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    Wyświetlanie 1-8 z 8
    Tytuł:
    Laboratoryjny zestaw spektrometru mas wyładowania jarzeniowego
    Laboratory model of glow discharge mass spectrometer
    Autorzy:
    Kaczorek, K.
    Konarski, P.
    Marks, J.
    Powiązania:
    https://bibliotekanauki.pl/articles/257677.pdf
    Data publikacji:
    2007
    Wydawca:
    Sieć Badawcza Łukasiewicz - Instytut Technologii Eksploatacji - Państwowy Instytut Badawczy
    Tematy:
    kwadrupolowy spektrometr mas
    wyładowanie jarzeniowe
    spektrometria mas
    GDMS
    układ próżniowy
    układ jonooptyczny
    quadruple mass spectrometer
    glow discharge
    glow discharge mass spectrometry
    vacuum system
    ion-optical system
    Opis:
    W artykule opisano laboratoryjny zestaw spektrometru mas wyładowania jarzeniowego opracowany i wykonany w Przemysłowym Instytucie Elektroniki w Warszawie. Wyładowanie jarzeniowe jest inicjowane prądem stałym w obecności argonu jako gazu wyładowczego i powoduje rozpylanie jonowe analizowanej próbki. Powstałe jony są analizowane za pomocą kwadrupolowego spektrometru mas. Przedstawiono podstawowe parametry urządzenia i przykłady uzyskanych spektrogramów.
    A laboratory model of a glow discharge mass spectrometer with Grimm-type glow discharge ion source and quadruple mass spectrometer has been developed. This spectrometer provides detailed analysis of metals, alloys and isolators at a very attractive price.
    Źródło:
    Problemy Eksploatacji; 2007, 1; 109-116
    1232-9312
    Pojawia się w:
    Problemy Eksploatacji
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Ion Etching Effects Occurring in Secondary Ion Mass Spectrometry Depth profiling of InGaAs/InP and InGaAs/AlAs/InP MBE Grown Heterostructures
    Autorzy:
    Kozhukhov, A. V.
    Konarski, P.
    Herman, M. A.
    Powiązania:
    https://bibliotekanauki.pl/articles/1952035.pdf
    Data publikacji:
    1996-11
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    68.35.Bs
    68.55.Jk
    Opis:
    Depth profiling analysis of In$\text{}_{x}$Ga$\text{}_{1-x}$As heterolayers grown by MBE on Fe doped InP(100) substrates was performed in the SAJW-02 secondary ion mass spectrometry analyser equipped with 4.5 keV O$\text{}_{2}^{+}$ ion source and a specially designed sample manipulator enabling depth profiling in the standard as well as in so-called Zalar rotation operation modes. The fairly high energy of the primary ion beam required for sputtering in secondary ion mass spectrometry measurements causes changes in surface topography, usually of different origin. Depth resolution parameters and roughness formation monitored by scanning electron microscopy were analysed for a set of samples with composition x changing in the range 0.33 to 0.60. The results were compared with the same data for a layer of x=0.53 (best lattice-matched to InP) grown on the top of a three monolayer thick AlAs film deposited previously on the InP substrate. Improvement in the depth profile resolution was revealed for the structure with an AlAs layer indicating sharper interface transition. Moreover, sample rotation applied for this structure improves further the depth profiling resolution. Thus, we showed for the first time that a very thin AlAs layer grown by MBE between the InP substrate and the In$\text{}_{0.53}$Ga$\text{}_{0.47}$As improves considerably the heterointerface properties and that Zalar rotation applied for depth profiling of the investigated material system diminishes further the negative effects of ion etching on depth resolution in secondary ion mass spectrometry analysis.
    Źródło:
    Acta Physica Polonica A; 1996, 90, 5; 869-874
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    The Effect of Phosphorus Incorporation into $SiO_2$/4H-SiC (0001) Interface on Electrophysical Properties of MOS Structure
    Autorzy:
    Król, K.
    Konarski, P.
    Miśnik, M.
    Sochacki, M.
    Szmidt, J.
    Powiązania:
    https://bibliotekanauki.pl/articles/1376053.pdf
    Data publikacji:
    2014-11
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    81.16.Pr
    77.84.Bw
    77.55.Dj
    Opis:
    This paper describes the influence of phosphorus incorporation into $SiO_2$/4H-SiC system. The main scope is an analysis of the slow responding trap states (near interface traps) since the influence of phosphorus technology on fast traps has already been investigated by numerous research groups. Two different phosphorus incorporation methods were incorporated - the diffusion-based process of $POCl_3$ annealing and ion implantation. We have shown that regardless of method used a new distinct near interface trap center can be found located approximately at $E_{V}$ + 3.0 eV. This trap can be related to the incorporated phosphorus amount as shown through secondary ion mass spectroscopy measurements.
    Źródło:
    Acta Physica Polonica A; 2014, 126, 5; 1100-1103
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Applying shallow nitrogen implantation from rf plasma for dual gate oxide technology
    Autorzy:
    Bieniek, T.
    Beck, R. B.
    Jakubowski, A.
    Głuszko, G.
    Konarski, P.
    Ćwil, M.
    Powiązania:
    https://bibliotekanauki.pl/articles/308685.pdf
    Data publikacji:
    2007
    Wydawca:
    Instytut Łączności - Państwowy Instytut Badawczy
    Tematy:
    CMOS
    dual gate oxide
    gate stack
    oxynitride
    plasma implantation
    Opis:
    The goal of this work was to study nitrogen implantation from plasma with the aim of applying it in dual gate oxide technology and to examine the influence of the rf power of plasma and that of oxidation type. The obtained structures were examined by means of ellipsometry, SIMS and electrical characterization methods.
    Źródło:
    Journal of Telecommunications and Information Technology; 2007, 3; 3-8
    1509-4553
    1899-8852
    Pojawia się w:
    Journal of Telecommunications and Information Technology
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Depth Profile Analysis of Phosphorus Implanted SiC Structures
    Autorzy:
    Konarski, P.
    Król, K.
    Miśnik, M.
    Sochacki, M.
    Szmidt, J.
    Turek, M.
    Żuk, J.
    Powiązania:
    https://bibliotekanauki.pl/articles/1402214.pdf
    Data publikacji:
    2015-11
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    68.49.Sf
    68.55.Ln
    82.80.Ms
    85.40.Ry
    Opis:
    Secondary ion mass spectrometry depth profile analyses were performed on two sets of 4H-SiC(0001) substrate samples implanted with phosphorus. Both sets were processed under the same conditions. We implanted the samples with 100 keV (10¹¹-10¹⁴ cm¯²) phosphorus ions through the thin chemical vapor deposition deposited silicon dioxide stopping mask in order to obtain an ultra-shallow implantation profile. After phosphorus implantation, secondary ion mass spectrometry depth profile analysis was performed on the first set of samples and the second set was subjected to thermal oxidation procedure at 1200°C in order to create a dielectric layer. The aim of the oxidation process was formation of the silicon dioxide layer enriched with phosphorus: the element, which is considered to be suitable for trap density reduction. Ion implantation parameters as well as oxidation and chemical etching procedures were examined for the proper incorporation of phosphorus into the subsurface structure of the silicon oxide. Secondary ion mass spectrometry depth profile analysis was performed with Physical Electronics 06-350E sputter ion gun and QMA-410 Balzers quadrupole mass analyser. The analytical parameters such as: 1.7 keV Ar⁺ ion beam digitally scanned over 3×3 mm² area and ion erosion rate of 1.4 nm/min and sampling rate of 0.3 nm, were suitable for samples oxidized after ion implantation.
    Źródło:
    Acta Physica Polonica A; 2015, 128, 5; 864-866
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Composition and electrical properties of ultra-thin SiOxNy layers formed by rf plasma nitrogen implantation/plasma oxidation processes
    Autorzy:
    Bieniek, T.
    Beck, R. B.
    Jakubowski, A.
    Konarski, P.
    Ćwil, M.
    Hoffman, P.
    Schmeißer, D.
    Powiązania:
    https://bibliotekanauki.pl/articles/308689.pdf
    Data publikacji:
    2007
    Wydawca:
    Instytut Łączności - Państwowy Instytut Badawczy
    Tematy:
    CMOS
    gate stack
    oxynitride
    plasma implantation
    Opis:
    Experiments presented in this work are a summary of the study that examines the possibility of fabrication of oxynitride layers for Si structures by nitrogen implantation from rf plasma only or nitrogen implantation from rf plasma followed immediately by plasma oxidation process. The obtained layers were characterized by means of: ellipsometry, XPS and ULE-SIMS. The results of electrical characterization of NMOS Al-gate test structures fabricated with the investigated layers used as gate dielectric, are also discussed.
    Źródło:
    Journal of Telecommunications and Information Technology; 2007, 3; 9-15
    1509-4553
    1899-8852
    Pojawia się w:
    Journal of Telecommunications and Information Technology
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Comparison of composition of ultra-thin silicon oxynitride layers fabricated by PECVD and ultrashallow rf plasma ion implantation
    Autorzy:
    Mroczyński, R.
    Bieniek, T.
    Beck, R. B.
    Ćwil, M.
    Konarski, P.
    Hoffman, P.
    Schmeißer, D.
    Powiązania:
    https://bibliotekanauki.pl/articles/308687.pdf
    Data publikacji:
    2007
    Wydawca:
    Instytut Łączności - Państwowy Instytut Badawczy
    Tematy:
    ultra-thin dielectrics
    oxynitride
    SIMS
    XPS
    PECVD
    Opis:
    In this paper differences in chemical composition of ultra-thin silicon oxynitride layers fabricated in planar rf plasma reactor are studied. The ultra-thin dielectric layers were obtained in the same reactor by two different methods: ultrashallow nitrogen implantation followed by plasma oxidation and plasma enhanced chemical vapour deposition (PECVD). Chemical composition of silicon oxynitride layers was investigated by means of X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). The spectroscopic ellipsometry was used to determine both the thickness and refractive index of the obtained layers. The XPS measurements show considerable differences between the composition of the fabricated layers using each of the above mentioned methods. The SIMS analysis confirms XPS results and indicates differences in nitrogen distribution.
    Źródło:
    Journal of Telecommunications and Information Technology; 2007, 3; 20-24
    1509-4553
    1899-8852
    Pojawia się w:
    Journal of Telecommunications and Information Technology
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    The influence of annealing (900?C) of ultra-thin PECVD silicon oxynitride layers
    Autorzy:
    Mroczyński, R.
    Głuszko, G.
    Beck, R. B.
    Jakubowski, A.
    Ćwil, M.
    Konarski, P.
    Hoffman, P.
    Schmeißer, D.
    Powiązania:
    https://bibliotekanauki.pl/articles/308691.pdf
    Data publikacji:
    2007
    Wydawca:
    Instytut Łączności - Państwowy Instytut Badawczy
    Tematy:
    ultra-thin dielectrics
    silicon oxynitride
    PECVD
    CMOS
    Opis:
    This work reports on changes in the properties of ultra-thin PECVD silicon oxynitride layers after high- temperature treatment. Possible changes in the structure, composition and electrophysical properties were investigated by means of spectroscopic ellipsometry, XPS, SIMS and electrical characterization methods (C-V, I-V and charge- pumping). The XPS measurements show that SiOxNy is the dominant phase in the ultra-thin layer and high-temperature annealing results in further increase of the oxynitride phase up to 70% of the whole layer. Despite comparable thickness, SIMS measurement indicates a densification of the annealed layer, because sputtering time is increased. It suggests complex changes of physical and chemical properties of the investigated layers taking place during high-temperature annealing. The C-V curves of annealed layers exhibit less frequency dispersion, their leakage and charge-pumping currents are lower when compared to those of as-deposited layers, proving improvement in the gate structure trapping properties due to the annealing process.
    Źródło:
    Journal of Telecommunications and Information Technology; 2007, 3; 16-19
    1509-4553
    1899-8852
    Pojawia się w:
    Journal of Telecommunications and Information Technology
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-8 z 8

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