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Wyświetlanie 1-4 z 4
Tytuł:
Microstructure and Mechanical Properties of AA1050/ AA6061/AA1050 Multi-Layer Sheet Fabricated by Cold Roll Bonding Process
Autorzy:
Lee, S.-H.
Powiązania:
https://bibliotekanauki.pl/articles/353150.pdf
Data publikacji:
2018
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
cold roll bonding process
AA1050/AA6061/AA1050 complex sheet
mechanical properties
electron backscatter diffraction
microstructure
Opis:
A cold roll-bonding process was applied to fabricate an AA1050/AA6061/AA1050 multi-layer sheet. Three Al sheets in which an AA6061 sheet is inserted inside two AA1050 sheets of 2 mm thickness, 40 mm width and 300 mm length were stacked up after surface treatment, and the material was then reduced to a thickness of 1.0 mm by multi-pass cold rolling. The AA1050/AA6061/AA1050 laminate complex sheet fabricated by roll bonding was then hardened by a natural aging (T4) and an artificial aging (T6) treatments. The microstructures of the as-roll bonded and the age-hardened Al complex sheets were revealed by optical microscope and electron back scatter diffraction analysis, and the mechanical properties were investigated by tensile and hardness testing. The strength of the as-roll bonded complex sheet was found to increase by 2.6 times, compared to that value of the starting material. Both AA1050 and AA6061 showed a typical recrystallization structure in which the grains were equiaxed after heat treatment. However, the grain size was smaller in AA6061 than in AA1050.
Źródło:
Archives of Metallurgy and Materials; 2018, 63, 3; 1489-1492
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Fabrication and Evaluation of AA6061/AA5052/AA6061/AA5052 Multi-Layer Complex Sheet by Cold-Roll Bonding Process
Autorzy:
Lee, Seong-Hee
Powiązania:
https://bibliotekanauki.pl/articles/353230.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
aluminum alloy
cold roll-bonding
aging treatment
mechanical properties
microstructure
Opis:
A cold roll bonding process is applied to fabricate an AA6061/AA5052/AA6061/AA5052multi-layer sheet. Two AA6061 and two AA5052 sheets with 2mm thickness are stacked alternately to each other, and reduced to a thickness of 2 mm by multi-pass cold rolling. The roll bonded multi-layer sheet is then hardened by natural aging (T4) and artificial aging (T6) treatments. The as roll-bonded sheet shows a typical deformation structure that the grains are elongated to the rolling direction. However, after T4 and T6 aging treatments, it has a recrystallization structure consisting of the coarse equiaxed grains in both AA5052 and AA6061 sheets. The as rolled material shows a lamella structure in which AA5052 and AA6061 sheets are stacked alternately to each other, having higher hardness in AA5052 than in AA6061. However, T4 and T6 aging treated materials show a different lamella structurein which the hardness of the AA6061 layers is higher than that of the AA5052 layers. The strengths of the T4 and T6 age-treated specimens are found to increase by 1.3 and 1.5 times respectively, compared to that of the starting material.
Źródło:
Archives of Metallurgy and Materials; 2020, 65, 3; 1093-1097
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric Elements
Autorzy:
Kim, Subin
Bae, Sung Hwa
Son, Injoon
Powiązania:
https://bibliotekanauki.pl/articles/2049171.pdf
Data publikacji:
2021
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermoelectric
ENEPIG
bonding strength
BiTe
plating
Opis:
To improve the mechanical performance of BiTe-based thermoelectric modules, this study applies anti-diffusion layers that inhibit the generation of metal intercompounds and an electroless nickel/electrode palladium/mission gold (ENEPIG) plating layers to ensure a stable bonding interface. If a plated layer is formed only on BiTe-based thermoelectric, the diffusion of Cu in electrode substrates produces an intermetallic compound. Therefore, the ENEPIG process was applied on the Cu electrode substrate. The bonding strength highly increased from approximately 10.4 to 16.4 MPa when ENEPIG plating was conducted to the BiTe-based thermoelectric element. When ENEPIG plating was performed to both the BiTe-based thermoelectric element and the Cu electrode substrate, the bonding strength showed the highest value of approximately 17.6 MPa, suggesting that the ENEPIG process is ef-fective in ensuring a highly reliable bonding interface of the BiTe-based thermoelectric module.
Źródło:
Archives of Metallurgy and Materials; 2021, 66, 4; 967-970
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Thermal Conductivity and Microstructure of Copper Coated Graphite Composite by Spark Plasma Sintering Process
Autorzy:
Park, S. H.
Kim, D. B.
Lee, R. G.
Son, I. J.
Powiązania:
https://bibliotekanauki.pl/articles/355632.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
metal matrix composites
thermal conductivity
thermal expansion
interfacial bonding
spark plasma sintering
Opis:
This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm-1K-1 and 8 to 5 ppm k-1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1303-1306
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-4 z 4

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