Wszystkie pola: Sochacki, Piotr. - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Artykuł

Skocz do pozycji: 2.

Tytuł:: Processing of printed circuit boards using a 532 nm green laser
Autorzy:: Ciszewski, Piotr
Sochacki, Mariusz
Powiązania:: https://bibliotekanauki.pl/articles/1818234.pdf
Data publikacji:: 2020
Wydawca:: Polska Akademia Nauk. Stowarzyszenie Elektryków Polskich
Tematy:: laser cutting
flexible printed circuits
heat affected zone
HAZ
Opis:: The paper describes a research on assessing the quality of edges resulting from the interaction of laser pulses with a material of rigid and flexible printed circuits. A modern Nd:YVO4 crystal diode-pumped solid-state laser generating a 532 nm wavelength radiation with a nanosecond pulse time was used for the research. Influence of laser parameters such as beam power and pulse repetition frequency on a heat affected zone and carbonization was investigated. Quality and morphology of laser-cut substrates were analyzed by optical microscopy. High quality laser cutting of printed circuit board substrates was obtained without delamination and surface damage, with a minimal carbonization and heat affected zone. The developed process was implemented on the printed circuit assembly line.
Źródło:: Opto-Electronics Review; 2020, 28, 4; 197--202
1230-3402
Pojawia się w:: Opto-Electronics Review
Dostawca treści:: Biblioteka Nauki

Artykuł

Skocz do pozycji: 3.

Tytuł:: Processing of printed circuit boards using a 532 nm green laser
Autorzy:: Ciszewski, Piotr
Sochacki, Mariusz
Powiązania:: https://bibliotekanauki.pl/articles/1818232.pdf
Data publikacji:: 2020
Wydawca:: Polska Akademia Nauk. Stowarzyszenie Elektryków Polskich
Tematy:: laser cutting
flexible printed circuits
heat affected zone
HAZ
Opis:: The paper describes a research on assessing the quality of edges resulting from the interaction of laser pulses with a material of rigid and flexible printed circuits. A modern Nd:YVO4 crystal diode-pumped solid-state laser generating a 532 nm wavelength radiation with a nanosecond pulse time was used for the research. Influence of laser parameters such as beam power and pulse repetition frequency on a heat affected zone and carbonization was investigated. Quality and morphology of laser-cut substrates were analyzed by optical microscopy. High quality laser cutting of printed circuit board substrates was obtained without delamination and surface damage, with a minimal carbonization and heat affected zone. The developed process was implemented on the printed circuit assembly line.
Źródło:: Opto-Electronics Review; 2020, 28, 4; 197--202
1230-3402
Pojawia się w:: Opto-Electronics Review
Dostawca treści:: Biblioteka Nauki