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Wyświetlanie 1-7 z 7
Tytuł:
Effect of superfinishing methods kinematic features on the machined surface
Autorzy:
Kacalak, W.
Tandecka, K.
Powiązania:
https://bibliotekanauki.pl/articles/99982.pdf
Data publikacji:
2012
Wydawca:
Wrocławska Rada Federacji Stowarzyszeń Naukowo-Technicznych
Tematy:
superfinishing
microfinishing film
surface topography
Opis:
The carried out research of the processes for the treatment of superfinishing with the application of microfinishing films of IMFF type with heaping the grain from the alundum with the nominal size of 15 micrometers for the different cinematic system proved that the topography of surface after smoothening depends on the cinematic features of process. It is demonstrated that the machining with oscillation can be substituted and the similar effects can be obtained as a result of the deviation from the parallelism of the directions of object feed and foil feed. This means the possibility to apply the super finisher attachments with a simpler building.
Źródło:
Journal of Machine Engineering; 2012, 12, 4; 35-48
1895-7595
2391-8071
Pojawia się w:
Journal of Machine Engineering
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Basics of the superfinishing results prognostication by the diamond lapping films
Autorzy:
Kacalak, W.
Tandecka, K.
Powiązania:
https://bibliotekanauki.pl/articles/100181.pdf
Data publikacji:
2012
Wydawca:
Wrocławska Rada Federacji Stowarzyszeń Naukowo-Technicznych
Tematy:
microfinishing film
abrasive grain
superfinishing
diamond
coated abrasives
Opis:
Superfinishing with the use of diamond lapping films differs to a significant extent from other machining methods. This is finishing surface machining, one which is realized by a slow rewinding of a microfinishing film, putting it in an oscillating motion and pressing the tool to the surface being machined. The surface being machined moves with a speed which is substantially greater than that of the tool feed. A characteristic feature of the process is a one-time use of the tool, the result being a need of an optimal selection of the machining parameters. Investigations of the topography of the microfinishing film surface were conducted with the use of new parameters that describe the arrangement and the shape of the vertices of active grains. The following were used for the purpose of assessment: coefficients that had been developed that describe the features of the shape of the tool surface, such as the standardized coefficient of the flatness of vertices wNki, the standardized number of vertices in relation to an area unit LNwi and the dissipation coefficient of the height of the location of vertices wNrwi. For the purpose of the assessment of the smoothening ability of diamond lapping films the smoothening potential coefficient wp was developed, which is defined as the geometric mean of the abovementioned indices.
Źródło:
Journal of Machine Engineering; 2012, 12, 4; 49-62
1895-7595
2391-8071
Pojawia się w:
Journal of Machine Engineering
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Numerical simulation of shear slitting process of grain oriented silicon steel using sph method
Autorzy:
Bohdal, Ł.
Tandecka, K.
Kałduński, P.
Powiązania:
https://bibliotekanauki.pl/articles/387439.pdf
Data publikacji:
2017
Wydawca:
Politechnika Białostocka. Oficyna Wydawnicza Politechniki Białostockiej
Tematy:
shear slitting
smoothed particle hydrodynamics
grain oriented silicon steel
digital image correlation
Opis:
Mechanical cutting allows separating of sheet material at low cost and therefore remains the most popular way to produce laminations for electrical machines and transformers. However, recent investigations revealed the deteriorating effect of cutting on the magnetic properties of the material close to the cut edge. The deformations generate elastic stresses in zones adjacent to the area of plastically deformed and strongly affect the magnetic properties. The knowledge about residual stresses is necessary in designing the process. This paper presents the new apprach of modeling residual stresses induced in shear slitting of grain oriented electrical steel using mesh-free method. The applications of SPH (Smoothed Particle Hydrodynamics) methodology to the simulation and analysis of 3D shear slitting process is presented. In experimental studies, an advanced vision-based technology based on digital image correlation (DIC) for monitoring the cutting process is used.
Źródło:
Acta Mechanica et Automatica; 2017, 11, 4; 333-338
1898-4088
2300-5319
Pojawia się w:
Acta Mechanica et Automatica
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Modelling and Analysis of Displacement of Materials Characterized by Different Properties in the Zone of Microcutting
Autorzy:
Kacalak, W.
Rypina, Ł.
Tandecka, K.
Powiązania:
https://bibliotekanauki.pl/articles/99747.pdf
Data publikacji:
2015
Wydawca:
Wrocławska Rada Federacji Stowarzyszeń Naukowo-Technicznych
Tematy:
ANSYS
modelling
microcutting
grinding
Opis:
This paper presents the results of numerical studies conducted using Ansys system, the impact of model’s parameters on the workpiece displacement formation. In the simulation, one used the model of real grain. The authors analyzed the influence of material’s properties on the formation of lateral flow in the machining zone. Observation was also made for the material’s stagnation zone, which depends on geometrical characteristics of the blade, shape of its surface and characteristics of the workpiece.
Źródło:
Journal of Machine Engineering; 2015, 15, 4; 46-58
1895-7595
2391-8071
Pojawia się w:
Journal of Machine Engineering
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Evaluation of Micromachining Processes Using Data in the Format and Geometric Characteristics of Micro-Chips
Autorzy:
Kacalak, W.
Tandecka, K.
Rypina, Ł.
Powiązania:
https://bibliotekanauki.pl/articles/99434.pdf
Data publikacji:
2015
Wydawca:
Wrocławska Rada Federacji Stowarzyszeń Naukowo-Technicznych
Tematy:
microfinishing
microchip
discontinuity
Opis:
Studies on micro-chips formed in the process of micromachining, including grinding and microfinishing using abrasive films, were conducted. Geometric characteristics of the micro-chips were analyzed and the presence of very long chips compared to their width was observed. One also reported the presence of very high temperatures in the treatment zone despite the applied cooling, which resulted in the formation of spherical chips. The occurrence of two characteristic spherical chip structures was observed followed by evaluation of their chemical composition. Based on the tabular structure of band chips, characteristic micro-discontinuities in the microcutting process were determined.
Źródło:
Journal of Machine Engineering; 2015, 15, 4; 59-68
1895-7595
2391-8071
Pojawia się w:
Journal of Machine Engineering
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
A method and new parameters for assessing the active surface topography of diamond abrasive films
Autorzy:
Kacalak, W.
Tandecka, K.
Mathia, T. G.
Powiązania:
https://bibliotekanauki.pl/articles/99984.pdf
Data publikacji:
2016
Wydawca:
Wrocławska Rada Federacji Stowarzyszeń Naukowo-Technicznych
Tematy:
microfinishing film
diamond
active surface
Opis:
This paper describes the methodology and results of research on the tribological characteristics of the surfaces of diamond abrasive films using a stereometric analysis. Abrasive films are used in various finishing processes of surfaces with very high smoothness and accuracy. A morphological analysis of surface vertexes in the plane that is parallel to the film surface and the perpendicular direction allowed an assessment of the distances between particles by means of a decomposition of the surface into Voronoi cells. When studying the formation of the aggregates of diamond particles and the spaces between them, one may infer about the machining potential of the abrasive film and determine the recommended kinematic conditions of the film that ensures the maximum use of this potential. Owing to the investigations related to the morphology of diamond abrasive films, one can observe relevant characteristic abrasive aggregates that vary in term of size and shape depending on particle sizes. Units with elongated shapes have a superior machining ability in relation to spherical-shaped units. One of significant parameters proposed that describe the technological potential of abrasive films is the edge length to width ratio of diamond units. Different operating modes are discussed. A statistical analysis of the dynamics observed of abrasive interfaces allowed a pertinent description of the abrasive process taking into consideration nominal and apparent as well as abrasively efficient morphologies.
Źródło:
Journal of Machine Engineering; 2016, 16, 4; 95-108
1895-7595
2391-8071
Pojawia się w:
Journal of Machine Engineering
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Prediction of Microfinishing Effects with the Use of Abrasive Films Utilizing Data Characterizing Their Surface Topography
Autorzy:
Kacalak, W.
Tandecka, K.
Mathia, T. G.
Powiązania:
https://bibliotekanauki.pl/articles/100198.pdf
Data publikacji:
2015
Wydawca:
Wrocławska Rada Federacji Stowarzyszeń Naukowo-Technicznych
Tematy:
abrasive grain
microfinishing
forecasting
surface topography
Opis:
The publication describes the methodology and results of the studies on stereometric characteristics of the diamond surface of microfinishing films. This methodology is used in different treatments of precise finishing of very high smoothness and accuracy. One presented the results of analysis of vertices’ size in parallel plane to the film surface and towards perpendicular plane to it. Moreover, one performed an assessment of the distance between the grains using surface decomposition on Voronoi cell surface. In order to determine the film surface necessary to perform a particular microfinishing operation, one developed an index which is dependent on the overall profile of the film in the form of an envelope of the sum of vertices’ projections above a certain level. Studying the formation of diamond aggregates of abrasive grains and the spaces between them, one can conclude about the machining potential of microfinishing film and determine a recommended speed of the film displacement ensuring maximum utilization of this potential.
Źródło:
Journal of Machine Engineering; 2015, 15, 4; 103-112
1895-7595
2391-8071
Pojawia się w:
Journal of Machine Engineering
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-7 z 7

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