- Tytuł:
- EMC shielding in power electronics multilayers
- Autorzy:
-
Schuh, S.
Albach, M. - Powiązania:
- https://bibliotekanauki.pl/articles/262725.pdf
- Data publikacji:
- 2005
- Wydawca:
- Akademia Górniczo-Hutnicza im. Stanisława Staszica w Krakowie
- Tematy:
-
power electronics
multilayer
planar passive component
analytical analysis - Opis:
- The integration of passive components in printed circuit boards by using structured layers of different material leads to completely new technical challenges, both in technological realisations and in simulations or modelling of the embedded components. The integration of uiductive components is very interesting due to the substantial place reduction on the surface of the printed circuit board. In this context the shielding of the stray field of these inductive components leads to some new approaches in magnetic field calculation and simulation by planar structures. So in this paper the influence of FPC foils (Ferrite Polymer Compounds), m-metal and thin layers of copper on the magnetic field distribution and thus on the inductive coupling mechanisms in multilayers is analytically calculated and verified by some measurements. The presented results - measurement and simulation - lead to the final conclusion that the integration ofi-metal in comparison to FPC foils and thin layers of copper in the multilayer is one of the promising procedures for EMC-shielding.
- Źródło:
-
Electrical Power Quality and Utilisation. Journal; 2005, 11, 2; 57-63
1896-4672 - Pojawia się w:
- Electrical Power Quality and Utilisation. Journal
- Dostawca treści:
- Biblioteka Nauki
Artykuł