- Tytuł:
- Influence of Ceramic Particles on the Microstructure and Mechanical Properties of SAC305 Lead-Free Soldering Material
- Autorzy:
-
Kumar, Manoj Pal
Gergely, G.
Koncz-Horvath, D.
Gacsi, Z. - Powiązania:
- https://bibliotekanauki.pl/articles/356293.pdf
- Data publikacji:
- 2019
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
composite solder
SiC particles
microstructure
wettability
microhardness - Opis:
- In this study, silicon carbide (SiC) reinforced lead-free solder (SAC305) was prepared by the powder metallurgy method. In this method SAC305 powder and SiC powder were milled, compressed and sintered to prepare composite solder. The composite solders were characterized by optical and scanning electron microscopy for the microstructural investigation and mechanical test. Addition of 1.5 wt.% and 2 wt.% ceramic reinforcement to the composite increased compressive strengths and microhardness up to 38% and 68% compared to those of the monolithic sample. In addition, the ceramic particles caused an up to 55% decrease in the wetting angle between the substrate and the composite solder and porosity was always increased with increase of SiC particles.
- Źródło:
-
Archives of Metallurgy and Materials; 2019, 64, 2; 603-606
1733-3490 - Pojawia się w:
- Archives of Metallurgy and Materials
- Dostawca treści:
- Biblioteka Nauki
Artykuł