- Tytuł:
- Scanning acoustic microscopy for non-destructive tests of electronic components
- Autorzy:
-
Sutor, A.
Winkler, G.
Bischoff, G. - Powiązania:
- https://bibliotekanauki.pl/articles/378445.pdf
- Data publikacji:
- 2006
- Wydawca:
- Sieć Badawcza Łukasiewicz - Instytut Technologii Elektronowej
- Tematy:
-
scanning acoustic microscopy
printed circuit boards
thick film
thin layers
microelectronic packages - Opis:
- Scanning acoustic microscopy (SAM) is an attractive tool in the non-destructive inspection of printed circuit boards, thick film, thin layers and microelectronic packages. For example it permits to detect subsurface delaminations, cracks and pores (air bubbles) for different materials: metals, plastics, ceramics or composites. The examples of different electronic components and circuits observed in SONOSCAN D-9000 ultrasonic microscope with frequencies of transducers between 10 Mhz and MHz and 230 MHz are presented in this paper.
- Źródło:
-
Electron Technology : Internet Journal; 2005-2006, 37/38, 7; 1-4
1897-2381 - Pojawia się w:
- Electron Technology : Internet Journal
- Dostawca treści:
- Biblioteka Nauki
Artykuł