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Wyszukujesz frazę "Immersion" wg kryterium: Temat


Wyświetlanie 1-3 z 3
Tytuł:
The Influence of Plastic Forming Processes on the Dissolution Rate of Biocompatible Mg Alloys
Autorzy:
Boczkal, S.
Karaś, M.
Korczak, P.
Kapinos, D.
Koprowski, P.
Szymański, W.
Wroński, S.
Powiązania:
https://bibliotekanauki.pl/articles/355548.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
MgLiCaZn alloys
biomaterials
structure
properties
immersion test
Opis:
The effect of plastic deformation process on the dissolution rate of biocompatible Mg alloys was investigated. Two biocompatible MgLi1Ca0,2Zn1 and MgLi1Ca1Zn1 alloys were selected for the study. The alloys were deformed on a 100T press at a temperature of 350°C by conventional extrusion and by the equal channel angular extrusion process (ECAE). The grain size analysis showed a high degree of the grain refinement from approximately 110 mm in the initial state to 2.8 mm after the 3rd pass of the ECAE process. Compared to as-cast state, the degree of strengthening has increased after plastic forming. The results of biodegradation tests have shown a significant increase in corrosion rate after both conventional extrusion and ECAE, although after subsequent ECAE passes, this rate was observed to slightly decrease in the MgLi1Ca1Zn1 alloy. Based on the results of macro- and microstructure examinations, the corrosion progress in samples after the extrusion process was described.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 3; 997-1004
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
Autorzy:
Hwang, J. H.
Lee, J.-H.
Powiązania:
https://bibliotekanauki.pl/articles/353042.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Sn-coated Cu
immersion plating
chip bonding
intermetallic compounds (IMC)
transient liquid phase (TLP)
sintering
Opis:
Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1143-1148
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Electrochemical Corrosion of Magnesium Alloy AZ31 with Additive Lithium
Autorzy:
Przondziono, J.
Hadasik, E.
Szala, J.
Powiązania:
https://bibliotekanauki.pl/articles/353288.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
magnesium alloy AZ31 with additive of 4.5% Li
electrochemical corrosion in NaCl
potentiodynamic test
immersion test
SEM
Opis:
The purpose of performed tests was evaluation of resistance to electrochemical corrosion of extruded magnesium alloy AZ31 with additive of 4.5% Li. Corrosion tests were performed in 0.01-2.0 M NaCl solutions. Potentiodynamic tests enabled to register polarisation curves. With application of stereoscopic microscope Nikon SMZ745T and electron scanning microscope Hitachi S-4200, the surface of the alloy was observed after immersion tests performed in 1-6 days. Results of performed tests prove explicitly deterioration of corrosion properties of the alloy with the increase of molar concentration of NaCl solution. It can be seen that corrosion process is intensive and that intensity increases with the increase of solution concentration and extension of exposure time.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 4; 2359-2363
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-3 z 3

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