- Tytuł:
- Investigation of heat transfer in integrated circuits
- Autorzy:
-
Frankiewicz, M.
Gołda, A.
Kos, A. - Powiązania:
- https://bibliotekanauki.pl/articles/220533.pdf
- Data publikacji:
- 2014
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
temperature
heat transfer
VLSI
electric analogy - Opis:
- The paper analyzes the phenomenon of heat transfer and its inertia in solids. The influence of this effect on the operation of an integrated circuit is described. The phenomenon is explained using thermal analogy implemented in the Spice environment by an R-C thermal model. Results from the model are verified by some measurements with a chip designed in CMOS 0.7 μm (5 V) technology. The microcontroller-based measurement system structure and experiment results are described.
- Źródło:
-
Metrology and Measurement Systems; 2014, 21, 1; 111-120
0860-8229 - Pojawia się w:
- Metrology and Measurement Systems
- Dostawca treści:
- Biblioteka Nauki
Artykuł