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Wyszukujesz frazę "Lai, Ping" wg kryterium: Autor


Wyświetlanie 1-2 z 2
Tytuł:
Feasibility study of RANS in predicting propeller cavitation in behind-hull conditions
Autorzy:
Zhang, Yuxin
Wu, Xiao-ping
Lai, Ming-yan
Zhou, Guo-ping
Zhang, Jie
Powiązania:
https://bibliotekanauki.pl/articles/1573849.pdf
Data publikacji:
2020
Wydawca:
Politechnika Gdańska. Wydział Inżynierii Mechanicznej i Okrętownictwa
Tematy:
RANS
Computational Fluid Dynamics (CFD)
propeller cavitation
turbulence model
grid sensitivity
Opis:
The propeller cavitation not only affects the propulsive efficiency of a ship but also can cause vibration and noise. Accurate predictions of propeller cavitation are crucial at the design stage. This paper investigates the feasibility of the Reynolds-averaged Navier–Stokes (RANS) method in predicting propeller cavitation in behind-hull conditions, focusing on four aspects: (i) grid sensitivity; (ii) the time step effect; (iii) the turbulence model effect; and (iv) ability to rank two slightly different propellers. The Schnerr-Sauer model is adopted as the cavitation model. A model test is conducted to validate the numerical results. Good agreement on the cavitation pattern is obtained between the model test and computational fluid dynamics. Two propellers are computed, which have similar geometry but slightly different pitch ratios. The results show that RANS is capable of correctly differentiating the cavitation patterns between the two propellers in terms of the occurrence of face cavitation and the extent of sheet cavitation; moreover, time step size is found to slightly affect sheet cavitation and has a significant impact on the survival of the tip vortex cavitation. It is also observed that grid refinement is crucial for capturing tip vortex cavitation and the two-equation turbulence models used – realizable k-ε and shear stress transport (SST) k-ω – yield similar cavitation results.
Źródło:
Polish Maritime Research; 2020, 4; 26-35
1233-2585
Pojawia się w:
Polish Maritime Research
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Stress evolution mechanism and thermo-mechanical reliability analysis of copper-filled TSV interposer
Autorzy:
Chen, Yuan
Su, Wei
Huang, Hong-Zhong
Lai, Ping
Lin, Xiao-ling
Chen, Si
Powiązania:
https://bibliotekanauki.pl/articles/1841909.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Polskie Naukowo-Techniczne Towarzystwo Eksploatacyjne PAN
Tematy:
through silicon vias
thermo-mechanical reliability
failure mechanism
finite element analysis
3D integrated packaging
thermal cycling experiment
Opis:
Through silicon via (TSV) has become one of the key emerging trends of three-dimensional (3D) packages, as it can realize vertically interconnect between stacked-dies. Due to large mismatch in thermal expansion coefficients (CTE) between the copper via and the silicon, significant mechanical stresses are induced at the interfaces when TSV structure is subjected to thermal stresses, which would greatly affect the reliability and electrical performance of TSV 3D device. In this paper, the relationship between the state of stresses and failure of TSV had been explored by combining finite element model simulation (FEM) and failure physical analysis. The position of the maximum stress of the TSV structure was obtained by FEM analysis. The relationship of stress and displacement change with temperature was also studied. And a thermal cycling experiment was conducted to validate the simulation results. Physical failure analysis after thermal cycling experiment was used to verify the degradation mechanism predicted by thermo-mechanical simulation.
Źródło:
Eksploatacja i Niezawodność; 2020, 22, 4; 705-714
1507-2711
Pojawia się w:
Eksploatacja i Niezawodność
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-2 z 2

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