Temat: MOS - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: Investigation of barrier height distributions over the gate area of Al-SiO2-Si structures
Autorzy:: Piskorski, K.
Przewłocki, H. M.
Powiązania:: https://bibliotekanauki.pl/articles/308661.pdf
Data publikacji:: 2007
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: barrier height
effective contact potential difference
MOS system
Opis:: Distributions of the gate-dielectric EBG(x, y) and semiconductor-dielectric EBS(x, y) barrier height values have been determined using the photoelectric measurement method. Modified Powell-Berglund method was used to measure barrier height values. Modification of this method consisted in using a focused UV light beam of a small diameter d =0.3 mm. It was found that the EBG(x, y) distribution has a characteristic dome-like shape which corresponds with the independently determined shape of the effective contact potential difference fMS(x, y) distribution. On the other hand, the EBS(x, y) distribution is of a random character. It is shown that the EBG(x, y) distribution determines the shape of the fMS(x, y) distribution. The model of the EBG and EBS barrier height distributions over the gate area has been proposed.
Źródło:: Journal of Telecommunications and Information Technology; 2007, 3; 49-54
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 2.

Tytuł:: Ultra-shallow nitrogen plasma implantation for ultra-thin silicon oxynitride (SiOxNy) layer formation
Autorzy:: Bieniek, T.
Beck, R. B.
Jakubowski, A.
Kudła, A.
Powiązania:: https://bibliotekanauki.pl/articles/308830.pdf
Data publikacji:: 2005
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: MOS technology
plasma processing
shallow implantation
radiation damage
Opis:: The radiation damage caused by low energy r.f. plasmas has not been, to our knowledge, studied so far in the case of symmetric planar plasma reactors that are usually used for PECVD processes. The reason is that, unlike nonsymmetrical RIE reactors, such geometry prevents, basically, high-energy ion bombardment of the substrate. In this work, we present the results of experiments in which we have studied the influence of plasma processing on the state of silicon surface. Very low temperature plasma oxidation has been used as a test of silicon surface condition. The obtained layers were then carefully measured by spectroscopic ellipsometry, allowing not only the thickness to be determined accurately, but also the layer composition to be evaluated. Different plasma types, namely N2, NH3 and Ar, were used in the first stage of the experiment, allowing oxidation behaviour caused by the exposure to those plasma types to be compared in terms of relative differences. It has been clearly proved that even though the PECVD system is believed to be relatively safe in terms of radiation damage, in the case of very thin layer processing (e.g., ultra-thin oxynitride layers) the effects of radiation damage may considerably affect the kinetics of the process and the properties of the formed layers.
Źródło:: Journal of Telecommunications and Information Technology; 2005, 1; 70-75
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 3.

Tytuł:: Variability of the local phi MS values over the gate area of MOS devices
Autorzy:: Przewłocki, H. M.
Kudła, A.
Brzezińska, D.
Massoud, H. Z.
Powiązania:: https://bibliotekanauki.pl/articles/308803.pdf
Data publikacji:: 2005
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: MOS structure
photoelectric measurements
electrical parameters
mechanical stress
Opis:: The local value distributions of the effective contact potential difference (ECPD or the phi MS factor) over the gate area of Al-SiO2-Si structures were investigated for the first time. A modification of the photoelectric phi MS measurement method was developed, which allows determination of local values of this parameter in different parts of metaloxide-semiconductor (MOS) structures. It was found that the phi MS distribution was such, that its values were highest far away from the gate edge regions (e.g., in the middle of a square gate), lower in the vicinity of gate edges and still lower in the vicinity of gate corners. These results were confirmed by several independent photoelectric and electrical measurement methods. A model is proposed of this distribution in which the experimentally determined phi MS (x; y) distributions, found previously, are attributed to mechanical stress distributions in MOS structures. Model equations are derived and used to calculate phi MS (x; y) distributions for various structures. Results of these calculations remain in agreement with experimentally obtained distributions. Comparison of various characteristics calculated using the model with the results of photoelectric and electrical measurements of a wide range of Al-SiO2-Si structures support the validity of the model.
Źródło:: Journal of Telecommunications and Information Technology; 2005, 1; 34-44
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 4.

Tytuł:: Comparison of the barrier height measurements by the Powell method with the phi MS measurement results
Autorzy:: Piskorski, K.
Kudła, A.
Rzodkiewicz, W.
Przewłocki, H. M.
Powiązania:: https://bibliotekanauki.pl/articles/308846.pdf
Data publikacji:: 2005
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: barrier height
effective contact potential difference
MOS system
Opis:: In this work, we have compared the barrier height measurements carried out using the Powell method with the photoelectric effective contact potential difference (phi MS) measurement results. The photoelectric measurements were performed on the samples that were previously applied in the investigation of the influence of stress on the duration of annealing in nitrogen. This paper shows that the results of barrier height measurement using the Powell method differ significantly from the phi MS measurement results.
Źródło:: Journal of Telecommunications and Information Technology; 2005, 1; 120-123
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 5.

Tytuł:: Effects of stress annealing on the electrical and the optical properties of MOS devices
Autorzy:: Rzodkiewicz, W.
Kudła, A.
Rawicki, Z.
Przewłocki, H. M.
Powiązania:: https://bibliotekanauki.pl/articles/308838.pdf
Data publikacji:: 2005
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: stress
MOS
Si-SiO2 system
electrical parameters
refractive index
Opis:: In this paper we show the results of a study of the effects of high-temperature stress annealing in nitrogen on the refraction index of SiO2 layers and electrical properties in metal-oxide-semiconductor (MOS) devices. We have experimentally characterized the dependence of the reduced effective contact potential difference (ECPD), the effective oxide charge density (Neff), and the mid-gap interface trap density (Dit) on the annealing conditions. Subsequently, we have correlated such properties with the dependence of the refraction index and oxide stress on the annealing conditions and silicon dioxide thickness. Also, the dependence of mechanical stress in the Si-SiO2 system on the oxidation and annealing conditions has been experimentally determined. We consider the contributions of the thermal-relaxation and nitrogen incorporation processes in determining changes in the SiO2 layer refractive index and the electrical properties with annealing time. This description is consistent with other annealing studies carried out in argon, where only the thermal relaxation process is present.
Źródło:: Journal of Telecommunications and Information Technology; 2005, 1; 115-119
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 6.

Tytuł:: Ultrathin oxynitride films for CMOS technology
Autorzy:: Beck, R.B.
Jakubowski, A.
Powiązania:: https://bibliotekanauki.pl/articles/308025.pdf
Data publikacji:: 2004
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: MOS technology
gate stack
ultrathin oxynitride layers
high temperature processing
plasma processing
Opis:: In this work, a review of possible methods of oxynitride film formation will be given. These are different combinations of methods applying high-temperature oxidation and nitridation, as well as ion implantation and deposition techniques. The layers obtained using these methods differ, among other aspects in: nitrogen content, its profile across the ultrathin layer,... etc., which have considerable impact on device properties, such as leakage current, channel mobility, device stability and its reliability. Unlike high-temperature processes, which (understood as a single process step) usually do not allow the control of the nitrogen content at the silicon-oxynitride layer interface, different types of deposition techniques allow certain freedom in this respect. However, deposition techniques have been believed for many years not to be suitable for such a responsible task as the formation of gate dielectrics in MOS devices. Nowadays, this belief seems unjustified. On the contrary, these methods often allow the formation of the layers not only with a uniquely high content of nitrogen but also a very unusual nitrogen profile, both at exceptionally low temperatures. This advantage is invaluable in the times of tight restrictions imposed on the thermal budget (especially for high performance devices). Certain specific features of these methods also allow unique solutions in certain technologies (leading to simplifications of the manufacturing process and/or higher performance and reliability), such as dual gate technology for system-on-chip (SOC) manufacturing.
Źródło:: Journal of Telecommunications and Information Technology; 2004, 1; 62-69
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 7.

Tytuł:: Semiconductor cleaning technology for next generation material systems
Autorzy:: Ruzyllo, J.
Powiązania:: https://bibliotekanauki.pl/articles/308761.pdf
Data publikacji:: 2007
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: III-V compounds
FinFET
IC manufacturing
MEMS
MOS gate stack
semiconductor cleaning
Opis:: This paper gives a brief overview of the challenges wafer cleaning technology is facing in the light of advanced silicon technology moving in the direction of non-planar device structures and the need for modified cleans for semiconductors other than silicon. In the former case, the key issue is related to cleaning and conditioning of vertical surfaces in next generation CMOS gate structure as well as deep 3D geometries in MEMS devices. In the latter, an accelerated pace at which semiconductors other than silicon are being introduced into the mainstream manufacturing calls for the development of material specific wafer cleaning technologies. Examples of the problems related to each challenge are considered.
Źródło:: Journal of Telecommunications and Information Technology; 2007, 2; 44-48
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 8.

Tytuł:: LPT and SLPT Measurement Methods of Flat-Band Voltage (VFB) in MOS Devices
Autorzy:: Piskorski, K.
Przewłocki, H. M.
Powiązania:: https://bibliotekanauki.pl/articles/308206.pdf
Data publikacji:: 2009
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: flat-band voltage
light pulse technique
MOS system
photoelectric methods
scanned light pulse technique
Opis:: The photoelectric techniques are often used for the measurements of metal oxide semiconductor (MOS) structure parameters. These methods, which consist in illuminating the MOS structure with a semitransparent metal gate by a UV light beam, are often competitive for typical electric measurements. The results obtained by different photoelectric methods are, in many cases, more accurate and reproducible than the results of other measurements. The flat-band voltage VFB is an important parameter of any MOS structure since its value influences the threshold voltage VT , which decides for example about power consumption of MOS transistors. One of the methods to measure the VFB value is the electric method of C(V) characteristic. This method involves certain calculations and requires the knowledge about parameters of the investigated sample. The accuracy of this method is rarely better than š100 mV (for higher doping of the substrates the accuracy is worse). The other method of VFB value determination, outlined in this article, is the photoelectric light pulse technique (LPT) method. This method based on the idea proposed by Yun is currently being optimized and verified experimentally.
Źródło:: Journal of Telecommunications and Information Technology; 2009, 4; 76-82
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 9.

Tytuł:: Energy concepts involved in MOS characterization
Autorzy:: Engström, O.
Gutt, T.
Przewłocki, H. M.
Powiązania:: https://bibliotekanauki.pl/articles/308781.pdf
Data publikacji:: 2007
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: C-V technique
capture cross sections
interface states
Meyer-Neldel rule
MOS
thermally stimulated current
Opis:: Starting from a quantum statistical reasoning, it is demonstrated that entropy properties of silicon/silicon dioxide interface electron traps may have a strong influence on measured distributions of interface states, depending on measurement method used. For methods, where the Fermi-level is used as a probe to define an energy position, the scale is based on free energy. On the other hand, methods based on thermal activation of electrons give the distribution on an enthalpy scale. It is shown that measured interface state distributions are influenced by the distribution of entropy, and that common features of measured energy distributions may be influenced by entropy variations. These results are used to interpret experimental data on the energy distribution of electron capture cross sections with an exponential increase followed by a more or less constant value as the energy distance of the traps from the conduction band edge increases. Such a relation is shown to be consistent with a situation where the emission and capture processes of electrons obey the Meyer-Neldel rule.
Źródło:: Journal of Telecommunications and Information Technology; 2007, 2; 86-91
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 10.

Tytuł:: Advanced compact modeling of the deep submicron technologies
Autorzy:: Grabiński, W.
Bucher, M.
Sallese, J.-M.
Krummenacher, F.
Powiązania:: https://bibliotekanauki.pl/articles/309312.pdf
Data publikacji:: 2000
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: ultra deep submicron (UDSM) technology
compact modeling
EKV MOS transistor model
MOSFET
matching
low power
RF applications
Opis:: The technology of CMOS large-scale integrated circuits (LSI's) achieved remarkable advances over last 25 year and the progress is expected to continue well into the next century. The progress has been driven by the downsizing of the active devices such as MOSFETs. Approaching these dimensions, MOSFET characteristics cannot be accurately predicted using classical modeling methods currently used in the most common MOSFET models such as BSIM, MM9 etc, without introducing large number of empirical parameters. Various physical effects that needed to be considered while modeling UDSM devices: quantization of the inversion layer, mobility degradation, carrier velocity saturation and overshoot, polydepletion effects, bias dependent source/drain resistances and capacitances, vertical and lateral doping profiles, etc. In this paper, we will discuss the progress in the CMOS technology and the anticipated difficulties of the sub-0.25 žm LSI downsizing. Subsequently, basic MOSFET modeling methodologies that are more appropriate for UDSM MOSFETs will be presented as well. The advances in compact MOSFET devices will be illustrated using application examples of the EPFL EKV model
Źródło:: Journal of Telecommunications and Information Technology; 2000, 3-4; 31-42
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 11.

Tytuł:: An accurate prediction of high-frequency circuit behaviour
Autorzy:: Yoshitomi, S.
Kimijima, H.
Kojima, K.
Kokatsu, H.
Powiązania:: https://bibliotekanauki.pl/articles/308807.pdf
Data publikacji:: 2005
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: electro-magnetic simulation
SPICE
circuit test structure
RF CMOS
EKV2.6-MOS model
spiral inductor
CMOS VCO
Opis:: An accurate way to predict the behaviour of an RF analogue circuit is presented. A lot of effort is required to eliminate the inaccuracies that may generate the deviation between simulation and measurement. Efficient use of computer-aided design and incorporation of as many physical effects as possible overcomes this problem. Improvement of transistor modelling is essential, but there are many other unsolved problems affecting the accuracy of RF analogue circuit modelling. In this paper, the way of selection of accurate transistor model and the extraction of parasitic elements from the physical layout, as well as implementation to the circuit simulation will be presented using two CMOS circuit examples: an amplifier and a voltage controlled oscillator (VCO). New simulation technique, electro-magnetic (EM)-co-simulation is introduced.
Źródło:: Journal of Telecommunications and Information Technology; 2005, 1; 47-62
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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