Scanning acoustic microscopy for non-destructive tests of electronic components

Scanning acoustic microscopy (SAM) is an attractive tool in the non-destructive inspection of printed circuit boards, thick film, thin layers and microelectronic packages. For example it permits to detect subsurface delaminations, cracks and pores (air bubbles) for different materials: metals, plastics, ceramics or composites. The examples of different electronic components and circuits observed in SONOSCAN D-9000 ultrasonic microscope with frequencies of transducers between 10 Mhz and MHz and 230 MHz are presented in this paper.