Autor: Park, B. R. - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: Development of Hydrophobic Surgical Forceps using Powder Injection Molding and Surface Treatment
Autorzy:: Park, D. Y.
Park, B. R.
Gal, C. W.
Lin, D.
Han, J. S.
Jeong, M.-S.
Bollina, R.
Hwang, W.
Park, S. J.
Powiązania:: https://bibliotekanauki.pl/articles/352093.pdf
Data publikacji:: 2018
Wydawca:: Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:: powder injection molding
hydrophobic
debinding
sintering
surface treatment
Opis:: Hydrophobic surgical forceps of end-effectors for laparoscopic operations or minimally invasive surgery were developed through powder injection molding (PIM) and surface treatment. Processing conditions for mixing, debinding, and sintering were investigated to produce defect-free components. An optimum solid loading was determined by torque rheometry experiments. The optimized processing conditions for debinding and sintering were designed through the measurement of weight loss and shrinkage behavior by thermogravimetric analysis and dilatometry experiments. After producing the surgical forceps based on the optimized processing conditions via PIM, surface treatment was carried out to generate the hydrophobic structure on the surface.
Źródło:: Archives of Metallurgy and Materials; 2018, 63, 1; 473-480
1733-3490
Pojawia się w:: Archives of Metallurgy and Materials
Dostawca treści:: Biblioteka Nauki

Artykuł

Skocz do pozycji: 2.

Tytuł:: Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process
Autorzy:: Park, S. H.
Kim, D. B.
Lee, R. G.
Son, I. J.
Powiązania:: https://bibliotekanauki.pl/articles/355632.pdf
Data publikacji:: 2017
Wydawca:: Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:: metal matrix composites
thermal conductivity
thermal expansion
interfacial bonding
spark plasma sintering
Opis:: This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm^-1K^-1 and 8 to 5 ppm k^-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.
Źródło:: Archives of Metallurgy and Materials; 2017, 62, 2B; 1303-1306
1733-3490
Pojawia się w:: Archives of Metallurgy and Materials
Dostawca treści:: Biblioteka Nauki

Artykuł

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