- Tytuł:
- Boriding of binary Ni-Ti and ternary Ni-Ti-Cu shape memory alloys
- Autorzy:
-
Ucar, N.
Turku, N.
Ozdemir, A.
Calik, A. - Powiązania:
- https://bibliotekanauki.pl/articles/1065676.pdf
- Data publikacji:
- 2016-07
- Wydawca:
- Polska Akademia Nauk. Instytut Fizyki PAN
- Tematy:
-
61.66.Dk
61.72.-y
62.20.Qp - Opis:
- In this work, the boriding of binary (Ni-Ti) and ternary (Ni-Ti-Cu) shape memory alloys was carried out in a solid medium at 1173 K for 8 h using the powder pack method with Ekabor-Ni powders. Characterization of boride layer formed on the surface of alloys was identified by optical microscopy and scanning electron microscopy. TiB₂, NiB₂ and SiC phases in the boride layer of borided binary (Ni-Ti) and ternary (Ni-Ti-Cu) shape memory alloys was confirmed by X-ray diffraction analysis. The microhardness and thickness of the boride layers were measured. The obtained hardness values show a hardness anomaly due to porosity and structural defects with increase of Cu content, while a decrease in the value of hardness moving from the boride layer to main structure was observed.
- Źródło:
-
Acta Physica Polonica A; 2016, 130, 1; 492-495
0587-4246
1898-794X - Pojawia się w:
- Acta Physica Polonica A
- Dostawca treści:
- Biblioteka Nauki
Artykuł