- Tytuł:
-
A Study On The Metal Carbide Composite Diffusion Bonding For Mechanical Seal
Badanie łączenia dyfuzyjnego kompozytu metal węglik na mechaniczne uszczelnienie - Autorzy:
-
Kim, D.-K.
Shon, I.-J.
Song, J.
Ryu, W.-J.
Shin, H.-Ch.
Kwon, E.-Y.
Shin, H.
Kang, S.-J. - Powiązania:
- https://bibliotekanauki.pl/articles/356399.pdf
- Data publikacji:
- 2015
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
diffusion bonding
nanostructures
mechanical seal
hard metal
mechanical properties
łączenie
nanostruktura
uszczelnienie mechaniczne
twardy metal
właściwości mechaniczne - Opis:
- Mechanical Seal use highly efficient alternative water having a great quantity of an aqueous solution and has an advantage no corrosion brine. Metal Carbide composites have been investigated as potential materials for high temperature structural applications and for application in the processing industry. The existing Mechanical seal material is a highly expensive carbide alloy, and it is difficult to take a price advantage. Therefore the study of replacing body area with inexpensive steel material excluding O-ring and contact area which demands high characteristics is needed. The development of WC-Ni base carbide alloy optimal bonding composition technique was accomplished in this study. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. The bonding statuses of this test specimen were excellent. The hardness of specimen and bonding rate were measured using ultrasound equipment. In this work, Powder of WC (involved VC, Cr), Co and Mo2C mixed by attrition milling for 24hours. Nanostructured WC-27.6wt.%Ni-1.5wt.%Si-0.11wt.%VC-1.1wt.%B4C composite were fabricated at 1190°C by high temperature vacuum furnace. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. Its relative density was about 99.7%. The mechanical properties (hardness and fracture toughness) were 87.2 HRA and 4.2 M·Pam1/2, respectively. The bonding status of this test specimen was excellent and the thickness of bonding layer was 20 ~30§ at 1050 and 1060°C bonding temperature.
- Źródło:
-
Archives of Metallurgy and Materials; 2015, 60, 2B; 1479-1483
1733-3490 - Pojawia się w:
- Archives of Metallurgy and Materials
- Dostawca treści:
- Biblioteka Nauki
Artykuł