Autor: Domański, P. D. - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: A versatile tool for extraction of MOSFETs parameters
Autorzy:: Tomaszewski, D.
Kociubiński, A.
Marczewski, J.
Kucharski, K.
Domański, K.
Grabiec, P.
Powiązania:: https://bibliotekanauki.pl/articles/308856.pdf
Data publikacji:: 2005
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: MOSFETs parameters
SPICE
least squares method
Opis:: Extraction of MOSFET parameters is a very important task for the purposes of MOS integrated circuits characterization and design. A versatile tool for the MOSFET parameter extraction has been developed in the Institute of Electron Technology (IET). It is used to monitor the technologies applied for fabrication of several groups of devices, e.g., CMOS ASICs, SOI pixel detectors. At present two SPICE MOSFET models (LEVEL = 1, 2) have been implemented in the extraction tool. The LEVEL = 3 model is currently being implemented. The tool combines different methods of parameter extraction based on local as well as global fitting of models to experimental data.
Źródło:: Journal of Telecommunications and Information Technology; 2005, 1; 129-134
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

Artykuł

Skocz do pozycji: 2.

Tytuł:: Piezoresistive sensors for atomic force microscopy - numerical simulations by means of virtual wafer fab
Autorzy:: Dębski, T.
Barth, W.
Rangelow, I.W.
Domański, K.
Tomaszewski, D.
Grabiec, P.
Jakubowski, A.
Powiązania:: https://bibliotekanauki.pl/articles/307644.pdf
Data publikacji:: 2001
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: atomic force microscopy (AFM)
piezoresistive sensors
technology simulation
technology characterization
Opis:: An important element in microelectronics is the comparison of the modelling and measurements results of the real semiconductor devices. Our paper describes the final results of numerical simulation of a micromechanical process sequence of the atomic force microscopy (AFM) sensors. They were obtained using the virtual wafer fab (VWF) software, which is used in the Institute of Electron Technology (IET). The technology mentioned above is used for fabrication of the AFM cantilevers, which has been designed for measurement and characterization of the surface roughness, the texturing, the grain size and the hardness. The simulation are very useful in manufacturing other microcantilever sensors.
Źródło:: Journal of Telecommunications and Information Technology; 2001, 1; 35-39
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

Artykuł

Skocz do pozycji: 3.

Tytuł:: TSSOI as an efficient tool for diagnostics of SOI technology in Institute of Electron Technology
Autorzy:: Barański, M.
Domański, K.
Grabiec, P.
Grodner, M.
Jaroszewicz, B.
Kociubiński, A.
Kucewicz, W.
Kucharski, K.
Marczewski, J.
Niemiec, H.
Sapor, M.
Tomaszewski, D.
Powiązania:: https://bibliotekanauki.pl/articles/308825.pdf
Data publikacji:: 2005
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: SOI CMOS technology
pixel detector
test structure
Opis:: This paper reports a test structure for characterization of a new technology combining a standard CMOS process with pixel detector manufacturing technique. These processes are combined on a single thick-_lm SOI wafer. Preliminary results of the measurements performed on both MOS SOI transistors and dedicated SOI test structures are described in detail.
Źródło:: Journal of Telecommunications and Information Technology; 2005, 1; 85-93
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

Artykuł

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