- Tytuł:
- Reliability Examinations of SAC Lead Free Solder Material
- Autorzy:
-
Koncz-Horváth, D.
Gergely, G.
Gyökér, Z.
Gácsi, Z. - Powiązania:
- https://bibliotekanauki.pl/articles/354957.pdf
- Data publikacji:
- 2019
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
SAC
thermal shock test
intermetallic layer
crack - Opis:
- In this paper the effect of soldering technique and thermal shock test were investigated on SAC 305 solder joints, produced by two different solder method. The solder joints were subjected to different cycle numbers up to 5000 thermal shock tests with two different thermal profiles of –30/+110°C and –40/+125°C. Microstructural properties of the tested joints were examined with the focus on intermetallic layer thickness and crack formation/propagation. Thickness of the scallop shaped Cu6Sn5 intermetallic layer was increased with increasing cycle number for both THRS and multiwave joints, but the thickening was more effective for the THRS joints. Cracks typically formed at the solder alloy/PTH barrel and the solder alloy/pin interfaces and propagated along grain boundaries and precipitations of intermetallic compound.
- Źródło:
-
Archives of Metallurgy and Materials; 2019, 64, 3; 925-930
1733-3490 - Pojawia się w:
- Archives of Metallurgy and Materials
- Dostawca treści:
- Biblioteka Nauki
Artykuł