Autor: Beck, M. - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: Novel Method of Improving Electrical Properties of Thin PECVD Oxide Films by Fluorination of Silicon Surface Region by RIE in RF CF4 Plasma
Autorzy:: Kalisz, M.
Głuszko, G.
Beck, R. B.
Powiązania:: https://bibliotekanauki.pl/articles/308057.pdf
Data publikacji:: 2010
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: capacitance-voltage characteristics
current-voltage characteristics
fluorine plasma
radio frequency reactive ion etching
Opis:: This study describes a novel technique to form good quality low temperature oxide (< 350 C degree). Low temperature oxide was formed by N2O + SiH4:N2 plasma in a plasma enhanced chemical vapour deposition (PECVD) system on the silicon surface reactively etched in CF4 plasma (RIE - reactive ion etching). The fabricated oxide demonstrated excellent (for low temperature dielectric formation process) currentvoltage (I-V) characteristics, such as: low leakage current, high breakdown voltage and good reliability. Experimental results indicate that the proposed method of fluorine incorporation into the SiO2/Si inteface improves electrical parameters of MOS structures.
Źródło:: Journal of Telecommunications and Information Technology; 2010, 1; 20-24
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 2.

Tytuł:: The Effect of High Temperature Annealing on Fluorine Distribution Profile and Electro-Physical Properties of Thin Gate Oxide Fluorinated by Silicon Dioxide RIE in CF4 Plasma
Autorzy:: Kalisz, M.
Głuszko, G.
Beck, R. B.
Powiązania:: https://bibliotekanauki.pl/articles/308059.pdf
Data publikacji:: 2010
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: capacitance-voltage characteristics
current-voltage characteristics
fluorine plasma
high temperature annealing process
radio frequency reactive ion etching
Opis:: This study describes the effects of high temperature annealing performed on structures fluorinated during initial silicon dioxide reactive ion etching (RIE) process in CF4 plasma prior to the plasma enhanced chemical vapour deposition (PECVD) of the final oxide. The obtained results show that fluorine incorporated at the PECVD oxide/Si interface during RIE is very stable even at high temperatures. Application of fluorination and high temperature annealing during oxide layer fabrication significantly improved the properties of the interface (Ditmb decreased), as well as those of the bulk of the oxide layer (Qeff decreased). The integrity of the oxide (higher Vbd ) and its uniformity (Vbd distribution) are also improved.
Źródło:: Journal of Telecommunications and Information Technology; 2010, 1; 25-28
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 3.

Tytuł:: Applying shallow nitrogen implantation from rf plasma for dual gate oxide technology
Autorzy:: Bieniek, T.
Beck, R. B.
Jakubowski, A.
Głuszko, G.
Konarski, P.
Ćwil, M.
Powiązania:: https://bibliotekanauki.pl/articles/308685.pdf
Data publikacji:: 2007
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: CMOS
dual gate oxide
gate stack
oxynitride
plasma implantation
Opis:: The goal of this work was to study nitrogen implantation from plasma with the aim of applying it in dual gate oxide technology and to examine the influence of the rf power of plasma and that of oxidation type. The obtained structures were examined by means of ellipsometry, SIMS and electrical characterization methods.
Źródło:: Journal of Telecommunications and Information Technology; 2007, 3; 3-8
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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Skocz do pozycji: 4.

Tytuł:: The influence of annealing (900?C) of ultra-thin PECVD silicon oxynitride layers
Autorzy:: Mroczyński, R.
Głuszko, G.
Beck, R. B.
Jakubowski, A.
Ćwil, M.
Konarski, P.
Hoffman, P.
Schmeißer, D.
Powiązania:: https://bibliotekanauki.pl/articles/308691.pdf
Data publikacji:: 2007
Wydawca:: Instytut Łączności - Państwowy Instytut Badawczy
Tematy:: ultra-thin dielectrics
silicon oxynitride
PECVD
CMOS
Opis:: This work reports on changes in the properties of ultra-thin PECVD silicon oxynitride layers after high- temperature treatment. Possible changes in the structure, composition and electrophysical properties were investigated by means of spectroscopic ellipsometry, XPS, SIMS and electrical characterization methods (C-V, I-V and charge- pumping). The XPS measurements show that SiOxNy is the dominant phase in the ultra-thin layer and high-temperature annealing results in further increase of the oxynitride phase up to 70% of the whole layer. Despite comparable thickness, SIMS measurement indicates a densification of the annealed layer, because sputtering time is increased. It suggests complex changes of physical and chemical properties of the investigated layers taking place during high-temperature annealing. The C-V curves of annealed layers exhibit less frequency dispersion, their leakage and charge-pumping currents are lower when compared to those of as-deposited layers, proving improvement in the gate structure trapping properties due to the annealing process.
Źródło:: Journal of Telecommunications and Information Technology; 2007, 3; 16-19
1509-4553
1899-8852
Pojawia się w:: Journal of Telecommunications and Information Technology
Dostawca treści:: Biblioteka Nauki

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