- Tytuł:
- Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate
- Autorzy:
-
Omaç, F.
Ozyurek, D.
Erer, M. - Powiązania:
- https://bibliotekanauki.pl/articles/1033343.pdf
- Data publikacji:
- 2017-01
- Wydawca:
- Polska Akademia Nauk. Instytut Fizyki PAN
- Tematy:
- 81.05.Bx
- Opis:
- In the present study, wetting behaviors of Sn-9Zn-xAl ternary lead-free solder alloys produced by the addition of Al in various amounts binary Sn-9Zn eutectic lead-free solder alloy (wt%) were investigated. Contact angles of alloys were measured by using of the sessile drop method. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of Al on microstructure were investigated. As a result, the studies show that Al-rich areas were found on microstructure of Sn-9Zn-xAl alloys. The lowest melting temperature for Sn-9Zn-0.5Al and Sn-9Zn-0.7Al alloys was determined as 200.9°C. It was determined that wetting capability of Sn-9Zn-xAl alloys failed because of oxidation.
- Źródło:
-
Acta Physica Polonica A; 2017, 131, 1; 165-167
0587-4246
1898-794X - Pojawia się w:
- Acta Physica Polonica A
- Dostawca treści:
- Biblioteka Nauki
Artykuł