- Tytuł:
- Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
- Autorzy:
-
Hwang, J. H.
Lee, J.-H. - Powiązania:
- https://bibliotekanauki.pl/articles/353042.pdf
- Data publikacji:
- 2017
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
Sn-coated Cu
immersion plating
chip bonding
intermetallic compounds (IMC)
transient liquid phase (TLP)
sintering - Opis:
- Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.
- Źródło:
-
Archives of Metallurgy and Materials; 2017, 62, 2B; 1143-1148
1733-3490 - Pojawia się w:
- Archives of Metallurgy and Materials
- Dostawca treści:
- Biblioteka Nauki
Artykuł