, TG8T and SE8T. Also, impact of process variation on cell stability is discussed.
Źródło:
International Journal of Electronics and Telecommunications; 2019, 65, 4; 603-609
2300-1933
Pojawia się w:
International Journal of Electronics and Telecommunications
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Light Fidelity (Li-Fi) overview and investigation into connection speed
Autorzy:
Sharma, Mithun
Sharma, Shilpi
Powiązania:
https://bibliotekanauki.pl/articles/1818970.pdf
Data publikacji:
2021
Wydawca:
Politechnika Białostocka. Oficyna Wydawnicza Politechniki Białostockiej
Tematy:
Light Fidelity
Li-Fi
Six-Sigma
defect reduction
wireless communication
redukcja wad
komunikacja bezprzewodowa
Opis:
The overarching aim was to reduce the frequency of connection failures that occur due to the connection speed and reliability, and identify, characterise and optimise the key process input variables (KPIVs). An experimental research approach with an inbuilt planned manipulation to one or more variables in the experimental data set was adopted. Key elements of the Six-Sigma methodology were applied to resolve the issue of high failures due to connection speed and reliability between two Li-Fi transceivers. KPIVs were successfully identified, characterised and optimised to implement a permanent corrective action to ensure a reduction in connection failures from 17% to 0%. The alignment between two Li-Fi transceivers along with Li-Fi cut-out was found to be critical in achieving good connection speed and reliability. The interference due to ambient visible spectrum lighting found to be statistically insignificant. This study explored the application and benefits of accessible wireless data communication technologies. Moreover, it sheds light on the probable factors that may influence Li-Fi connection speed and areas for future research. The current research provides a Six- Sigma based solution to high connection failure rates while using an infrared-based Li-Fi transceiver. Results also offer insights into the analytical tools that were found to be effective during the problem-solving process.
Źródło:
Engineering Management in Production and Services; 2021, 13, 1; 63--73
2543-6597
2543-912X
Pojawia się w:
Engineering Management in Production and Services
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Critical evaluation into the practical utility of the Design of Experiments
Autorzy:
Sharma, Mithun
Sharma, Shilpi
Powiązania:
https://bibliotekanauki.pl/articles/2086449.pdf
Data publikacji:
2021
Wydawca:
Politechnika Białostocka. Oficyna Wydawnicza Politechniki Białostockiej
Tematy:
Six-Sigma
design of experiments
screening
Taguchi screening
full factorial
projektowanie eksperymentów
klasyfikowanie
Taguchi klasyfikacja
silnia
Opis:
The research aims to emphasise the relevance of the Design of Experiments (DOE) technique as a reliable method for ensuring efficient use of statistical methods in routine industrial processes. A case study approach with a deductive strategy was used to assess the effectiveness of different DOE methods to achieve the desired objectives. Screening, mid-resolution and high-resolution DOE methods helped identify, characterise, and optimise an experimental variable against the desired output response. A general framework for effective DOE is provided as part of DOE planning, including defining DOE objectives, selection criteria, noise reduction, and application across industries. Overall, various DOE models proved successful in identifying a complicated relationship between experimental variables and output response. However, when ideal DOE models may not be feasible, reducing test run by choosing lower resolution DOE or fewer replicates can still provide important insights into the experimental variables’ impact on output responses.
Źródło:
Engineering Management in Production and Services; 2021, 13, 3; 50--65
2543-6597
2543-912X
Pojawia się w:
Engineering Management in Production and Services
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Performance Evaluation of a Zone-based Three-level Heterogeneous Clustering Protocol for WSNs
Autorzy:
Rao, Sanapala Shanmukha
Shilpi
Kumar, Arvind
Powiązania:
https://bibliotekanauki.pl/articles/24200745.pdf
Data publikacji:
2023
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
clustering
heterogeneous
network lifetime
stability period
zone-based WSN
Opis:
This paper proposes a zone-based three-level heterogeneous clustering protocol (ZB-TLHCP) for heterogeneous WSNs. In ZB-TLHCP, the sensor field/region is divided into zones where super, advance, and normal nodes are deployed uniformly and randomly. The performance of the proposed ZB-TLHCP system is compared with that of zonal-stable election protocol (Z-SEP), distributed energy efficient clustering (DEEC), and threshold-based DEEC (TDEEC) protocol by varying the number of super and advance nodes, their energy levels for the fixed sensor field, and the total number of nodes. Matlab simulation results revealed that the proposed ZB-TLHCP solution performed better than Z-SEP, DEEC, and TDEEC protocols, as it increased the instability period, prolonged the network's lifetime, and achieved higher throughput values.
Źródło:
Journal of Telecommunications and Information Technology; 2023, 3; 85--93
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Structured Problem Solving: combined approach using 8D and Six Sigma case study
Autorzy:
Sharma, Mithun
Sharma, Shilpi
Sahni, Sanjeev
Powiązania:
https://bibliotekanauki.pl/articles/125526.pdf
Data publikacji:
2020
Wydawca:
Politechnika Białostocka. Oficyna Wydawnicza Politechniki Białostockiej
Tematy:
8D
Six Sigma
Structured Problem Solving
customer complaint
defect reduction
ustrukturyzowane rozwiązywanie problemów
skarga klienta
redukcja wad
Opis:
The current research study aimed to explore the utility of selected problem-solving tools and techniques in root-cause analysis to demonstrate their practical application. An experimental research design adopting a positivist empirical approach with a deductive strategy was followed to assess the effectiveness of a combined (8D & Six Sigma) problem-solving approach in reducing a high defects rate of a mixer shower assembly line. A novel application of the 8D framework in combination with Six Sigma and other analytical tools was found highly effective in reducing the reject rate from 11.84% to 0.11%. Successful identification of the root cause led to the implementation of permanent corrective action ensuring a long-term stable assembly process. The research study provided a problem-solving framework that was found effective in resolving a complex problem and implementing long-term corrective action in an assembly production line. However, this framework can be used in other industries. The research study provides a solution to a high number of leak rejects in a subassembly where “O-seals” are used between mating parts. It also provides analytical tools that were found highly effective during the problem-solving process.
Źródło:
Engineering Management in Production and Services; 2020, 12, 1; 57-69
2543-6597
2543-912X
Pojawia się w:
Engineering Management in Production and Services
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Validating a destructive measurement system using Gauge R&R — a case study
Autorzy:
Sharma, Mithun
Sahni, Sanjeev P.
Sharma, Shilpi
Powiązania:
https://bibliotekanauki.pl/articles/125507.pdf
Data publikacji:
2019
Wydawca:
Politechnika Białostocka. Oficyna Wydawnicza Politechniki Białostockiej
Tematy:
Six Sigma
destructive testing
measurement system analysis
Gauge R&R
crossed Gauge R&R
test niszczący
analiza systemu pomiarowego
Gage R&R
Opis:
The research study aims to evaluate the precision of the measurement system using Gauge R&R. An experimental research design adopting a positivist empirical approach with deductive strategy was followed to assess the effectiveness of Crossed Gauge R&R technique for validating a measurement system using destructive testing. Crossed Gauge R&R technique in Minitab was found to be highly effective in quantifying different components of measurement variation relative to process variation. Clue generation from the Crossed Gauge R&R study combined with manufacturing and measurement process know-how helped in identifying and eliminating the root causes for measurement variation. Overall Crossed Gauge R&R proved successful in validating the burst strength test equipment. However, it should be noted that manufacturing and test equipment played an equally important part in developing and executing the gauge R&R study and accurately analysing the results. So, Crossed Gauge R&R should be used as an aid rather than the solution for measurement system validation.
Źródło:
Engineering Management in Production and Services; 2019, 11, 4; 34-42
2543-6597
2543-912X
Pojawia się w:
Engineering Management in Production and Services
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application
Autorzy:
Sharma, Mithun
Sahni, Sanjeev P.
Sharma, Shilpi
Powiązania:
https://bibliotekanauki.pl/articles/125540.pdf
Data publikacji:
2019
Wydawca:
Politechnika Białostocka. Oficyna Wydawnicza Politechniki Białostockiej
Tematy:
Six Sigma
quality
silicon wafer
lapping
quality control
total thickness variation
wafer manufacturing
jakość
płytka krzemowa
docieranie
kontrola jakości
całkowita zmiana grubości
produkcja płytek
Opis:
Aiming to reduce flatness (Total Thickness Variation, TTV) defects in the lapping process of the silicon wafer manufacturing, it is crucial to understand and eliminate the root cause(s). Financial losses resulting from TTV defects make the lapping process unsustainable. DMAIC (Define, Measure, Analyse, Improve and Control), which is a Six Sigma methodology, was implemented to improve the quality of the silicon wafer manufacturing process. The study design and the choice of procedures were contingent on customer requirements and customised to ensure maximum satisfaction; which is the underlying principle of the rigorous, statistical technique of Six Sigma. Previously unknown causes of high TTV reject rates were identified, and a massive reduction in the TTV reject rate was achieved (from 4.43% to 0.02%). Also, the lapping process capability (Ppk) increased to 3.87 (beyond the required standard of 1.67), suggesting sustainable long-term stability. Control procedures were also effectively implemented using the techniques of poka yoke and control charts. This paper explores the utility of Six Sigma, a quality management technique, to improve the quality of a process used in the semiconductor industry. The application of the Six Sigma methodology in the current project provides an example of the root cause investigation methodology that can be adopted for similar processes or industries. Some of the statistical tools and techniques were used for the first time in this project, thereby providing new analysis and quality improvement platform for the future. The article offers a deeper understanding of the factors that impact on the silicon wafer flatness in the lapping process. It also highlights the benefits of using a structured problem-solving methodology like Six Sigma.
Źródło:
Engineering Management in Production and Services; 2019, 11, 2; 87-105
2543-6597
2543-912X
Pojawia się w:
Engineering Management in Production and Services
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Analysis of the Correlation Between Crimp Parameters and its Effect on Yarn Strength and Hairiness
Autorzy:
Akter, Shilpi
Motalab, Mohammad Abdul
Helali, Maksud
Powiązania:
https://bibliotekanauki.pl/articles/2171963.pdf
Data publikacji:
2022
Wydawca:
Sieć Badawcza Łukasiewicz - Instytut Biopolimerów i Włókien Chemicznych
Tematy:
mechanical gear crimp
correlation
crimp length
crimp angle
yarn strength
yarn hairiness
Opis:
The objective of this paper is to analyse the correlation between crimp parameters and the effect of crimps on yarn strength and hairiness. Crimp is an essential property for natural and man-made fibres. Crimps always form with different parameters as they are very much irregular in size and shape. So, if the crimps are regular in size and shape, the end products like yarn and fabric properties will improve. Jute is a natural fibre with no natural crimp. In this research work, the gear crimping method was used as a mechanical crimping system to impart a regular size and shape of crimps into jute sliver. As a result, crimp parameters like the crimp length and crimp angle become uniform, and it is then easy to measure them. Results also showed that the crimp length is directly proportional and the crimp angle is reversely proportional to the number of crimps per unit length, and they are highly correlated. It was also shown that crimp and crimp parameters also affect the yarn strength and hairiness. In conclusion, it is revealed that with an increase in the number of crimps, the yarn strength was increased and hairiness was decreased.
Źródło:
Fibres & Textiles in Eastern Europe; 2022, 2 (151); 55--60
1230-3666
2300-7354
Pojawia się w:
Fibres & Textiles in Eastern Europe
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-8 z 8

    Ta witryna wykorzystuje pliki cookies do przechowywania informacji na Twoim komputerze. Pliki cookies stosujemy w celu świadczenia usług na najwyższym poziomie, w tym w sposób dostosowany do indywidualnych potrzeb. Korzystanie z witryny bez zmiany ustawień dotyczących cookies oznacza, że będą one zamieszczane w Twoim komputerze. W każdym momencie możesz dokonać zmiany ustawień dotyczących cookies