Temat: gate - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: Applying shallow nitrogen implantation from rf plasma for dual gate oxide technology
Autorzy:: Bieniek, T.
Beck, R. B.
Jakubowski, A.
Głuszko, G.
Konarski, P.
Ćwil, M.
Powiązania:: https://bibliotekanauki.pl/articles/308685.pdf
Data publikacji:: 2007
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: CMOS
dual gate oxide
gate stack
oxynitride
plasma implantation
Opis:: The goal of this work was to study nitrogen implantation from plasma with the aim of applying it in dual gate oxide technology and to examine the influence of the rf power of plasma and that of oxidation type. The obtained structures were examined by means of ellipsometry, SIMS and electrical characterization methods.
Źródło:: Journal of Telecommunications and Information Technology; 2007, 3; 3-8
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 2.

Tytuł:: Composition and electrical properties of ultra-thin SiOxNy layers formed by rf plasma nitrogen implantation/plasma oxidation processes
Autorzy:: Bieniek, T.
Beck, R. B.
Jakubowski, A.
Konarski, P.
Ćwil, M.
Hoffman, P.
Schmeißer, D.
Powiązania:: https://bibliotekanauki.pl/articles/308689.pdf
Data publikacji:: 2007
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: CMOS
gate stack
oxynitride
plasma implantation
Opis:: Experiments presented in this work are a summary of the study that examines the possibility of fabrication of oxynitride layers for Si structures by nitrogen implantation from rf plasma only or nitrogen implantation from rf plasma followed immediately by plasma oxidation process. The obtained layers were characterized by means of: ellipsometry, XPS and ULE-SIMS. The results of electrical characterization of NMOS Al-gate test structures fabricated with the investigated layers used as gate dielectric, are also discussed.
Źródło:: Journal of Telecommunications and Information Technology; 2007, 3; 9-15
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 3.

Tytuł:: Challenges in ultrathin oxide layers formation
Autorzy:: Beck, R.B.
Jakubowski, A.
Łukasiak, L.
Korwin-Pawłowski, M.
Powiązania:: https://bibliotekanauki.pl/articles/307646.pdf
Data publikacji:: 2001
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: silicon technology
oxidation
PECVD
RTO
gate oxide
ultrathin
layers
Opis:: In near future silicon technology cannot do without ultrathin oxides, as it becomes clear from the "Roadmap'2000". Formation, however, of such layers, creates a lot of technical and technological problems. The aim of this paper is to present the technological methods, that potentially can be used for formation of ultrathin oxide layers for next generations ICs. The methods are briefly described and their pros and cons are discussed.
Źródło:: Journal of Telecommunications and Information Technology; 2001, 1; 27-34
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 4.

Tytuł:: Ultrathin oxynitride films for CMOS technology
Autorzy:: Beck, R.B.
Jakubowski, A.
Powiązania:: https://bibliotekanauki.pl/articles/308025.pdf
Data publikacji:: 2004
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: MOS technology
gate stack
ultrathin oxynitride layers
high temperature processing
plasma processing
Opis:: In this work, a review of possible methods of oxynitride film formation will be given. These are different combinations of methods applying high-temperature oxidation and nitridation, as well as ion implantation and deposition techniques. The layers obtained using these methods differ, among other aspects in: nitrogen content, its profile across the ultrathin layer,... etc., which have considerable impact on device properties, such as leakage current, channel mobility, device stability and its reliability. Unlike high-temperature processes, which (understood as a single process step) usually do not allow the control of the nitrogen content at the silicon-oxynitride layer interface, different types of deposition techniques allow certain freedom in this respect. However, deposition techniques have been believed for many years not to be suitable for such a responsible task as the formation of gate dielectrics in MOS devices. Nowadays, this belief seems unjustified. On the contrary, these methods often allow the formation of the layers not only with a uniquely high content of nitrogen but also a very unusual nitrogen profile, both at exceptionally low temperatures. This advantage is invaluable in the times of tight restrictions imposed on the thermal budget (especially for high performance devices). Certain specific features of these methods also allow unique solutions in certain technologies (leading to simplifications of the manufacturing process and/or higher performance and reliability), such as dual gate technology for system-on-chip (SOC) manufacturing.
Źródło:: Journal of Telecommunications and Information Technology; 2004, 1; 62-69
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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