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    Wyświetlanie 1-11 z 11
    Tytuł:
    Defect Transformations in Ion Bombarded InGaAsP
    Autorzy:
    Ratajczak, R.
    Turos, A.
    Stonert, A.
    Nowicki, L.
    Strupiński, W.
    Powiązania:
    https://bibliotekanauki.pl/articles/1504046.pdf
    Data publikacji:
    2011-07
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    61.43.-j
    61.72.-y
    81.05.-t
    82.80.-d
    85.40.-e
    Opis:
    Damage buildup and defect transformations at temperatures ranging from 15 K to 300 K in ion bombarded InGaAsP epitaxial layers on InP were studied by in situ Rutherford backscattering/channeling measurements using 1.4 MeV $\text{}^4He$ ions. Ion bombardment was performed using 150 keV N ions and 580 keV As ions to fluences ranging from 5 × $10^{12}$ to 6 × $10^{14}$ at./$cm^2$. Damage distributions were determined using the McChasy Monte Carlo simulation code assuming that they consist of randomly displaced lattice atoms and extended defects producing bending of atomic planes. Steep damage buildup up to amorphisation with increasing ion fluence was observed. Defect production rate increases with the ion mass and decreases with the implantation temperature. Parameters of damage buildup were evaluated in the frame of the multi-step damage accumulation model. Following ion bombardment at 15 K defect transformations upon warming up to 300 K have also been studied. Defect migration beginning above 100 K was revealed leading to a broad defect recovery stage with the activation energy of 0.1 eV for randomly displaced atoms and 0.15 eV for bent channels defects.
    Źródło:
    Acta Physica Polonica A; 2011, 120, 1; 136-139
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Stopping Power and Energy Straggling of Channeled He-Ions in GaN
    Autorzy:
    Turos, A.
    Ratajczak, R.
    Pągowska, K.
    Nowicki, L.
    Stonert, A.
    Caban, P.
    Powiązania:
    https://bibliotekanauki.pl/articles/1504098.pdf
    Data publikacji:
    2011-07
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    61.82.Fk
    61.85.+p
    68.55.Ln
    68.35.Dv
    Opis:
    GaN epitaxial layers are usually grown on sapphire substrates. To avoid disastrous effect of the large lattice mismatch a thin polycrystalline nucleation layer is grown at 500°C followed by the deposition of thick GaN template at much higher temperature. Remnants of the nucleation layer were visualized by transmission electron microscopy as defect agglomeration at the GaN/sapphire interface and provide a very useful depth marker for the measurement of channeled ions stopping power. Random and aligned spectra of He ions incident at energies ranging from 1.7 to 3.7 MeV have been measured and evaluated using the Monte Carlo simulation code McChasy. Impact parameter dependent stopping power has been calculated for channeling direction and its parameters have been adjusted according to experimental data. For virgin, i.e. as grown, samples, the ratio of channeled to random stopping power is constant and amounts to 0.7 in the energy range studied. Defects produced by ion implantation largely influence the stopping power. For channeled ions the variety of possible trajectories leads to different energy loss at a given depth, thus resulting in much larger energy straggling than that for the random path. Beam energy distributions at different depths have been calculated using the McChasy code. They are significantly broader than those predicted by the Bohr formula for random direction.
    Źródło:
    Acta Physica Polonica A; 2011, 120, 1; 163-166
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Channeling Study of Co and Mn Implanted and Thermally Annealed Wide Band-Gap Semiconducting Compounds
    Autorzy:
    Ratajczak, R.
    Werner, Z.
    Barlak, M.
    Pochrybniak, C.
    Stonert, A.
    Zhao, Q.
    Powiązania:
    https://bibliotekanauki.pl/articles/1402209.pdf
    Data publikacji:
    2015-11
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    61.43.-j
    61.72.-y
    81.05.-t
    82.80.-d
    85.40.-e
    Opis:
    The defect build-up, structure recovery and lattice location of transition metals in ion bombarded and thermally annealed ZnO and GaN single crystals were studied by channeled Rutherford backscattering spectrometry and channeled particle-induced X-ray emission measurements using 1.57 MeV ⁴He ions. Ion implantation to a fluence of 1.2×10¹⁶ ions/cm² was performed using 120 keV Co and 120 keV Mn ions. Thermal annealing was performed at 800°C in argon flow. Damage distributions were determined using the Monte Carlo McChasy simulation code. The simulations of channeled Rutherford backscattering spectra reveal that the ion implantation leads to formation of two types of defect structures in ZnO and GaN such as point and extended defects, such as dislocations. The concentrations of both types of defects are at a comparable level in both structures and for both implanted ions. Differences between both implantations appear after thermal annealing where the Mn-doped ZnO reveals much better transition metals substitution and recovery effect.
    Źródło:
    Acta Physica Polonica A; 2015, 128, 5; 845-848
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Materials Research on Archaeological Objects Using PIXE and Other Non-Invasive Techniques
    Autorzy:
    Miśta, E.
    Stonert, A.
    Korman, A.
    Milczarek, J.
    Fijał-Kirejczyk, I.
    Kalbarczyk, P.
    Wiśniewska, A.
    Powiązania:
    https://bibliotekanauki.pl/articles/1402188.pdf
    Data publikacji:
    2015-11
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    81.05.Bx
    82.80.Ej
    82.80.Dx
    82.80.Ms
    82.80.Pv
    Opis:
    An interdisciplinary study of metallic objects from selected archaeological sites in Poland was performed. The aim of the project was to obtain information about the chemical composition and structural changes of the objects. Furthermore, the research results provided information about the technological process which was used to manufacture the artifacts. The materials research had a non- and micro-invasive character which is very important in this type of investigation. The main experimental tools were particle-induced X-ray emission supplemented with nuclear reaction thermal neutron (white beam) radiography, scanning electron microscopy with X-ray energy dispersive analysis, and laser ablation inductively coupled plasma mass spectrometry techniques. The results show that the artifacts were made by a secondary smelting process used in local metallurgy manufactures.
    Źródło:
    Acta Physica Polonica A; 2015, 128, 5; 815-817
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    On the Question of Ferromagnetism in Proton and He-Irradiated Carbon
    Autorzy:
    Szczytko, J.
    Juszyński, P.
    Teliga, L.
    Twardowski, A.
    Stonert, A.
    Ratajczak, R.
    Korman, A.
    Powiązania:
    https://bibliotekanauki.pl/articles/1811995.pdf
    Data publikacji:
    2008-11
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    75.20.Ck
    75.50.Dd
    Opis:
    We tried to repeat the observation of the ferromagnetic response in proton and He-irradiated carbon made by the group of Esquinazi et al. We used $He^+$ and $H^+$ beams focused on graphite sample. The amount of charge deposited in the sample was comparable to the amount of charge used by Esquinazi. Magnetic measurements were performed in SQUID magnetometer. The magnetization of the samples before and after irradiation was compared. We did not observe any ferromagnetic enhancement of magnetization of our irradiated samples. Even if experiment was not the same as Esqinazi's one, we can exclude some of the mechanisms of ferromagnetism proposed by Esquinazi.
    Źródło:
    Acta Physica Polonica A; 2008, 114, 5; 1387-1390
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Azotek krzemu stosowany w technologii planarnych fotodiod wykonanych na bazie InP
    Silicon nitride for InP based planar photodiode applications
    Autorzy:
    Zynek, J.
    Hejduk, K.
    Klima, K.
    Możdżonek, M.
    Stonert, A.
    Turos, A.
    Rzodkiewicz, W.
    Powiązania:
    https://bibliotekanauki.pl/articles/192312.pdf
    Data publikacji:
    2008
    Wydawca:
    Sieć Badawcza Łukasiewicz - Instytut Technologii Materiałów Elektronicznych
    Tematy:
    azotek krzemu
    PECVD
    fotodioda planarna
    InP
    silicon nitride
    planar photodiode
    Opis:
    Przeprowadzono badania warstw azotku krzemu osadzonych na płytkach z fosforku indu metodą PECVD (Plasma Enhanced Chemical Yapor Deposition) z wykorzystaniem do wytwarzania plazmy dwóch generatorów pracujących na różnych częstotliwościach. Celem badań było ustalenie warunków wytwarzania warstw azotku krzemu stosowanych w technologii planarnych fotodiod wykonanych na bazie InP, w których obszarem absorpcyjnym są studnie kwantowe z InxGa1-xAs. Warstwy azotku krzemu były osadzane w temperaturach pomiędzy 250°C i 300°C. Podstawą do oceny wytworzonych warstw były wyniki badań: ich składu chemicznego, struktury, współczynnika załamania, poziomu naprężeń, rezystywności, wytrzymałości dielektrycznej, stałej dielektrycznej i efektywnej gęstości powierzchniowej ładunków elektrycznych. Stwierdzono, że warstwy osadzane w temperaturze 250°C mają najlepszą strukturę, dobrze spełniają rolę maski w procesie selektywnej dyfuzji cynku, a właściwości elektryczne umożliwiają wykorzystanie ich do pasywacji powierzchni bocznych złącz p-n, pod warunkiem zastosowania odpowiedniego cyklu wygrzewań po procesie osadzania.
    Silicon nitride films, deposited on InP wafers by the PECVD (Plasma Enhanced Chemical Vapor Deposition) method, have been investigated in terms of their applicability in the technology of InP based planar photodiodes with the InxGa1-xAs quantum well absorption region. In order to compensate the mechanical stress in the films, the plasma was excited by two radio-frequency sources operating at frequencies of 13,56 MHz and 100 kHz. The films were deposited at different temperatures in the range of 250 - 300°C. The chemical composition of all examined films, determined by the RBS (Rutherford Backscattering Spectrometry) method, is very close to that of stoichiometric Si3N4. The films contain a large amount of hydrogen. The hydrogen content, evaluated by the NRA (Nuclear Reactions Analysis) technique, exceeds 30 %. The silicon nitride films deposited at 300°C have grown much faster on InP wafers than on Si wafers placed beside these and the structure of both films is different. As the films deposited on Si are amorphous with smooth surfaces, the films deposited on InP are heterogeneous with rough surfaces. These last ones exhibit lower Si-N bond concentration, lower refractive index, higher extinction coefficient, lower resistivity and lower dielectric breakdown strength than the films deposited on silicon. Deterioration of the film quality is caused probably by the reaction of phosphorus, released from the InP substrate at the beginning of the deposition process, with deposited SiNx:H. Such films should not be used in the fabrication of InP based planar photodiodes. When the deposition temperature decreases, the properties of silicon nitride films improve. Their structure becomes more homogeneous and the Si-N bond concentration increases. The silicon nitride films deposited on InP at 250°C have the same amorphous structure and the same Si-N bond concentration, determined from FTIR (Fourier Transform Infrared Spectroscopy) absorption characteristics, as the films deposited on silicon. They exhibit the highest refractive index, the lowest extinction coefficient, the highest resistivity and the highest dielectric breakdown strength. These films are continuous, they do not crack during thermal processes and they can be applied as masking layers for the selective Zn diffusion used to form the p-n junctions. Unfortunately the films deposited at 250°C have the highest hydrogen content and the highest effective charge density. These films cannot be applied directly to passivate the p-n junction side surfaces. Measurements of hydrogen depth profiles and of FTIR absorption characteristics have revealed that the amount of hydrogen and of Si-N, Si-H and N-H bonds changed during annealing. An analysis of C-V characteristics of Al/Si3N4:H/InP MIS capacitors containing these films has shown, that annealing of the Si3N4:H films reduced the electronic defect state density at the Si3N4:H/InP interface. It is possible to take advantage of the thermal instability of silicon nitrides deposited by the PECVD method and to reduce the trap state density and the effective charge density by proper annealing processes. These investigations have enabled us to achieve reverse current values as low as 4 - 15 pA at the voltage of - 5 V and 200 - 500 pA at the voltage of -50 V for planar InP diodes with the 320 um diameter p-n junction. A high yield of 90 % is obtained. These results make a good base for development of planar photodiodes with InxGa1-xAs quantum wells inserted into the depletion region of the InP p-n junction.
    Źródło:
    Materiały Elektroniczne; 2008, T. 36, nr 4, 4; 95-113
    0209-0058
    Pojawia się w:
    Materiały Elektroniczne
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    The Use of Analytical Methods in Evaluation of Coptic Wall Paintings Conservation - A Case Study
    Autorzy:
    Ali, M.
    Abd El Aal, S.
    Mahgoub, G.
    Sihame, A.
    Turos, A.
    Korman, A.
    Stonert, A.
    Powiązania:
    https://bibliotekanauki.pl/articles/1504111.pdf
    Data publikacji:
    2011-07
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    78.70.En
    07.60.Pb
    Opis:
    Egypt has a lot of ancient monasteries and churches, which were decorated with different kinds of wall paintings. Structure of these wall paintings consists of support, plaster and painting layers. Paintings deterioration is primarily due to physicochemical, natural and human factors. The most detrimental factors are bat patches, old varnish and organic waste of birds. All these lead to the gradual disappearance of paintings. Modern technology of conservation is focused on application of new materials for cleaning of wall paintings. Here we report on the use of enzymes, for cleaning surface of coptic wall paintings. Analytical techniques such as particle induced X-ray emission, Fourier transform infrared and optical microscopy were used to evaluate the enzymatic cleaning processes of coptic wall paintings and to identify the chemical composition of red, yellow and white pigments. Particle induced X-ray emission results indicated that there is no change in the chemical composition of the materials and pigments due to enzymatic cleaning. Fourier transform infrared and optical microscopy results confirmed the stability of organic medium before and after treatment of different kind of patches.
    Źródło:
    Acta Physica Polonica A; 2011, 120, 1; 171-176
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    RBS/Channeling and TEM Study of Damage Buildup in Ion Bombarded GaN
    Autorzy:
    Pągowska, K.
    Ratajczak, R.
    Stonert, A.
    Turos, A.
    Nowicki, L.
    Sathish, N.
    Jóźwik, P.
    Muecklich, A.
    Powiązania:
    https://bibliotekanauki.pl/articles/1504096.pdf
    Data publikacji:
    2011-07
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    61.82.Fk
    61.85.+p
    68.55.Ln
    68.35.Dv
    Opis:
    A systematic study on structural defect buildup in 320 keV Ar-ion bombarded GaN epitaxial layers has been reported, by varying ion fluences ranged from 5 × $10^{12}$ to 1 × $10^{17}$ at./$cm^2$. 1 μm thick GaN epitaxial layers were grown on sapphire substrates using the metal-organic vapor phase epitaxy technique. Rutherford backscattering/channeling with 1.7 $MeV^4He$ beam was applied for analysis. As a complementary method high resolution transmission electron microscopy has been used. The later has revealed the presence of extended defects like dislocations, faulted loops and stacking faults. New version of the Monte Carlo simulation code McChasy has been developed that makes it possible to analyze such defects on the basis of the bent channel model. Damage accumulation curves for two distinct types of defects, i.e. randomly displaced atoms and extended defects (i.e. bent channel) have been determined. They were evaluated in the frame of the multistep damage accumulation model, allowing numerical parameterization of defect transformations occurring upon ion bombardment. Displaced atoms buildup is a three-step process for GaN, whereas extended defect buildup is always a two-step process.
    Źródło:
    Acta Physica Polonica A; 2011, 120, 1; 153-155
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    RBS/Channeling Analysis of Zinc Oxide Films Grown at Low Temperature by Atomic Layer Deposition
    Autorzy:
    Ratajczak, R.
    Stonert, A.
    Guziewicz, E.
    Gierałtowska, S.
    Krajewski, T.
    Luka, G.
    Wachnicki, L.
    Witkowski, B.
    Godlewski, M.
    Powiązania:
    https://bibliotekanauki.pl/articles/1400467.pdf
    Data publikacji:
    2013-05
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    77.55.hf
    81.05.Dz
    81.15.Hi
    68.55.ag
    82.80.Yc
    61.85.+p
    Opis:
    The results of the Rutherford backscattering/channeling study of ZnO layers are presented. ZnO layers were deposited on the silicon single crystals and GaN epitaxial layers at low temperature by atomic layer deposition. Deposition temperature varied between 100 and 300°C. A random spectra analysis was performed to determine layer thickness and composition. In turn, analysis of the aligned spectra allows us to study evolution of ingrown defects. The Rutherford backscattering study supports the results of X-ray photoelectron spectroscopy measurements, performed separately, that the ZnO-ALD layers deposited at low temperature contain a higher oxygen content. Composition measurements, performed as a function of growth temperature, show that oxygen content decreases with the increasing temperature of the atomic layer deposition growth process.
    Źródło:
    Acta Physica Polonica A; 2013, 123, 5; 899-903
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Wpływ zastosowania wysokotemperaturowej warstwy zarodkowej AIN na właściwości GaN osadzanego na podłożach szafirowych
    The effect of implementation of high-temperature AIN nucleation layer on properties of GaN grown on sapphire substrates
    Autorzy:
    Lenkiewicz, D.
    Strupiński, W.
    Zdunek, K.
    Ratajczak, R.
    Stonert, A.
    Borysiuk, J.
    Caban, P.
    Dumiszewska, E.
    Kościewicz, K.
    Wesołowski, M.
    Powiązania:
    https://bibliotekanauki.pl/articles/192297.pdf
    Data publikacji:
    2007
    Wydawca:
    Sieć Badawcza Łukasiewicz - Instytut Technologii Materiałów Elektronicznych
    Opis:
    Warstwy epitaksjalne związków półprzewodnikowych typu AIII-N są szeroko stosowane w przyrządach optoelektronicznych i mikrofalowych między innymi takich jak diody elektroluminescencyjne, detektory UV i tranzystory HEMT. Wskutek niedopasowania sieciowego pomiędzy warstwą a podłożem szafirowym istnieje konieczność stosowania przejściowej niskotemperaturowej warstwy zarodkowej. Typowa temperatura wzrostu warstwy zarodkowej (~550°C) jest znacznie niższa od temperatury wzrostu dalszych warstw aplikacyjnych przyrządu (≥ 1070C). Podczas zwiększania temperatury, w warstwie zarodkowej zachodzi przemiana struktury kubicznej w heksagonalną, której towarzyszy tworzenie się defektów strukturalnych (błędów ułożenia), co prowadzi do pogorszenia się parametrów przyrządu. Niniejsza praca koncentruje się na otrzymaniu warstwy zarodkowej w wyższej temperaturze z pominięciem niekorzystnego etapu zmiany struktury. Zastosowanie takiej warstwy zarodkowej z A1N pozwala na otrzymanie stabilnej struktury heksagonalnej o niskiej gęstości defektów strukturalnych oraz otwiera możliwość natychmiastowego dwuwymiarowego wzrostu warstwy aplikacyjnej GaN. Analizowane warstwy GaN charakteryzują się znacznie mniejszą szerokością połówkową rentgenowskiego widma dyfrakcyjnego dla promieniowania odbitego w kierunku <0002> oraz znacznie wyższą rezystywnością w porównaniu do warstw GaN otrzymanych metodą dwuetapową. W pracy przedstawiono wyniki badań wysokotemperaturowej warstwy zarodkowej oraz wpływu warunków jej wzrostu na strukturę krystaliczną i właściwości elektryczne warstw GaN. Zaprezentowano możliwość uzyskania wysokorezystywnych warstw GaN na podłożach szafirowych. Zaobserwowano znaczący wpływ temperatury wzrostu na właściwości heterostruktur wykorzystujących związki typu GaN.
    The III-N compounds are widely used for manufacturing optoelectronic and microwave devices such as electroluminescent diodes, UV detectors and HEMTs. Application of the lattice-mismatched sapphire substrates requires using low-temperature transition nucleation layers. Typically, the growth temperature of a nucleation layer is 550°C and highly differs from that of the subsequent application layer equal to 1070°C. The temperature increase has a detrimental effect on the structure of the nucleation layer. As a result, more lattice defects, such as interstitials, dislocations and stacking faults are formed in the application layer leading in consequence to deterioration of the device parameters. Present work concentrates on the development of a high-temperature nucleation layer and elimination of the harmful effect of the high temperature. The application of such A1N nucleation layer allows us to obtain a stable hexagonal structure with lower defect density, and it opens up also a possibility for an immediate two-dimensional growth of GaN application layer. The studies of high-temperature nucleation layers properties, their growth conditions and structural and electrical parameters of GaN application layers have been performed. The possibility to obtain the GaN layers with a high-resistivity using sapphire substrates and the AIN nucleation layers has been shown.
    Źródło:
    Materiały Elektroniczne; 2007, T. 35, nr 3-4, 3-4; 5-18
    0209-0058
    Pojawia się w:
    Materiały Elektroniczne
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Capability of Semiconducting NiO Films in Gamma Radiation Dosimetry
    Autorzy:
    Guziewicz, M.
    Jung, W.
    Grochowski, J.
    Borysiewicz, M.
    Golaszewska, K.
    Kruszka, R.
    Baranska, A.
    Piotrowska, A.
    Witkowski, B.
    Domagala, J.
    Gryzinski, M.
    Tyminska, K.
    Stonert, A.
    Powiązania:
    https://bibliotekanauki.pl/articles/1492706.pdf
    Data publikacji:
    2011-12
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    73.61.Jc
    29.40.-n
    87.53.Bn
    Opis:
    Electrical properties of RF magnetron sputtered p-NiO films were characterized after fabrication and after gamma irradiations using $\text{}^{137}Cs$ and $\text{}^{60}Co$ sources. Electrical parameters are obtained from the Hall measurements, impedance spectroscopy and C-V measurement of n-Si/p-NiO junction diodes. The results show that resistivity of the NiO film is gradually increased following after sequential irradiation processes because of the decrease in holes' concentration. Hole concentration of a NiO film decreases from the original value of $4.36 \times 10^{16} cm^{-3}$ to $2.86 \times 10^{16} cm^{-3}$ after $\text{}^{137}Cs γ$ irradiation with doses of 10 Gy. In the case of γ irradiation from $\text{}^{60}Co$ source, hole concentration of the film decreases from $6.3 \times 10^{16}//cm^3$ to $4.1 \times 10^{16}//cm^3$ and to $2.9 \times 10^{16}//cm^3$ after successive expositions with a dose of 20 Gy.
    Źródło:
    Acta Physica Polonica A; 2011, 120, 6A; A-069-A-072
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-11 z 11

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