- Tytuł:
- Effect of Pd-P Layer on the Bonding Strength of Bi-Te Thermoelectric Elements
- Autorzy:
-
Bae, Sung Hwa
Han, Se Hun
Son, Injoon
Kim, Kyung Tae - Powiązania:
- https://bibliotekanauki.pl/articles/353621.pdf
- Data publikacji:
- 2019
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
bismuth telluride
thermoelectric module
electroless Pd-P plating
bonding strength - Opis:
- In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoelectric elements without electroless Pd-P plating, and the fracture of the bond originated from these intermetallic compounds. A Pd-Sn solder reaction layer with a thickness of approximately 20 μm was formed under the Pd-P plating layer in the case of the electroless Pd-P plating, and prevented the diffusion of Bi and Te. In addition, the fracture did not occur on the bonding interface but in the thermoelectric elements for the electroless Pd-P plating because the bonding strength of the Pd-Sn reaction layer was higher than the shear strength of the thermoelectric elements.
- Źródło:
-
Archives of Metallurgy and Materials; 2019, 64, 3; 963-968
1733-3490 - Pojawia się w:
- Archives of Metallurgy and Materials
- Dostawca treści:
- Biblioteka Nauki
Artykuł