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    Wyświetlanie 1-3 z 3
    Tytuł:
    Pack Siliconizing of Ti6Al4V Alloy
    Autorzy:
    Celebi Efe, G.
    İpek, M.
    Bindal, C.
    Zeytin, S.
    Powiązania:
    https://bibliotekanauki.pl/articles/1031464.pdf
    Data publikacji:
    2017-09
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    81.65.Lp
    81.65.-b
    Opis:
    In this study, it was aimed to produce titanium silicide layer on Ti6Al4V by a simple, cheap and efficient method of pack siliconizing. Siliconizing was performed in a pack containing a mixture composed of SiO₂ powder as siliconizing source, pure Al powder as a reducer for siliconizing, NH₄Cl as an activator and Al₂O₃ powder as filler, at 1000°C for 8, 10 and 12 hours in open atmospheric furnace. Optical microscope and SEM-EDS studies indicate that the morphology of silicide layers has smooth, dense and layered nature. The presence of phases, confirmed by XRD analyses, reveals that the silicide layers formed at 1000°C are composed of TiSi₂, Ti₃Si₅, TiN, TiO₂ and SiO₂ compounds. Silicide layer thickness was increased with increasing process time and ranged from 7.5 to 9.0 μm. Hardness of silicide layers, measured by Vickers indentation, is over 2100 HV.
    Źródło:
    Acta Physica Polonica A; 2017, 132, 3; 760-762
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Effects of SiC Particle Size on Properties of Cu-SiC Metal Matrix Composites
    Autorzy:
    Celebi Efe, G.
    Altinsoy, I.
    Ipek, M.
    Zeytin, S.
    Bindal, C.
    Powiązania:
    https://bibliotekanauki.pl/articles/1491445.pdf
    Data publikacji:
    2012-01
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    81.05.Ni
    81.20.Ev
    Opis:
    This paper was focused on the effects of particle size and distribution on some properties of the SiC particle reinforced Cu composites. Copper powder produced by cementation method was reinforced with SiC particles having 1 and 30 μm particle size and sintered at 700°C. Scanning electron microscopy studies showed that SiC particles were dispersed in copper matrix homogeneously. The presence of Cu and SiC components in composites were verified by X-ray diffraction analysis technique. The relative densities of Cu-SiC composites determined by Archimedes' principle are ranged from 96.2% to 90.9% for SiC with 1 μm particle size, 97.0% to 95.0% for SiC with 30 μm particle size. Measured hardness of sintered compacts varied from 130 to 155 HVN for SiC having 1 μm particle size, 188 to 229 HVN for SiC having 30 μm particle size. Maximum electrical conductivity of test materials was obtained as 80.0% IACS (international annealed copper standard) for SiC with 1 μm particle size and 83.0% IACS for SiC with 30 μm particle size.
    Źródło:
    Acta Physica Polonica A; 2012, 121, 1; 251-253
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Comparing of Commercial and Cemented Cu-SiC Composites
    Autorzy:
    Celebi Efe, G.
    Altinsoy, I.
    Yener, T.
    Ipek, M.
    Zeytin, S.
    Bindal, C.
    Powiązania:
    https://bibliotekanauki.pl/articles/1287723.pdf
    Data publikacji:
    2014-02
    Wydawca:
    Polska Akademia Nauk. Instytut Fizyki PAN
    Tematy:
    81.05.Bx
    81.05.Je
    81.05.Ni
    Opis:
    SiC with 30 μm particle size reinforced copper composites have been fabricated by powder metallurgy method and sintered at 700C for 2 h in open atmosphere. Copper powder was produced by cementation method and obtained as commercial for comparing. Cemented and commercial copper powders were reinforced with SiC having 30 μm particle size at ratios of 0, 1, 2, 3, and 5 wt% for improving mechanical properties of copper without decreasing the electrical conductivity. The presence of Cu and SiC which are dominant components in the sintered composites were confirmed by X-ray diffraction analyses technique. Scanning electron microscope showed that SiC particles are distributed homogeneously in the copper matrix. The relative densities of Cu and Cu-SiC composites sintered at 700C are ranged from 98.0% to 96.2% for commercial Cu-SiC composites, 97.55 to 95.0% for cemented Cu-SiC composites, microhardness of composites ranged from 133 to 277 HV for commercial Cu-SiC composites and 127 to 229 HV for cemented Cu-SiC composites, and the electrical conductivity of composites changed between 95.6%IACS and 77.2%IACS for commercial Cu-SiC composites, 91.7%IACS and 69%IACS for cemented Cu-SiC composites. It was observed that there is a good agreement between cemented Cu-SiC and commercial Cu-SiC composites.
    Źródło:
    Acta Physica Polonica A; 2014, 125, 2; 417-419
    0587-4246
    1898-794X
    Pojawia się w:
    Acta Physica Polonica A
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-3 z 3

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