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Wyszukujesz frazę "miniaturization" wg kryterium: Wszystkie pola


Wyświetlanie 1-9 z 9
Tytuł:
Miniaturization of medium voltage compact switchgear
Miniaturyzacja kompaktowej rozdzielnicy średniego napięcia
Autorzy:
Krajewski, W.
Powiązania:
https://bibliotekanauki.pl/articles/158745.pdf
Data publikacji:
2017
Wydawca:
Sieć Badawcza Łukasiewicz - Instytut Elektrotechniki
Tematy:
metoda elementów skończonych
miniaturyzacja
pole elektryczne
rozdzielnica kompaktowa
wytrzymałość elektryczna
compact switchgear
electric field
electric withstand
finite element method
miniaturization
Opis:
Miniaturyzacja rozdzielnic kompaktowych wiąże się z oszczędnością materiałów, co, poza zmniejszeniem gabarytów, przyczynia się do obniżenia ich ceny rynkowej. To z kolei zwiększa konkurencyjność i atrakcyjność rynkową produktu, przekładając się na wolumen sprzedaży. Jest to zatem korzystne zarówno dla producentów, jak i odbiorców. Niemniej jednak, oszczędność materiałów nie może pogarszać jakości produktu finalnego. W artykule przedstawiono pewne aspekty miniaturyzacji rozdzielnicy kompaktowej 24 kV, produkowanej przez krajową firmę ZPUE S.A. Biuro konstrukcyjne tej spółki zaproponowało usunięcie niektórych elementów wcześniej produkowanego urządzenia. Pozbyto się zbędnych ścianek działowych, jak i niektórych elementów obudowy zewnętrznej, zmniejszając w ten sposób wagę, gabaryty i zużycie materiałów. W niniejszym artykule przeanalizowano dalszą możliwość zmniejszenia wymiarów gabarytowych rozdzielnicy. W tym celu przeprowadzono analizę numeryczną pola elektrycznego wewnątrz wybranych jej przedziałów. Zastosowano w tym celu oprogramowanie Maxwell 3D firmy Ansys, bazujące na metodzie elementów skończonych.
The miniaturisation of compact switchgears leads to savings in materials and enables the appliances’ price to be reduced. It is beneficial for both manufacturers and customers. Nevertheless, the saving in the materials used should not impinge on the product’s quality. Some aspects of the miniaturization of 24 kV compact switchgear, produced by the Polish company ZPUE S.A., are presented in this paper. The R&D Department of the factory has proposed to remove some redundant elements and walls of the external switchgear casing. The possibility of a further reduction in the dimensions of this new switchgear casing is considered in the present paper. To this end the electric field distribution inside the switchgear is analysed. This analysis has been done with the Maxwell 3D (Ansys) software package, which employs the finite element method (FEM).
Źródło:
Prace Instytutu Elektrotechniki; 2017, 276; 15-38
0032-6216
Pojawia się w:
Prace Instytutu Elektrotechniki
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Design and Development of Miniature Dual Antenna GPS-GLONASS Receiver for Uninterrupted and Accurate Navigation
Autorzy:
Sudhir, N. S.
Manvi, S. S.
Powiązania:
https://bibliotekanauki.pl/articles/307676.pdf
Data publikacji:
2014
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
dual-antenna receiver
embedded system
GLONASS
GPS
miniaturization
Opis:
Global Positioning System (GPS), Global Navigation Satellite System (GLONASS), and GPS-GLONASS receivers are commonly used for navigation. However, there are some applications where a single antenna interface to a GPS or GPS-GLONASS receiver will not suffice. For example, an airborne platform such as an Unmanned Aerial Vehicles (UAV) will need multiple antennae during maneuvering. Also, some applications will need redundancy of antenna connectivity to prevent loss of positioning if a link to satellite fails. The scope of this work is to design a dual antenna GPS-GLONASS navigation receiver and implement it in a very small form-factor to serve multiple needs such as: provide redundancy when a link fails, and provide uninterrupted navigation even under maneuvering, also provide improved performance by combining data from both signal paths. Both hardware and software architectures are analyzed before implementation. A set of objectives are identified for the receiver which will serve as the benchmarks against which the receiver will be validated. Both analysis and objectives are highlighted in this paper. The results from the tests conducted on such a dual antenna GPS-GLONASS receiver have given positive results on several counts that promise a wider target audience for such a solution.
Źródło:
Journal of Telecommunications and Information Technology; 2014, 4; 108-115
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
A design framework for rigorous constrained EM-driven optimization of miniaturized antennas with circular polarization
Autorzy:
Bekasiewicz, Adrian
Koziel, Slawomir
Powiązania:
https://bibliotekanauki.pl/articles/220503.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
axial ratio
antenna miniaturization
circular polarization antenna
constrained optimization
EM-driven design
Opis:
Compact radiators with circular polarization are important components of modern mobile communication systems. Their design is a challenging process which requires maintaining simultaneous control over several performance figures but also the structure size. In this work, a novel design framework for multi-stage constrained miniaturization of antennas with circular polarization is presented. The method involves sequential optimization of the radiator in respect of selected performance figures and, eventually, the size. Optimizations are performed with iteratively increased number of design constraints. Numerical efficiency of the method is ensured using a fast local-search algorithm embedded in a trust-region framework. The proposed design framework is demonstrated using a compact planar radiator with circular polarization. The optimized antenna is characterized by a small size of 271 mm2 with 37% and 47% bandwidths in respect of 10 dB return loss and 3 dB axial ratio, respectively. The structure is benchmarked against the state-of-the-art circular polarization antennas. Numerical results are confirmed by measurements of the fabricated antenna prototype.
Źródło:
Metrology and Measurement Systems; 2019, 26, 1; 41-52
0860-8229
Pojawia się w:
Metrology and Measurement Systems
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Measurement of perforated panels at a scaled measurement setup
Autorzy:
Baruch, Katarzyna
Kamisiński, Tadeusz
Majchrzak, Aleksandra
Powiązania:
https://bibliotekanauki.pl/articles/127955.pdf
Data publikacji:
2019
Wydawca:
Politechnika Poznańska. Instytut Mechaniki Stosowanej
Tematy:
scale modelling
law of similarity
dimensional analysis
orifice
miniaturization
modelarstwo redukcyjne
prawo podobieństwa
analiza wymiarowa
otwór
miniaturyzacja
Opis:
In the paper, the authors present an ongoing research on the absorption and measurement uncertainty of perforated panels made at different scales. Knowing the similarity criteria describing the relation between a full-size perforated panel and its scaled equivalent, it is possible to conduct the measurements of the elements of significantly reduced size - with an area not exceeding 0.2 m2. This procedure notably decreases the costs resulting from the production, transportation and storing the measurement samples. At the same time, the obtained values of sound absorption coefficient measured for the samples at 1:8 scale will characterize their full-size equivalents of geometry changed according to the derived similarity criteria. The paper discusses the possibilities of measurement of scaled samples.
Źródło:
Vibrations in Physical Systems; 2019, 30, 1; 1-8
0860-6897
Pojawia się w:
Vibrations in Physical Systems
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Design and characterization of a soft magneto-rheological miniature shock absorber for a controllable variable stiffness sole
Autorzy:
Grivon, D.
Civet, Y.
Pataky, Z.
Perriard, Y.
Powiązania:
https://bibliotekanauki.pl/articles/141356.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
magneto-rheological fluid
miniaturization
soft shock absorber
design and characterization
Opis:
The proposed paper discusses the design and characterization of a soft miniature Magneto-Rheological (MR) shock absorber. In particular, the final application considered for the insertion of the designed devices is a controllable variable stiffness sole for patients with foot neuropathy. Such application imposes particularly challenging constraints in terms of miniaturization (cross-sectional area ≤ 1.5 cm2, height ≤ 25 mm) and high sustainable loads (normal loads up to 60 N and shear stresses at the foot/device interface up to 80 kPa) while ensuring moderate to low level of power consumption. Initial design considerations are done to introduce and justify the chosen novel configuration of soft shock absorber embedding a MR valve as the core control element. Successively, the dimensioning of two different MR valves typologies is discussed. In particular, for each configuration two design scenarios are evaluated and consequently two sets of valves satisfying different specifications are manufactured. The obtained prototypes result in miniature modules (external diam. ≤ 15 mm, overall height ≤ 30 mm) with low power consumption (from a minimum of 63 mW to a max. of 110 mW) and able to sustain a load up to 65 N. Finally, experimental sessions are performed to test the behaviour of the realized shock absorbers and results are presented.
Źródło:
Archives of Electrical Engineering; 2015, 64, 4; 547-558
1427-4221
2300-2506
Pojawia się w:
Archives of Electrical Engineering
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Thin and Rectangular Die Bond Pick-Up Mechanism to Reduce Cracking During the Integrated Circuit Assembly Process
Autorzy:
Rahman, Ahmad R. A.
Nayan, Nazrul Anuar
Powiązania:
https://bibliotekanauki.pl/articles/102963.pdf
Data publikacji:
2020
Wydawca:
Stowarzyszenie Inżynierów i Techników Mechaników Polskich
Tematy:
die attachment
miniaturization
integrated circuit
packaging process
mocowanie matrycy
miniaturyzacja
układ scalony
proces pakowania
Opis:
The demand for small, thin, and lightweight electronic devices is increasing. More advanced design and assembly processes of electronic packaging technology have developed to fulfill this need. The critical processes in semiconductor packaging involved in meeting the ever increasing demands of technology include wafer back grinding, dicing, and die attachment. With low die thickness, the risk of die failure, which can cause functional damage, is high. In the die attachment process, the pin ejector causes an impact during the pick and place process. Those effects can result in a micro indentation or micro crack under the die and would be the weak point throughout the entire process. This study designed and evaluated an ejector system for the die attachment process. The proposed method uses a static pole heated inside the cavity for the platform to die before being ejected. Vacuum stabilizes the die suction. Moreover, heat softens the sawing tape and weakens the die adhesion. For die selection during the die attachment process, the results show that the critical die crack problem for a thin and rectangular die is solved using the proposed method. In summary, the packaging of semiconductors has advanced to accommodate the pick-up technology solution in relation to the challenging material needed for the current miniaturization market trend and demand.
Źródło:
Advances in Science and Technology. Research Journal; 2020, 14, 3; 57-64
2299-8624
Pojawia się w:
Advances in Science and Technology. Research Journal
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Towards miniaturized sensors for determination of exchangeable potassium in soil samples
Autorzy:
Grygolowicz-Pawlak, E.
Plachecka, K.
Wolanin, B.
Malinowska, E.
Powiązania:
https://bibliotekanauki.pl/articles/25360.pdf
Data publikacji:
2006
Wydawca:
Polska Akademia Nauk. Instytut Agrofizyki PAN
Tematy:
soil analysis
measurement
soil
inductively coupled plasma-mass spectroscopy
atomic absorption spectroscopy
miniaturization
potentiometric electrode
standard method
nutrient level
flame emission spectroscopy
Źródło:
International Agrophysics; 2006, 20, 2
0236-8722
Pojawia się w:
International Agrophysics
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
A review on active techniques in microchannel heat sink for miniaturization problem in electronic industry
Autorzy:
Bhandari, Prabhakar
Singh, Jarnail
Kumar, Kaushal
Ranakoti, Lalit
Powiązania:
https://bibliotekanauki.pl/articles/2175199.pdf
Data publikacji:
2022
Wydawca:
Centrum Badań i Innowacji Pro-Akademia
Tematy:
microchannel heat sink
active technique
electrostatic force
flow pulsation
magnetic field
heat transfer enhancement
radiator mikrokanałowy
siła elektrostatyczna
pulsacja przepływu
pole magnetyczne
wymiana ciepła
Opis:
With continuous miniaturization of modern electronic components, the need of better cooling devices also keeps on increasing. The improper thermal management of these devices not only hampers the efficiency but can also cause permanent damage. Among various techniques, microchannel heat sink has shown most favourable performance. To further enhance the performance, two techniques i.e., active and passive are used. In passive technique, no external power source is required like heat sink design alteration and working fluid modification. External power source is necessary for heat transfer augmentation in the microchannel heat sink when using the active approach. Due to compact size of microchannel, active techniques are not used more often. However, the present work highlights the different active technique used in microchannel i.e., Electrostatic forces, flow pulsation, magnetic field, acoustic effects, and vibration active techniques. Above mentioned techniques have been analysed in detail.
Źródło:
Acta Innovations; 2022, 45; 45--54
2300-5599
Pojawia się w:
Acta Innovations
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Barriers in Miniaturization of Electronic Devices and the Ways to Overcome Them - from a Planar to 3D Device Architecture
Autorzy:
Godlewski, M.
Guziewicz, E.
Gierałtowska, S.
Łuka, G.
Krajewski, T.
Wachnicki, Ł.
Kopalko, K.
Powiązania:
https://bibliotekanauki.pl/articles/1807598.pdf
Data publikacji:
2009-12
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
85.35.-p
73.40.Lq
73.40.Qv
81.05.Dz
81.15.-z
Opis:
We witness a new revolution in electronic industry - a new generation of integrated circuits uses as a gate isolator $HfO_{2}$. This high-k oxide was deposited by the atomic layer deposition technique. The atomic layer deposition, due to a high conformality of deposited films and low growth temperature, has a large potential to be widely used not only for the deposition of high-k oxides, but also of materials used in solar cells and semiconductor/organic material hybrid structures. This opens possibilities of construction of novel memory devices with 3D architecture, photovoltaic panels of the third generation and stable in time organic light emitting diodes as discussed in this work.
Źródło:
Acta Physica Polonica A; 2009, 116, S; S-19-S-21
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-9 z 9

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