- Tytuł:
- Processing of printed circuit boards using a 532 nm green laser
- Autorzy:
-
Ciszewski, Piotr
Sochacki, Mariusz - Powiązania:
- https://bibliotekanauki.pl/articles/1818232.pdf
- Data publikacji:
- 2020
- Wydawca:
- Polska Akademia Nauk. Stowarzyszenie Elektryków Polskich
- Tematy:
-
laser cutting
flexible printed circuits
heat affected zone
HAZ - Opis:
- The paper describes a research on assessing the quality of edges resulting from the interaction of laser pulses with a material of rigid and flexible printed circuits. A modern Nd:YVO4 crystal diode-pumped solid-state laser generating a 532 nm wavelength radiation with a nanosecond pulse time was used for the research. Influence of laser parameters such as beam power and pulse repetition frequency on a heat affected zone and carbonization was investigated. Quality and morphology of laser-cut substrates were analyzed by optical microscopy. High quality laser cutting of printed circuit board substrates was obtained without delamination and surface damage, with a minimal carbonization and heat affected zone. The developed process was implemented on the printed circuit assembly line.
- Źródło:
-
Opto-Electronics Review; 2020, 28, 4; 197--202
1230-3402 - Pojawia się w:
- Opto-Electronics Review
- Dostawca treści:
- Biblioteka Nauki
Artykuł