- Tytuł:
- Influence of Hole Chamfer Size on Strength of Blind Riveted Joints
- Autorzy:
-
Lubas, Monika
Witek, Lucjan - Powiązania:
- https://bibliotekanauki.pl/articles/2024032.pdf
- Data publikacji:
- 2021
- Wydawca:
- Stowarzyszenie Inżynierów i Techników Mechaników Polskich
- Tematy:
-
blind rivet
failure phenomenon
shearing test
lap blind joint
chamfer size - Opis:
- This work presents the results of the strength analysis of single lap riveted joints. In experimental investigations, performed in this paper, the blind rivet was considered. Blind riveted joints are very popular and often used in many branches as aerospace or automotive. In scientific publications is a research gap related to the strength analysis and failure mechanisms of the blind riveted joints. There are many geometrical parameters of riveted joints that have influence on strength parameters of the joint. One of them is the size of the chamfer located on the edge of the rivet hole. In this analysis a four different sizes of the hole chamfer were examined. The investigated specimens (sheets and the rivet) were made out of aluminium alloy. The tests of the blind rivet joints were performed with the use of a Zwick-Roell tension machine. As a results of experimental investigations, the ultimate shear load diagrams of joints were obtained. Obtained shear load diagrams showed influence of the hole chamfer size on destructive force of joint. Moreover, for a few joints the static test was interrupted before the damage of rivet. Next, the joints were covered by the epoxy resin. After that, the joints in an advanced stage of rivet deformation were cut and magnified using an optical microscope. Analysis of the rivet axial sections at various stages of deformation is an interesting task from the research point of view. Results obtained in this work contribute to a better understanding of the failure process of blind rivets.
- Źródło:
-
Advances in Science and Technology. Research Journal; 2021, 15, 2; 49-56
2299-8624 - Pojawia się w:
- Advances in Science and Technology. Research Journal
- Dostawca treści:
- Biblioteka Nauki