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Wyszukujesz frazę "Yener, S." wg kryterium: Autor


Wyświetlanie 1-4 z 4
Tytuł:
Production and characterization of niobium toughened Ti-TiAl₃ metallic-intermetallic composite
Autorzy:
Yener, T.
Zeytin, S.
Powiązania:
https://bibliotekanauki.pl/articles/1054969.pdf
Data publikacji:
2017-09
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
46.50.+a
72.80.Tm
Opis:
Ti-TiAl₃ in situ composites with 10 wt.% Nb were successfully prepared from Ti, Al, and Nb metallic powders by powder metallurgy processing technique of electric current activated/assisted sintering. The current and process time used for producing metallic-intermetallic composites were 2000 A and 90 s, respectively. In terms of fracture toughness, effects of addition of ductile niobium phase to Ti-TiAl₃ composites were investigated. According to SEM-EDS and XRD results, the synthesized composites mainly consisted of TiAl₃ matrix and dispersive Nb reinforcing phases, as well as ductile Ti phases. Hardness and fracture toughness values of the samples were measured by Vickers hardness tester under loads of 100 g and 10 kg, respectively. Fracture toughness value of TiAl₃ intermetallic composites was increased with Nb ductile phase addititon from 1.69± 0.05 MPa m^{1/2} to 5.23± 0.3 MPa m^{1/2}.
Źródło:
Acta Physica Polonica A; 2017, 132, 3; 941-943
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
In Situ Formation of Ti-TiAl₃ Metallic-Intermetallic Composite by Electric Current Activated Sintering Method
Autorzy:
Yener, T.
Okumus, S.
Zeytin, S.
Powiązania:
https://bibliotekanauki.pl/articles/1400568.pdf
Data publikacji:
2015-04
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
81.05.Zx
81.20.Ev
Opis:
In this study we have investigated fabrication of in situ metallic- intermetallic Ti-TiAl₃ composites from powder mixture containing 40 wt % Ti-Al, 50 wt % Ti-Al and 60 wt % Ti-Al by electric current activated sintering method. Powder mixtures without additive were compressed uniaxially under 130 MPa of pressure and sintered 2000 A current for 20 minutes in a steel mould. Microstructures of sintered samples were investigated by optic and scanning electron microscopes, phases in samples were analyzed by XRD and their hardness was measured by Vickers hardness tester. Optic and scanning electron microscopes investigations showed that microstructures of samples were consisting of two components: Main component was titanium aluminide and other was metallic titanium. Besides this there was a trace amount of aluminium oxide in the sintered body. XRD analyses also demonstrated that main phase is TiAl₃. It was determined that as weight percentage of titanium in the mixture was decreasing, also the amount of metallic titanium has decreased in the sintered body. Additionally, average hardness values of samples were about 500 HV
Źródło:
Acta Physica Polonica A; 2015, 127, 4; 917-920
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Determination of the Young Modulus of Ti-TiAl₃ Metallic Intermetallic Laminate Composites by Nano-Indentation
Autorzy:
Yener, T.
Güler, S.
Siddique, S.
Walther, F.
Zeytin, S.
Powiązania:
https://bibliotekanauki.pl/articles/1398728.pdf
Data publikacji:
2016-04
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
72.80.Tm
61.82.Bg
68.55.Nq
Opis:
Nano-indentation is an important technique to determine the Young modulus of multiphase materials where normal tensile tests are not appropriate. In this work, Ti-TiAl₃ metallic-intermetallic laminate composites have been fabricated successfully in open atmosphere using commercial purity Al and Ti foils with 250 μm and 500 μm initial thicknesses, respectively. Sintering process was performed at 700°C under 2 MPa pressure for 7.5 h. Mechanical properties including the Young modulus were determined after manufacturing. The Young moduli of metallic and intermetallic phases were determined as 89 GPa and 140 GPa, respectively. Microstructure analyses showed that aluminum foil was almost consumed by forming a titanium aluminide intermetallic compound. Titanium aluminides grow up through spherical shaped islands and metallic-intermetallic interface is a wavy form in Ti-Al system. Thus, the final microstructure consists of alternating layers of intermetallic compound and unreacted Ti metal. Microstructure and phase characterizations were performed by scanning electron microscopy, energy dispersive spectroscopy, and X-ray diffraction. Hardness of test samples was determined as 600 HV for intermetallic zone and 130 HV for metallic zone by the Vickers indentation method.
Źródło:
Acta Physica Polonica A; 2016, 129, 4; 604-606
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Comparing of Commercial and Cemented Cu-SiC Composites
Autorzy:
Celebi Efe, G.
Altinsoy, I.
Yener, T.
Ipek, M.
Zeytin, S.
Bindal, C.
Powiązania:
https://bibliotekanauki.pl/articles/1287723.pdf
Data publikacji:
2014-02
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
81.05.Bx
81.05.Je
81.05.Ni
Opis:
SiC with 30 μm particle size reinforced copper composites have been fabricated by powder metallurgy method and sintered at 700C for 2 h in open atmosphere. Copper powder was produced by cementation method and obtained as commercial for comparing. Cemented and commercial copper powders were reinforced with SiC having 30 μm particle size at ratios of 0, 1, 2, 3, and 5 wt% for improving mechanical properties of copper without decreasing the electrical conductivity. The presence of Cu and SiC which are dominant components in the sintered composites were confirmed by X-ray diffraction analyses technique. Scanning electron microscope showed that SiC particles are distributed homogeneously in the copper matrix. The relative densities of Cu and Cu-SiC composites sintered at 700C are ranged from 98.0% to 96.2% for commercial Cu-SiC composites, 97.55 to 95.0% for cemented Cu-SiC composites, microhardness of composites ranged from 133 to 277 HV for commercial Cu-SiC composites and 127 to 229 HV for cemented Cu-SiC composites, and the electrical conductivity of composites changed between 95.6%IACS and 77.2%IACS for commercial Cu-SiC composites, 91.7%IACS and 69%IACS for cemented Cu-SiC composites. It was observed that there is a good agreement between cemented Cu-SiC and commercial Cu-SiC composites.
Źródło:
Acta Physica Polonica A; 2014, 125, 2; 417-419
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-4 z 4

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