Autor: Więcek, Bogusław - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: Thermal modeling of planar and cylindrical biomedical multilayers structures in frequency domain
Autorzy:: Strąkowska, Maria
Więcek, Bogusław
Powiązania:: https://bibliotekanauki.pl/articles/114518.pdf
Data publikacji:: 2019
Wydawca:: Stowarzyszenie Inżynierów i Techników Mechaników Polskich
Tematy:: thermal models
Vector Fitting
perfusion
Pennes model
Foster network
Opis:: Planar and cylindrical thermal models of biomedical multilayer structures with perfusion are presented in this paper. For each layer the models are solved analytically in frequency domain using the Laplace transform. Modeling the multilayer structure allows formulating the set of linear equations with unknown integral constants. As a result, the thermal impedance Z_th(jω) is calculated. Next, the poles of thermal impedance are estimated using Vector Fitting (VF) method. Finally, distribution of thermal time constants allows evaluating the temperature response T(t) of the modeled structure.
Źródło:: Measurement Automation Monitoring; 2019, 65, 2; 32-36
2450-2855
Pojawia się w:: Measurement Automation Monitoring
Dostawca treści:: Biblioteka Nauki

Artykuł

Skocz do pozycji: 2.

Tytuł:: Thermal investigations of PCM enhanced electronics cooling
Autorzy:: Felczak, Mariusz
Więcek, Bogusław
Powiązania:: https://bibliotekanauki.pl/articles/114610.pdf
Data publikacji:: 2019
Wydawca:: Stowarzyszenie Inżynierów i Techników Mechaników Polskich
Tematy:: heat exchange
phase change materials
thermal impedance
cooling of electronic systems
Opis:: The paper presents experimental results of PCM (Phase Change Material) enhanced cooling system. The investigations were focused on obtaining the best results of the cooling system during its start-up. The latent heat of phase change material was used to decrease temperature of the cooled electronic device. Comparison of a standard heat sink available on the market and the same heat sink filled with PCM applications was done. Temperature was monitored and registered during device start-up until its thermal steady state. It was done using contact and IR temperature measurement methods. PCMs usage enabled to absorb heat during electronic device start-up. The paper proves that using PCMs it is possible to delay temperature rise during electronic devices heating.
Źródło:: Measurement Automation Monitoring; 2019, 65, 2; 44-47
2450-2855
Pojawia się w:: Measurement Automation Monitoring
Dostawca treści:: Biblioteka Nauki

Artykuł

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